Product News
07/01/2006
2D, 3D X-ray inspection system
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The Cougar-SMT X-ray inspection system can image components in 2D and 3D for thorough inspection of applications requiring high magnifications, such as MEMS/MOEMS, semiconductor packages, and high-density interconnects. It includes a microfocus X-ray tube up to 160kV, real-time 16-bit image processing, digital flat-panel detector, and accelerated CT reconstruction and visualization. The system provides feature recognition down to 1µm, with a total magnification of up to 10,000×. Modular add-ons include BGA and die-attach void calculation modules, and a more sophisticated manipulator system. Comet North America Inc., Stamford, CT; ph 203/969-2161, ww.cometna.com
Step-and-repeat litho system
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The JBX-6300FS is a spot-beam, vector-scan, step-and-repeat lithography system designed for high volume direct patterning on wafers, capable of writing minimum linewidths of 8nm. Wafers with diameters ranging from 2-8 in. can be accommodated, as well as parts and pieces. An autoloader allows continuous unattended operation of up to 10 cassettes under vacuum. The company claims the system is an inexpensive alternative to typical immersion lithography tools. JEOL USA Inc., Peabody, MA; ph 978/535-5900, www.jeol.com.
HDD, MRAM metrology
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The MRW3 is a third-generation magnetic metrology system for measuring magnetic properties of hard-disk drive (HDD) recording heads and magnetoresistive random-access memory (MRAM) on product wafers for production control and early detection of process issues. It utilizes a proprietary closed-loop magnet system, with magnetic field repeatability of <0.1 oersted and sub-1 sec per resistance/magnetic-field transfer curve. Features include GEM/SECS factory automation, 1000 hrs MTBF reliability, and both 200mm and 300mm configurations. KLA-Tencor Corp., San Jose, CA; ph 408/875-6033, http://www.kla-tencor.com.
Steam purification, delivery
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The Intaeger system produces ultrahigh-purity steam and process control by boiling de-ionized water, removing contaminants such as dissolved gases, eliminating metallic impurity sources, and reducing particle sources. The company claims purity is equal to or better than that created by burning oxygen and hydrogen. Delivery pressure, temperature, and the directly related mass flow rate are automatically controlled. Liquid level is monitored and filled either automatically or manually. A temperature control loop minimizes condensation of UHP steam. The system has purge and drain capabilities. The purifier can be located remotely from the steam generator, conserving space around the process tool. RASIRC Inc., San Diego, CA; ph 858/259-1220, www.rasirc.com.
New photochemical dispensing system
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The IntelliGen Mini Dispense System for new and retrofit applications features a two-stage dispense technology so that filtration occurs at an independent rate of dispense, enabling the use of 10mm and below filter pore sizes for maximum defect reduction. The system offers fill-rate control and real-time pressure control to maximize filter performance, and prevents microbubble formation in even the most sensitive photochemicals. A brushless DC motor with closed-loop control delivers dispense rates down to 0.1 ml/sec. Entegris Inc., Chaska, MN; ph 978/436-6786, www.entegris.com.
Ellipsometry-based thin-film metrology
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The S3000 and S2000 ellipsometry-based metrology systems, for ≤0.18µm 300mm and 200mm device fabrication, are designed for thin-film (thickness 20-20,000Å) metrology, with modules for thin-film, CMP, etch, and lithography applications. The tools, built on the company’s Vanguard process control platform, use a fifth-generation focus-beam ellipsometry technology, incorporating long-life laser light sources for high accuracy, long-term stability, small spot size, and easy tool-to-tool matching. Deep-UV and visible reflectometry capabilities are optional. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, www.rudolphtech.com.
Wet chemistry analysis
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The WetSpec 200 is an in-line wet chemistry analyzer for real-time monitoring of chemical concentrations of liquids in wet processes. The system supports up to eight channels in parallel, measuring different chemistry components. The software can soft-switch between different chemistries, analysis of different chemistries for each channel, and flexible chemo-metric methodology. Typical applications include SC1, SC2, DSP, HF/HCI, ST, and EKC. CI Semi, Migdal HaEmek, Israel; ph 97/2464-48882, www.ci-semi.com.
DRIE etching tool
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The AMS 200 I-Productivity DRIE tool offers silicon etch rates of up to 32 µm/min. Hardware and proprietary design improvements have been made to the vacuum pumping lines, process chamber, wafer chucks, and pressure control system. Gas delivery optimization has been monitored in a mass production environment, showing significant reduction of running costs and increased throughput, the company claims. Alcatel Micro Machining Systems, Annecy, France; ph 33/0450-657593, www.adixen.com.
Ultrasmall metrology system
The LittleFoot metrology system offers an ultrasmall footprint (84×119cm) that is 64% smaller than earlier generation n&k systems, thanks to a new wafer handling mechanism. Capabilities include film thickness measurement and determination of the values of n and k from 190-1000nm, with a wavelength sensitivity of 1nm intervals. The system also measures CDs from 5µm down to 65nm and smaller, as well as trench depths and profiles. The tool includes a recipe-generation wizard for complex thin-film stacks and multifaceted trench structures. n&k Technology Inc., Santa Clara, CA; ph 408/850-7302, www.nandk.com.
Confocal laser scanning microscope
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The LEXT OLS3000 confocal laser scanning microscope is designed for submicron imaging, with 0.12µm linewidth resolution and magnification power of 120-14,400×. The company says ideal 2D measurement applications are 1.5mm-1µm widths, and 1mm-0.5µm bumps for 3D measurements. Recommended roughness analysis is about Rz 0.1µm, and analysis of line and surface roughness is possible. Brightfield, darkfield, and differential interference contrast microscopy techniques are possible in both video and laser confocal imaging modes. Olympus Industrial Systems Group, Micro-Imaging Division, Orangeburg, NY; ph 866/642-4725, www.olympusmicroimaging.com.
Turbomolecular pump
The STP-XA4503C turbomolecular pump, for use with electron microscopes, metrology systems, and lithography systems, offers high performance in the process pressure range of high vacuum to 2000sccm process flow, with enhanced throughput for all gases. The pump integrates the controller with the pump body, eliminating cables and off-board controller, and employs an innovative magnetic bearing system, enabling a compact package with low vibration. BOC Edwards Inc., Wilmington, MA; ph 408/496-1177 www.bocedwards.com.
Helium ion microscope
The LookingGlass LG-2 helium ion microscope uses helium ions in a beam as the imaging particles. Because ions can be focused into a smaller probe size and have less sample interaction, the system can generate higher-resolution images with more material contrast, and enable better detail than scanning electron microscopes, the company claims. The first production version of the microscope was being assembled at press time, with applications projected for defect review and CD measurement. ALIS Corp., Peabody, MA; ph 603/424-1184, www.aliscorporation.com.
Optical fiber thermometer
The OR4000 line of optical fiber thermometers offers noncontact temperature measurement for RTP, HDP-CVD, MO-CVD, UV cure, and a variety of other semiconductor processes. It has multichannel capabilities and supports read rates up to 2KHz. The product series includes a device adding real-time emissivity compensation, and a noncontact alternative to thermocouple-based temperature measurements. Advanced Energy Industries Inc., Fort Collins, CO; ph 970/407-6280, www.advanced-energy.com.
Ozonated water delivery system
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The Liquozon Loop03 ozonated water delivery system is an ultracompact standalone system offered as an alternative to existing semiconductor cleaning technologies, offering up to 12 L/min of DIO3 at ozone concentrations to 40/75 ppm, with MTBF >20,000 hours. The system features closed-loop concentration control and DI water recirculation, and point-of-use DIO3 generation and easy conversion of ozone back to oxygen. It can be integrated with single wafer cleaning and processing tools for applications such as organic clean, water-mark removal, and oxide growth. MKS Instruments Inc., Wilmington, MA; ph 978/284-4050, www.mksinst.com.
Lab capillary rheometer
The RheoCapillary laboratory capillary rheometer determines the flow behavior of a wide range of materials, measuring shear viscosity, extensional viscosity, wallslip, melt fracture, and rupture with a variety of dies and accessories. A twin bore design allows fast measurements and high flexibility. Standard test control functionality as well as scientific evaluation capabilities are available. ATS Rheosystems, Bordentown, NJ; ph 609/298-2522, www.atsrheosystems.com.
Burn-in-with-test system
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The LM-1 Logic and Memory Burn-In System is a burn-in-with-test system that can be customized for different device types during the same burn-in cycle, such as high and low-power logic devices, flash memories, DRAMs, and SRAMs. The system has capacity of 1536 devices when individual temperature control is required, or 6400 devices when individual temperature control is not required and a conventional burn-in cycle is run. Features include 16 independent pattern zones; optional individual temperature control for each device under test; large system capacity of up to 32 burn-in boards; programmable temperature control up to 150°C; up to 128 digital I/O channels per burn-in board; ASIC architecture for per-pin timing, testing, and formatting of pattern data; 300A current per burn-in board; and scan mode vector memory up to 1G deep. Micro Control Co., Minneapolis, MN; ph 763/786-8750, www.microcontrol.com.
Integrated control loop
The EZ-ZONE ST integrated control loop combines temperature control, power control, safety shut-down, and power disconnect in a single package. It features a PID temperature controller already connected to a high amperage solid-state relay with the option of adding a properly sized heat sink, current measurement, an over/under temperature limit, a definite purpose mechanical contactor, and digital communications in one package. One available option is adding a remote user interface for increased usability. Watlow Electric Manufacturing Co., St. Louis, MO; ph 314/628-4041, www.watlow.com.
Benchtop ph meter
The Orion 2-Star benchtop pH meter features up to three-point calibration, auto calibration compatible with NIST and DIN buffers, and a 50-point data log to store information within the unit. Measurement range is pH0-14.999, with 0.1-0.001 resolution, and relative accuracy of ±0.002. A variety of package configurations are available. Thermo Electron Corp., Beverly, MA; ph 800/225-1480, www.thermo.com.
Flip-chip placement platform
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The AdVantis XS is a flip-chip placement platform designed for high-end assembly applications in semiconductor and standard surface mount assembly. It offers a 4-spindle and/or 7-spindle head, specialized component feeders, and high-resolution imaging. The system, driven by the company’s proprietary VRM linear motors, delivers accuracy of ±9µm at ±3σ, with a 25% increase in feeder capacity and 15% faster than the company’s GSMxs line. Universal Instruments, Binghamton, NY; ph 607/779-4079, www.uic.com.
Scriber/breaker
The DM-8510 scriber/breaker is designed to separate III-V wafers (GaAs, GaN, and InP) and ceramic substrates during manufacturing of LEDs, power laser diodes, RF micro devices, and MEMS. It can separate wafers up to 150mm in diameter, with an option available for 200mm wafers and an automated “cassette-to-cassette” handling system with passive temperature compensation to enhance reliability. Features include an encoder-controlled air bearing stage, a force feedback-controlled scribe module to apply even force across the wafer, and an individual adjustable break baker. DynTest Technologies GmbH, Grassau, Germany; ph +49/8641-6969, www.dyntest.de.
Heat-curing epoxy
The EP17 one-component heat-curing epoxy adhesive/sealant is a flowable paste used to bond a variety of substrates including metals, glass, ceramics, vulcanized rubbers, and many plastics. It has a service operating range of -300-600°F, can cure at temperatures from 300-350°F for 60-90 min. Tensile strength is 8700psi with tensile modulus of 387,000psi. It has a Shore D hardness of >90 and a compressive strength of >13,000 psi. Master Bond Inc., Hackensack, NJ; ph 201/343-8983, www.masterbond.com.
Mercury probe system
The CV92M mercury probe system tests blanket wafers up to 200mm dia., forming contacts on a limited number of sites on the wafer or on small pieces. Contact areas are 3E-5 cm2 to 0.5 cm2, with contact area repeatability >2%. Configurations include dot, dot
ing, dot/2 rings, and four dots. Typical applications include gate-oxide integrity measurements (e.g., high-k materials), doping density profiling, resistivity measurements of semi-insulating materials or ultrashallow junctions, characterization of polysilicon and SOI structures, and ultrashallow junction leakage current measurements. Four Dimensions Inc., Hayward, CA; ph 510/782-1843, www.4dimensions.com.
Real-time process refractometer
The PR-23-M real-time process refractometer measures the concentrations of process liquids such as HF, HCl, KOH, IPA, PGMEA, NMP, NH4OH, C2H6O2, and CH3COCH to help prevent out-of-spec chemicals from entering the semiconductor process. The tool, which installs directly into the process pipeline, utilizes a solid-state CCD camera to provide a digital measurement of refractive index. Measurement accuracy is ±0.0002 RI (±0.1% by weight). K-Patents Inc., Naperville, IL; ph 630/955-1545, www.kpatents.com.
Electrical test tool
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The Eliminator 6 electrical test tool eliminates test points required by flying probe test (FPT) systems, enabling fixtureless, quick test preparation for high-volume production electrical test. Applications include substrates, IC packages, and PCB inner layers. The tool scans PCB panels at a rate of up to 76.2mm/sec, resulting in FPT test times of <2 min/panel. The company claims the tool used with prober centric test can increase throughput for several FPTs by 3×-4× each, and can reduce FPT test time for an I/C package panel by 78% with no test tooling cost. Everett Charles Technologies, Pomona, CA; ph 909/625-9348, www.ectinfo.com.
Line of achromatic lenses
The Tech Spec line of achromatic lenses, consisting of two optical components cemented together to form an achromatic doublet, incorporate a multilayer broadband antireflection coating designed to minimize reflections in the visible spectrum. The lenses feature >99% transmission from 425-675nm. Edmund Optics Inc., Barrington, NJ; ph 856/573-6250, www.edmundoptics.com.
Piezoelectric nanopositioning controller
The E-761 PCI-bus piezoelectric nanopositioning controller is for closed-loop piezoelectric positioners and scanners. Features include polynomial linearization and coordinate transformation, with 32-bit DSP and 24-bit D/A converters for subnanometer position resolution. It automatically recognizes ID-chip equipped nanopositioning stages and optimizes all servo-control parameters. PI (Physik Instrumente) LP, Auburn, MA; ph 508/832-3456, www.pi-usa.us.
Particle filters
The MaxP particle filters are designed to capture contaminants that harm mass spectrometer helium leak detectors (MSLD) and associated vacuum pumps, minimizing the loss of performance from leak detectors and pumps, while extending the system life. Models are available for most MSLD systems, including Alcatel, Balzer, DuPont, Edwards, Leybold, Varian, Veeco, and VIC systems. Helium Leak Testing Inc., Northridge, CA; ph 818/349-5690, www.heliumleaktesting.com.
Perfluoroelastomer seal material
The Chemraz 551 perfluoroelastomer seal material is specifically designed for wet surface preparation in semiconductor processes, as an alternative to similar applications that require broad chemical resistance and higher temperature tolerance. The company claims the material displays “minimal” swelling at service temperatures up to 290°C. The company’s Chemraz 644 advanced perfluoroelastomer targets both static and dynamic oxide etch wafer processing applications, with stability at service temperatures up to 280°C, with excursions to 300°C. Greene, Tweed, Kulpsville, PA; ph 215/256-9521, www.gtsemi.com.