Product news
11/01/2006
Disk surface metrology
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The Candela Optical Surface Analyzer 6300 series provides full surface disk topography metrology in both radial and circumferential directions for data storage substrates and finished media. Capabilities include identification of roughness variations of <0.1Å, with 0.22-2000µm spatial bandwidth coverage and a lower noise floor (<0.5Å). Features include patented multichannel optics and unique laser stability management technology, increased laser power, and new optics design. KLA-Tencor Corp.,San Jose, CA; ph 408/875-6033, www.kla-tencor.com.
193nm immersion photomask inspection
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The AIMS 45-193i aerial image inspection system, developed in cooperation with SEMATECH, emulates the imaging of photomasks for 193nm immersion scanners down to the 45nm technology node. Compared to former AIMS systems, the beam path is now completely inverted and the mask is handled face-down. The illumination and the imaging path address all relevant scanner settings, including wavelength, numerical aperture (to NA=1.4), and polarization simulation, as well as dipole and quadrupole illumination schemes. A vector effect emulation capability allows the study of rigorous polarization effects as they appear in reticles and the scanner technology itself. Carl Zeiss SMT AG, Jena, Germany; ph 49/7364-202194, www.smt.zeiss.com.
300mm Ti/TiN deposition tool
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The Trias LT Ti/TiN 300mm metal CVD system enables deposition of titanium and titanium nitride films for low-temperature processing required in the manufacture of nickel silicide contacts. An enhanced shower head design allows wafer temperature control over a wide range of deposition temperatures. The company claims the system can achieve 20% lower contact resistance vs. conventional PVD technology, while maintaining junction leakage in logic devices corresponding to the 45nm node. Tokyo Electron America Inc., Austin, TX; ph 512/424-1757, www.tel.com.
Single wafer RTP tool
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The Atmos dual-chamber single-wafer rapid thermal processing (RTP) system, built on the company’s Helios platform, enables a range of rapid thermal oxidation applications for 300mm and 70nm-32nm chip manufacturing, including selective oxidation and shallow-trench isolation. A model-based temperature measurement and control system enables within-wafer uniformity and wafer-to-wafer repeatability. Features include a modular dual-chamber platform, an integrated pyrogenic water-vapor generator, dual-side wafer heating to reduce pattern-related temperature effects, and a dedi-cated edge grip and edge support end-effector. Mattson Technology Inc., Fremont, CA; ph 510/657-5900, www.mattson.com.
New pads for CMP applications
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Several additions to the Vision Pad family of CMP pads include the VisionPad for STI, which reduces defects by 50% without sacrificing planarization results, according to the company. The EcoVision EV4000 offers an order-of-magnitude reduction in defectivity for copper barrier processes. Features in the new IC1000 AT series of polishing pads include an ultraflat design with unique grooves, and new endpoint and adhesive technologies. Rohm and Haas Electronic Materials, CMP Technologies, Philadelphia, PA; ph 602/470-4418, www.rohmhaas.com.
Patterning flexibility at 45nm
The Dimension45/32 system addresses patterning challenges at the 45 and 32nm nodes, such as patterning critical routing layers (M2-M6 or beyond) at 45nm using dry lithography instead of immersion. Capabilities include process setup optimization, printability analysis, dynamic retargeting, enhanced etch models, enhanced process window optimization, model-based sub-resolution assist features, and yield-based optimization. Invarium Inc., San Jose, CA; ph 408/213-8000, www.invarium.com.
Wider range for parametric tests
The N9201A array structure for Agilent’s 4070 Series parametric testers provides a per-channel architecture that supports up to 40 total source/monitor units, 5× more than previously available in a single tester, for faster characterization of in-line array test structures. An address generation function enables advanced array matrix testing. Agilent Technologies Inc., Santa Clara, CA; ph 800/829-4444, www.agilent.com.
Dual-cure epoxy
The UV15DC80 dual-cure (UV and heat curable) epoxy system for bonding, sealing, coating, and potting applications can cure in shadowed areas by supplemental heat curing at 80°C for 15-30 minutes. Straight UV curing can be accomplished for thicknesses of 0.010-0.020-in. using UV light at 365nm with 30-40mW/cm of energy, with faster cures achievable at higher energy outputs. Post curing at 125-135°C for 15-30 minutes can increase the Tg from 90°C achieved by straight UV cure to over 130°C. Properties include >70 shore D hardness, 3%-4% elongation after cure, tensile strength >4200 psi, tensile modulus of 120,000 psi, and refractive index of 1.517. Master Bond Inc., Hackensack, NJ; ph 201/343-8983, www.masterbond.com.
Controlling water vapor in gas streams
The RainMaker is an alternative to direct liquid injection, bubblers, or membrane contactors for controlling the transfer of pure water or ammonia hydroxide into most types of carrier gas streams, leaving behind microdroplets, dissolved gases, and most volatile contaminants in the source. Thin hydrophilic membranes allow rapid transfer of water vapor without the chance of wet out from hollow fiber contactors. A back pressure regulation device enables accurate delivery of low-vapor pressure gases into sub-atmospheric processes. Flow rates range from 18µg-1kg/min; maximum performance thresholds are 60psig (4 Bar) and 120°C. Targeted applications include RTP, ALD, plasma stripping, immersion lithography, diffusion, and wafer cleaning. RASIRC Inc., San Diego, CA; ph 858/259-1220, www.rasirc.com.
3D modeling for OPC
The Tachyon M3D (Mask 3D) enables improved high-NA process-window modeling accuracy for sub-65nm OPC and OPC verification by incorporating mask 3D imaging effects. It constructs image-based photomask imaging models using rigorous electromagnetic field simulation of polarization and scattering caused by subwavelength features on 4× masks. Wafer pattern distortions caused by mask 3D effects can be corrected by Tachyon OPC+ and verified by Tachyon LMC with a single FEM model. Brion Technologies Inc., Santa Clara, CA; ph 408/653-1500, www.brion.com.
300mm upgrade to backend litho system
The 200mm Unity GOLD system provides 150- and 200mm wafer packaging for flat-panel display (FPD) applications, while the 300mm Unity Platinum lithography system provides 200mm and 300mm wafer processing capabilities for high-volume chip manufacturing. Ultratech is marketing the tools, built on the company’s Unity platform, specifically for use in wafer foundries. Ultratech Inc., San Jose, CA; ph 408/321-8835, www.ultratech.com.
High-speed confocal 3D measurement
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The SISCAN Model MC64, developed with Siemens Optical Solutions, promises higher resolution (10µm lateral, 0.5µm vertical) than laser trangulation at speeds faster than an interferometer (sample rate/channel of 8000/sec, 8mm working distance, 512,000 measurements/sec). Multiple sensors can be used in parallel to raise the throughput rate. Typical applications include distance, depth, or flatness measurement to measuring waviness or roughness, 3D shape inspection, and bump inspection of wafers and substrates. The basic system consists of a scanning head with beam splitter and 64 channels, a 64-channel photodiode detector, and a vertical oscillating mirror. An optional topographer comes with a granite table and X/Y positioning unit. Metrology Resource Co., Oxford, MI; ph 248/628-8671, www.metrologyresource.com.