Product News
10/01/2006
Excimer laser workstation
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The IX-250 excimer laser micromachining system is a Class 1 industrial-grade workstation that can accommodate a variety of excimer lasers, offering 12 axes of motion, with 250mm×200mm travel (for processing 150mm wafers). It operates across the full range of excimer wavelengths, including vacuum UV (157nm and 193nm), short-wavelength UV for processing sensitive polymers, and very high resolution and submicron processing. A flexible beam delivery system features large-aperture optics for utilization of large excimer beams, and can accommodate beam shaping modules such as beam profilometers, dosage control, mirror mounts, homogenizers, and mask imaging systems. J.P. Sercel Associates Inc., Hollis, NH; ph 603/595-7048, www.jpsalaser.com.
Instrument for surface chemical characterization
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The K-Alpha uses x-ray photoelectron spectroscopy to quantitatively determine the surface chemical composition of the top few nanometers of solid materials such as insulators, semiconductors, and metals. A monochromated x-ray beam can be focused into a small spot with 30µm lateral resolution. An integrated ion source provides a high-resolution depth profiling capability, facilitating 3D analysis. Thermo Electron Corp., Waltham, MA; ph 800/642-6538, www.thermo.com.
Upgraded darkfield inspection system
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The Puma 91xx darkfield patterned wafer inspection system offers double the throughput for critical line monitor applications (20 wafers/hour) than last year’s 9000 series, and >30WPH for less critical tool monitoring apps, as well as enhanced data processing and additional pixel combinations, from high sensitivity to high throughput. A new algorithm reduces the number of parameters needed to create and tune tool recipes by nearly 80%. The tool incorporates the company’s proprietary Streak multipixel sensor and line scanning technologies, to avoid speed and sensitivity limitations of acousto-optic devices and photo multiplier tubes. KLA-Tencor Corp., San Jose, CA; ph 408/875-3000, www.kla-tencor.com.
Mini-cleanroom for pre-cure processes
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The “Cocoon” pre-cure system incorporates a HEPA filter within the curing chamber, creating a miniature, heated, inverted cleanroom for the pre-cure process. Lenses are suspended directly above the hot laminar airflow from the HEPA filter face, while a contoured airflow director eliminates turbulence in the corners and prevents build-up of pockets of particles. The system is available as a freestanding console or an option for high-performance cleaning and hard-coating systems. Interlab Inc., Danbury, CT; ph 203/748-5624, www.interlab-inc.com.
In situ wafer process monitoring
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The Integral Wafer enables in situ process monitoring during critical, harsh environment process applications, such as high-power dielectric etch. The ultrathin RF-shielded laminated device (in 200mm or 300mm sizes) is recessed into a silicon substrate and capped with a cover to provide shielding from contaminants and the outside prcoessing environment. The 300mm version includes 65 temperature sensors with a 20-130°C operating range. SensArray Corp., Santa Clara, CA; ph 408/986-5640, www.sensarray.com.
Add-on for TEL Mark series
The ARDiMuS system expands data and recipe management capabilities of TEL’s Mark series tracks. The software auto-configures itself to the system, offering enhanced recipe control and in situ data monitoring and analysis. Rite Track, West Chester, OH; ph 513/881-7820, www.ritetrack.com.
Upgraded fab MES software
Improvements and upgrades to the Factory-Works manufacturing execution system (MES) application suite include: modules for work order and inventory management, a manufacturing bill of materials, process nonconformance, and enhanced reporting functionality, with an open standard message bus and enterprise data exchange. The company’s upgraded “300works” MES offering includes wafer tracking, advanced database archiving and purging, and dynamic function calls. Brooks Software, Chelmsford, MA; ph 978/262-4497, www.brookssoftware.com.
Interlayer dielectric precursor
The PDEMS ILD is an organosilicate glass for making a porous low-k dielectric material by PECVD, for 45nm geometries and beyond. A UV-based post-treatment process creates the pores, which are imparted to the film by employing a hydrocarbon-based precursor as a “porogen” that co-deposits during the growth of the film. The dielectric constant is tunable from 2.7 to <2.0. Air Products and Chemicals Inc., Allentown, PA; ph 610/481-1192, www.airproducts.com.
Multisite test system
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The Sapphire D-40 system combines analog, digital, mixed-signal and RF test instrumentation for SiP and MCP device integration and test. It has enhanced data management and parallel test capabilities, offering 40 interchangeable instrument slots. Features include 3000+ digital pins/576 analog pins/144 mixed-signal pins, 1022 test site capacity, and 200Mbps data rates. Sixteen or 32 MVNA RF channels are available. Credence Systems Corp., Milpitas, CA; ph 408/635-4337, www.credence.com.
Multifunctional microscope workstation
The CrossBeam NVision 40 microscope, codeveloped with SII Nanotechnology Inc., combines electron beam, focused ion beam (FIB), and gas injection system technologies for nanoscopic imaging, structuring, and analysis. Features include two in-lens detector systems that can be operated simultaneously for ultrahigh resolution imaging. The zeta FIB column is capable of achieving 4nm resolutions. Carl Zeiss SMT AG, Oberkochen, Germany; ph 49/7364-20-2194, www.smt.zeiss.com.
Quartz material for next-gen semis
The i21 ingot is a new homogenous solid quartz material for production of 300mm wafers with submicron linewidths. Available in sizes from 400mm to 560mm, it offers an ultralow defect concentration, and low OH (hydroxyl group) content to make it useful with high-temperature batch diffusion systems. GE Advanced Materials, Strongsville, OH; ph 440/878-5740, www.ge.com/advancedmaterials.
300mm horizontal wafer shipper
The Hawk blow-molded polypropylene co-polymer horizontal wafer shipper protects 2-25 300mm wafers during handling and shipping. It has a wide access slot for manual or automated wafer insertion and removal, dual-wall air-filled lid and base, and low nestable profile for secure stacking with less storage space. Wafers are equally suspended by die cut wafer separators and foam cushioning consumables. Infixeon LLC, Austin, TX; ph 512/918-1732, www.infixeon.com.