Product News
08/01/2006
Automated chemical analysis system
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The Sentry Harsh Chemistry Metrology system offers automated real-time, “proactive” analysis to detect metallic and ultimately organic contaminants in harsh chemistries used in semiconductor manufacturing processes. The system’s proprietary hardware and software neutralize harsh chemistries without diluting the sample with ultrapure water, allowing metallic contaminants to flow through for accurate and timely detection. A proprietary in-line mass spectrometry system, including an electrospray time-of-flight mass spectrometer, can perform measurement of anions and cations, while a spectral data analysis engine automatically applies peak fitting algorithms to generate graphical results. Metara Inc., Sunnyvale, CA; ph 408/331-5200, www.metarainc.com.
Streamlined, cleaner gas abatement tool
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The Alpine-5 point-of-use gas abatement system utilizes flameless electric heaters rather than burning methane to reach temperatures to abate perfluorocompound gas emissions, resulting in a cleaner and safer process. The tool achieves >95% DRE (destruction and removal efficiencies) for etch and CVD applications, vs. 70% DRE for other tools, the company claims. The system’s catalytic decomposition reactor lowers required temperature to decompose PDF gases by 30%-40% (to 850-950°C) vs. other tools. A patented vortex device removes heat, particles, and water-soluble acids. The company also claims the Alpine system achieves 10× longer preventative maintenance cycles than other abatement systems on CVD applications. TecHarmonic Inc., San Jose, CA; ph 408/360-8780, www.techarmonic.com.
Upgraded fault defect system
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The Imprint MX3 system offers fault detection and classification for logic, DRAM, and flash device manufacturing. The system processes data from multiple sensors to better identify excursions and drift-e.g., enabling gas drift sensitivity down to 3%, vs. 10% with only RF sensors, the company claims. The tool also enables expanded advanced process control applications and enables fault libraries to be transferred across multiple tools or chambers running the same process, either at the same site or between sites. Straatum Processware Ltd., Dublin, Ireland; ph 35/31839-5122, www.straatum.com.
Plasma ALD tool
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The FlexAl atomic layer deposition (ALD) tool, developed in conjunction with the Eindhoven U. of Technology, enables use of low-temperature deposition, high-density and ultrathin films, and high film purity, and also incorporates thermal ALD processing capabilities. Processes reportedly have been developed for materials including TiN, HfO2, high-k dielectric, Al2O3 down to room temperature, and single-metal Ru. The company also claims very low-resistivity nitride and metal films have been achieved, with excellent control of material stoichiometry. The system can handle sample sizes up to 200mm wafers for applications including manufacturing of semiconductors, OLEDs, and MEMS. Oxford Instruments plc (Plasma Technology division), Bristol, UK; ph 44/0-1934-837000, www.oxford-instruments.com.
300mm flash test tool
The Harmony OneTouch wafer probe card technology addresses challenges associated with one-touchdown 300mm flash wafer probing. A bridge capability adjusts the tilt of the probe card relative to the wafer, and reduces thermal setup time from hours to just minutes, the company claims. The OneTouch card also incorporates a new “MicroSpring” contactor, designed to be more reliable in a high-volume flash environment. FormFactor Inc., Livermore, CA; ph 925/290-4000, www.formfactor.com.
Strip material for etch removal
The Act EZstrip 511 etch and ash residue remover targets cleaning of residue in single-wafer and batch tools, designed to be compatible with copper and low-k materials in 65nm and 45nm semiconductor manufacturing processes. The material, composed mainly of biodegradable components designed to be environmentally friendly, works under a low process temperature (room temperature to 40°C) to provide an extended bath life. The company claims processing can be done in as little as 60 sec. Air Products Inc., Lehigh Valley, PA; ph 610/481-1192, www.airproducts.com.
High-speed process monitoring
The NeXus SPC diagnostic tool performs split-second analysis of process conditions for Applied Materials’ Vantage Radiance Plus RTP, Vantage RadOx RTP, and Centura Epi systems, monitoring critical process parameters up to 100×/sec (100Hz). Algorithms construct models based on predefined control limits, using data from multiple process and chamber sensors to create real-time patterns. Availability on other Applied systems is planned for the future. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647, www.appliedmaterials.com.
Wafer slice & dice
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The IX-200 high-precision wafer dicing (singulation) system comes in two configurations. The “ChromaDice” DPSS (solid state) version, available in 266nm or 355nm wavelengths, cuts as narrow as 2.5µm in width, yielding as much as 24% more die/wafer with die yields >99%. It delivers excellent results on GaAs, Si, and other materials and scribes up to 150mm wafers, including sapphire LED wafers. The “ChromaAblate” configuration targets the micromachining of Si, GaN, GaAs, and other III-V materials, with a 248nm wavelength excimer laser or an optional 193nm beam delivery package. JP Sercel Associates, Hollis, NH; ph 603/595-7048, www.jpsalaser.com.
High-dose implanter
This extension of the Axcelis Optima platform uses clusters of boron, instead of individual atoms, for extremely high-dose, low-energy implant applications in leading-edge memory and logic devices. Implanting molecules of B18H22 results in higher productivity without risk of beam contamination associated with beam deceleration, the company claims. The Imax source technology can be used for any of the company’s Optima HD line of implanters. Axcelis Technologies Inc., Beverly, MA; ph 978/787-4000, www.axcelis.com.
Image processing system
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PADS (probe accuracy diagnosis system) is an ultrahigh-speed image processing engine designed to provide fast and reliable probe mark inspection (PMI) capability. The company says the tool, which is integrated with TEL’s P-12XLm 300mm automatic wafer prober, achieves up to 100× throughput improvement over current PMI capabilities, with recognition ratios of up to 99.9%. A GUI interface and real-time image recognition capability enable capturing and saving probe mark information in both graphical and data formats. Users also can view and analyze detailed parameters of the wafer and probe marks. Tokyo Electron Ltd., Austin, TX; ph 512/424-1757, www.tel.com.
Wet process station
The Series 1414 Wet Process Station for semiconductor manufacturing cleanroom operations is designed for in-wall placement, allowing total laminar clean air flow to the work deck. Components are mounted on support rails to be positioned for easy replacement, or repositioning for optimal product flow through the station. A flexible, acid- and solvent-resistant membrane protects the controller face. Heated tanks come with liquid level sensors, and various safety overrides. DI water flow bypass diaphragm valves inhibit bacterial growth. Modular electrical devices and plumbing systems provide orderly maintenance with minimal service inventory. Clean Air Products, Minneapolis, MN; ph 800/423-9728, www.cleanairproducts.com.
Pattern generator for FPDs
The FPS5100 laser pattern generator, based on Micronic’s LRS line of pattern generators, targets high-volume production of photomasks for electronic packaging, passive matrix TN/STN LCDs, and other large area applications. The system features throughput of up to 12,000 mm2/min, and a main writing grid down to 0.4µm. Micronic Laser Systems AB, Taby, Switzerland; ph +46/8638-5200, www.micronic.se.
Wafer-level calibration
This new version of SüssCal Professional software addresses wafer-level calibration and accuracy of on-wafer measurements for high-frequency (RF and microwave) devices, automating the calibration process for semi- or fully automated probe systems. A LRM+ calibration method offers measurements from DC to >110GHz, and eliminates the need for de-embedding. A PortMapping feature offers easy set-up of complicated multiport calibration. Süss MicroTec Test Systems, Munich, Germany; ph 800/685-7877 ext. 218, www.suss.com.
Hybrid Z-nanopositioning component
The M-714 precision Z-stage/C-702 Hybrid Controller is a hybrid Z-nanopositioning system, employing piezoelectric and DC-motor drives to offer better resolution and response with long travel ranges and high holding forces. Featuring 2nm linear encoder resolution, the component incorporates integrated piezo actuators to compensate for stick/slip during startup and settling. The controller can handle count rates of 100 million pulses/sec. Physik Instrumente LP, Auburn, MA; ph 508/832-3456, www.pi-usa.us.
Vacuum pump inlet trap
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The MV Multi-Trap is a modular, high-capacity vacuum pump inlet trap for new or retrofitted 300mm wafer fabricators and processes, such as nitride, TEOS, TiN, AlO3, and BPSG, that generate large amounts of heavy particulates. It features a first stage knock-down baffle, multiple stages of user-selectable filtration, and can be equipped with a cooling option for condensables. The system can be stacked to accumulate up to 2500 in3 of solids. MV Products, North Billerica, MA; ph 978/667-2393, www.massvac.com.
Defect classification software
The TrueADC automatic defect classification system offers a dynamic defect library function to facilitate expansion of the library, enabling adjustment for new defects or process variations in the production line. The software includes custom pre-shipment library development based on customer-provided images. New defect data from unclassified defects can be transferred from Rudolph’s Harmony ASR defect review software. The company claims the system quadruples the amount of information extracted from an image compared with current technologies. Rudolph Technologies Inc., Flanders, NJ; ph 952/259-1647, www.rudolphtech.com.
In situ chemical separation
The 3300 series single-wafer wet processors incorporate in situ chemical separation systems for collection and reuse of processing chemistries free of cross-contamination, thus reducing consumption. The combination of gravity-driven drainage, plus a sealed collection ring, eliminate the need for forced exhaust. In situ chemical separation can be configured for any SSEC 3300 processor, including wet etch, strip, and clean systems. Solid State Equipment Corp., Horsham, PA; ph 215/328-0700, www.ssecusa.com.