Attendees choose ‘best-in-show’ products
09/01/2006
Solid State Technology and sister magazine Advanced Packaging invited SEMICON West attendees to vote on the best products they saw at the July trade show in San Francisco’s Moscone Center. Three categories of awards were given for both the Wafer Processing Products and the Final Manufacturing Products.
Wafer Processing Winners
Most innovative: Aviza Technology Inc.’s Celsior single-wafer ALD system
The Celsior is a next-generation single wafer atomic layer deposition (ALD) system designed for manufacturing at the 90nm node, and R&D starting at the 65nm node. The system is capable of integrating up to five process modules around a production proven central hub, which ensures high productivity in a small footprint. Celsior is designed as a 200mm/300mm bridge tool, offering the flexibility to process 200mm and/or 300mm wafers on the same platform. Aviza Technology Inc., Scotts Valley, CA; ph 831/439-6405, e-mail [email protected], www.avizatechnology.com.
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Best solution to a problem: Accretech USA Inc.’s Habanero edge-bevel cleaning technology
The Habanero improves device yields by removing delaminating films from 300mm wafer edge and bevel regions using an atmospheric pressure micro-torch technology. Accretech USA Inc., Austin, TX; ph 512/246-4500, e-mail [email protected], www.accretechusa.com.
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Best cost-of-ownership: RASIRC Inc.’s Intaeger UHP ultrahigh purity steam generator
The Intaeger system produces ultrahigh-purity steam and process control by boiling de-ionized water, removing contaminants such as dissolved gases, eliminating metallic impurity sources, and reducing particle sources. The company claims purity is equal to or better than that created by burning oxygen and hydrogen. Delivery pressure, temperature, and mass flow rate are automatically controlled. Liquid level is monitored and filled automatically or manually. A temperature control loop minimizes condensation of UHP steam. The purifier can be located remotely from the steam generator, conserving space around the process tool. RASIRC Inc., San Diego, CA; ph 858/259-1220, e-mail [email protected], www.rasirc.com.
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Final Manufacturing Winners
Most innovative product: Süss MicroTec Inc.’s C4NP wafer-bumping line
This C4NP wafer bumping line, incorporating IBM’s Controlled Collapse Chip Connection-New Process (C4NP) technology, consists of three pieces of equipment: a mold-fill tool, mold inspection tool, and solder transfer tool. C4NP uses an injection-molding process to fill pre-fabricated and reusable glass templates with molten solder. Filled mold and wafer are brought into close proximity and solder bumps are transferred onto the entire wafer in a single process. Süss MicroTec Inc., Waterbury Center, VT, www.suss.com.
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Best solution to a problem: Heraeus Inc.’s TF series fluxes
TF series fluxes are developed for semiconductor companies requiring high performance and environmentally responsible materials for ball attach and chip attach. The fluxes are compatible with a wide range of underfills, and available for high-speed printable flux, standard printing flux, and dispense flux applications. Heraeus Inc., West Conshohocken, PA; ph 610/825-6050, e-mail [email protected], www.4cmd.com.
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Best cost-of-ownership: Süss MicroTec AG Test Division’s BlueRay probe system
The BlueRay probe system offers wafer-level testing for discrete devices. The tool can be upgraded from a semiautomatic to a fully-automated wafer prober in less than an hour, with an optional dockable wafer-handling robot. A redesigned communication between the hardware and software uses a standard Ethernet interface or an optional TTL interface. The software architecture is based on a stable Linux backbone. Süss MicroTec AG, Munich, Germany; ph 49/89-32007-395, e-mail [email protected], www.suss.com.
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