SEMICON West 2006 Product News
06/01/2006
Vistec launches e-beam trio
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The VB-300 e-beam lithography tool, successor to the VB6-UHR EWF, incorporates a 100kV high-brightness gun and 50MHz/20bit intelligent pattern generator, with field size capability of 1.2mm at 50-100kV operation. Enhancements include a stiffer platform and highly damped construction that supports the new 320mm stage. Also newly launched by the company are two variable-shaped beam systems. The SB3050, targeting direct patterning for R&D and prototyping at the 32nm node, has a 310×310mm stage travel range with full 300mm writing capabilities. The SB250 offers a 210×210mm stage travel range, enabling exposures of ≥7-in. masks and 200mm wafers. Vistec Semiconductor Systems GmbH, Wetzlar, Germany; 49/6441-29-2608, www.vistec-semi.com.
Step-and-repeat NIL system
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The EVG770 step-and-repeat UV-based nanoimprint lithography (NIL) stepper targets post-optical lithography needs for 32nm node semiconductor manufacturing. It features resolution down to 10nm, and sub-50nm overlay alignment accuracy via a dual-stage alignment approach. The tool imprints under reduced environmental pressure, enabling low-input pressures, fast process times, and enhanced pattern fidelity compared with other technical solutions in ambient pressure, the company claims. The system was developed in conjunction with German research foundry AMO GmbH, targeting initial R&D work and small-scale production. EV Group, Schärding, Austria; ph 43/7712-5311, www.evgroup.com.
Solving wet processing needs
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This automated system combines interface, processing, drying, and transfer modules for acid or solvent wet processing requirements meeting NFPA, NEC, and SEMI standards. It features event- and recipe-driven process controls, with an Ethernet-based distribution control system and up to a class 1 mini-environment. It also offers real-time data logging and a bulk chemical supply interface, as well as a host SECS-GEM interface, flush mount capability, and front or rear maintenance access. The company claims reliability is >1500 hrs MTBF. System options include bath recirculation/filtration for high- and room-temperature processes, megasonic and ultrasonic baths for particle and thick-residue removal, bath spiking, bulk distribution to the station and dispense to the baths, and in situ monitoring for particles, dissolved silica, resistivity, etc. MicroTech Systems Inc., Fremont, CA; 510/651-5277, www.microtechprocess.com.
Tool for 45nm photomask etching
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The Mask Etcher V platform is the company’s fifth-generation dry etch tool that extends into 45nm manufacturing processes. Features include sub-3nm uniformity in chrome etch and 2° phase uniformity for advanced quartz mask. The platform provides enhanced ICP process solutions over previous systems, including improved particle control, ultralow CD etch bias, and sub-7nm feature-size linearity. Unaxis Wafer Processing, St. Petersburg, FL; 727/577-4999, www.waferprocessing.unaxis.com.
Testing the MEMS waters
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The Temeon wafer-level microelectromechanical system (MEMS) tester helps manufacturers isolate and validate electrical and mechanical functionality at the wafer level prior to packaging. The tool lets customers test mechanical as well as electrical performance, and offers increased fault coverage to minimize package waste at the wafer level. A low-force contact methodology eliminates adverse effects to wafer yield due to strain applied to MEMS structures that may alter performance. An initial Temeon sample has been delivered to a Japanese MEMS device manufacturer. Tokyo Electron Ltd., Tokyo, Japan; 03/5561-7000, www.tel.com.
Test tool for lower-end needs
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This Compact Test Head tool, part of Agilent’s 93000 SoC series, targets lower-end test needs for digital and mixed-signal consumer devices. It has 18 hardware slots (16 slots for digital, analog, and RF cards, plus two for device power supplies and utilities). A new PCI Express-based transfer link speeds up tester data uploads/downloads, and enhanced DC test capabilities enable faster throughput. It comes with a dedicated cooler or a single cooling unit sharable by up to four compact test heads. Other features shared with the 93000 platform include Pin Scale digital, advanced analog and RF modules, SmarTest software, device-under-test boards, and docking. Agilent Technologies Inc., Palo Alto, CA; ph 650/752-5000, www.agilent.com
New pulse and pattern generators
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The Series 3400 line of pulse/pattern generators offer signal quality and precise control for semiconductor device and material research and characterization, as well as process integration. The single- and dual-channel products offer 1-165MHz frequency output range, and pulse amplitudes of up to ±10V (50Ω source impedance) or ±20V (1kΩ source impedance). A pattern generation capability lets users simulate serial data patterns to test devices and determine performance characteristics in less than ideal situations. Pulse widths ranging from <3 nsec-1000 sec can be programmed. Keithley Instruments Inc., Cleveland, OH; ph 440/248-0400, www.keithley.com.
CVD tool for diamond deposition
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The Model 650 hot filament chemical-vapor deposition (CVD) reactor is a fourth-generation tool for applying diamond coatings in a variety of process and tool applications. It adds integrated process control for allowing unattended operation and external monitoring, and can be configured to produce finely tuned deposition processes in ultrasmooth nanocrystalline or rougher microcrystalline structures, in thicknesses ranging from submicron to >50µm. Applications for the new tool include depositing diamond on 300mm wafers, wear coatings, substrates for thermal management, amorphous silicon deposition for solar cells, electrodes for water treatment and electrochemistry, passivation layers for semiconductor chucks, and cutting tools. The Model 650 comes in a standard production or R&D configuration. A uniform or mixed batch of irregularly shaped substrates are supported with proprietary fixturing, while flat substrates are coated with a standard planar filament array. sp3 Diamond Technologies Inc., Santa Clara, CA; 408/496-4121, www.cvdsolutions.com.
Controller for vacuum transducers
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The PDR900 controller is a standalone, single-channel power supply and readout unit for use with MKS’s HPS Series 900 digital vacuum transducers. It features three high-power setpoint relays for process control, and a leak detection feature with an audible alarm. It can be used with transducers that feature both RS232 and RS485 digital interfaces (it automatically detects the transducer type), eliminating analog measurement noise coupling from transducer cables. The PDR900 offers user-selectable readout in mbar, Torr, or Pascals, with a built-in data logger for process monitoring and analysis. MKS Instruments Inc., Wilmington, MA; ph 978/284-4000, www.mksinst.com.
Double-speed wafer surface inspection
The WI-2000 wafer inspector is designed for advanced surface inspection and defect detection on whole wafers, wafers on hoop rings, and wafers on filmframe carriers. It integrates ICOS’s proprietary image processing board, as well as improved die alignment and inspection algorithms, which the company claims doubles the inspection speed. Additional features include on/off-line inking and on/off-line review and reclassification. The system also sports a new user interface for easier recipe setup. The WI-2000 can be configured as a standalone tool or combined with a handler module. ICOS Vision Systems Corp. NV, Heverlee, Belgium; ph 32/16-398-220, www.icos.be.
Double-sided wafer cleaning option
The DV-38DS offers eight double-side process modules instead of the eight standard chambers in SEZ’s DV-38 300mm tool, for simultaneous high-throughput removal of wafer frontside polymers and backside organics and particles. The system uses DSP+ chemistry and deionized water on both sides of the wafer, eliminating the need for multiple, individual cleaning steps or for immersion (batch process) tools. SEZ Group, Villach, Austria; ph 43/4242-204455, www.sez.com.
Post-measurement computation
The Matchbox computation engine is a new scatterometry acceleration tool that provides advanced critical dimension (CD) metrology for 65nm device manufacturing. It enhances productivity of scatterometry-based CD and profile metrology systems by processing grating diffraction signature matching in parallel to signal acquisition by the CD metrology tool, increasing throughput by up to 20% and giving users more flexibility in sampling strategy, line balancing, and multiple libraries, the company claims. Matchbox is compatible with Accent’s PCM3 library generation system and CDS200 metrology system. Accent Optical Technologies, Bend, OR; ph 541/322-2500, www.accentopto.com.
Coating for temporary wafer bonds
The WaferBond coating line combines a new spin on polymer and remover, specially designed for temporary wafer bonding applications in compound semiconductor and MEMS manufacturing. Features include a single coat >10µm, process capabilities up to 180°C, and excellent resistance to common process chemicals and solvents. The company’s recommendations are for 1-2 min bonds under 130-170°C temperatures. Plasma O2 etch rate (dry) is 1µm/min at 500W. Brewer Science Inc., Rolla, MO; ph 573/364-0300, www.brewerscience.com.
E-beam lab unit
The AEB e-beam lab unit is a compact and modular tool for evaluating the use of e-beams in various curing, sterilization, materials modification and research, and process development applications. The unit features a solid-state power supply and emitter subsystem that can achieve up to 200µm penetration. It includes an 8.5×10-in. sample tray and adjustable chamber for processing samples up to 2.5 in. high. Options include nitrogen inerting and water cooling. The tool, which operates at room temperature without lamps or chillers and leaves no chemical residue, is available with 100-, 125-, or 150kV power supplies. Advanced Electron Beams Inc., Wilmington, MA; ph 978/658-8600, www.aeb.com.
Remote particle counting
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The Met One 4500 series remote airborne particle counter remotely monitors cleanrooms, samples inert gases, and verifies mini-environments in electronics, life sciences, and industrial environments. Minimum sensitivity is 0.3-0.5µm, with a flow rate of 2.83 lpm. A “long-life laser” diode extends service life. The tool integrates with existing facility monitoring systems through modbus and pulse communication protocols, and can be combined with the company’s Ultra Vision Online software to monitor a cleanroom from a single desktop console. Hach Ultra Analytics Inc., Grants Pass, OR; ph 970/663-9760, www.hachultra.com.
Programmable signal gating module
The Programmable Signal Gating Module line of analytical quadrupole mass spectrometers is designed for data gathering from pulsed plasma diagnostics and timed surface science applications, either supplied with new instruments or retrofitted with existing ones. It consists of a firmware and hardware unit, along with software to control timed acquisition parameters (gate/delay/foreground/background/invert) with 0.1 µsec resolution. Main features include software gate control and integral variable gate control delay, for data acquisition within a user-defined time slice of a pulse cycle. It also offers foreground and background data channels for simultaneous data acquisition of appearance potential beam-to-background signals in modulated molecular beam studies. Hiden Analytical Ltd., Warrington, UK; ph 44/1925-445225, www.hidenanalytical.com
Small-footprint CD metrology tool
The ultrasmall-footprint (84×119cm) 8000-CD system offers film thickness measurement and determination on 150mm and 200mm wafers, for 5µm to sub-90nm critical dimensions (as well as trench depths and profiles), and n and k values from 190-1000nm in 1nm intervals. It offers easy recipe generation for complex thin-film stacks and multifaceted trench structures. The system’s core technology is based on deep ultraviolet-visible-near infrared broadband spectrophotometry, with patented reflective optics. n&k Technology Inc., Santa Clara, CA; ph 408/850-7300, www.nandk.com.
Copper additives for sub-65nm manufacturing
The Ultrafill L-4000 series of levelers and suppressors targets sub-65nm node interconnect metallization for memory and logic devices. The levelers feature the ability to “dial-in” specific amounts of dopants into ultrapure copper films, to improve via stress migration accuracy and capabilities. The products were developed in conjunction with major copper tool suppliers and direct interaction with IC customers, the company said. Rohm and Haas Electronic Materials, Philadelphia, PA; ph 215/592-3000, www.rohmhaas.com.
Photoresists for bump, thick-resist apps
The SIPR photoresist is a second-generation positive-tone thick photoresist designed to eliminate cracking during plating. It is capable of a single coat up to 100µm thick, offering improved photo speeds, and is easily stripped with standard solvents after plating. The SINR AD50 is a TMAH developable siloxane-based photoresist for stress buffer applications. It has a dielectric constant in the 3.0 range, and requires a curing temperature of about 230°C. It can be processed with standard photolithography equipment. Shin-Etsu MicroSi Inc., Phoenix, AZ; ph 650/937-0000, www.microsi.com.
Wafer bonder platform for R&D
The Elan wafer bonder, targeting R&D and other low-volume bonding applications, has the same core technology as the company’s higher-end bonders, and is compatible with its MA/BA mask aligners. Standard configuration is supplied on a metal frame platform with a vacuum chamber with built-in control electronics and computer. Typical processes developed on the Elan, such as anodic, glass frit, eutectic, thermocompression, and polymer bonding, are transferable to automated high-volume wafer bonding cluster tools to transition from R&D to pilot line production and then mass production. Süss MicroTec GmbH, Munich, Germany; ph 49/8932-0070, www.suss.com.
In-air electron detector
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The Model AC-2 photoelectron spectrometer measures ionization potential and work function of surface in air, without requiring a vacuum environment. It consists of an open counter, equipped with a UV source, capable of measuring samples up to 50×50mm in size, powder samples, and films on any surface that emits photoelectrons-metals, semiconductors, organics, magnetic and polarized materials, and catalysts, pigments, and ceramics. Measurements can be taken in 5 min, vs. up to 30 min for other methods requiring a vacuum environment, the company claims. RKI Instruments Inc., Union City, CA; ph 510/441-5651, www.rkiinstruments.com.
New NIR spectrograph
The SD512NIR spectrograph is designed for use in optical emission spectroscopy and interferometric endpoint applications requiring measurement of wavelengths in the near-infrared. The product, which features a 512-element, linear indium-gallium-arsenide (InGaAs) photodiode array, can measure from 900-1700nm. A three-stage thermoelectric cooler reduces thermal noise. It comes with the company’s SpectraView software with a variety of open algorithms and user sequences. Tool integration is possible using RS232, Ethernet, and Digital I/0 communication. Verity Instruments Inc., Carrollton, TX; ph 972/446-9990, www.verityinst.com.
Aero-mechanical platform for FPD substrates
The GAMP noncontact turnkey platform offers noncontact motion, positioning, and handling for large-format flat-panel display substrates under most production scenarios. The product incorporates a stationary platform to let the substrate float, with CoreFlow’s Smart Nozzle technology combining pressure-atmosphere and pressure-vacuum zones. Other glass-handling features include an interface to loader, conveyor, and alignment capabilities. CoreFlow Ltd., Yoqneam, Israel; ph 97/2499-35757, www.coreflow.com.
Pressure measurement device
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The model 760 VactronÔ series capacitance manometer offers a variety of vacuum and pressure measurements for semiconductor process tools, industrial OEM systems, and laboratory and R&D equipment. Measurement parameters range from 0-10 to 1000 Torr, 0-1 to 20 psia, 0-1 to 100 kPa, and 0-10 to 1000 mbar/hPa. Standard accuracy is ±0.25% of reading, with optional accuracy of ± 0.15% of reading. A 0-10 VDC or 0-5 VDC signal output is linear with pressure and independent of gas composition. The device can be configured with industry standard 15 pin D-sub or 6 position terminal strip electrical connections. Multi-turn potentiometers are provided; a wide range of vacuum and pressure connections is also available. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, www.setra.com.
Screen-printable phase change material
The PCM45F-SP thermal interface material is a screen printable phase-change material aiming to give chipmakers more flexibility during the semiconductor packaging process. It has a thermal impedance of .07°C-cm2/W, a specific gravity of 2.0 grams/cm3 that is 25% lighter than common silicon-based greases, and lower viscosity than silicon-based greases. A uniquely designed polymer system addresses the problem of “pump out,” enabling the material to pass 3000 temperature cycles. Honeywell Electronic MaterialsSunnyvale, CA; ph 408/962-2098, www.honeywell.com/em.
New platform for chip design
The Talus platform provides RTL-to-tapeout through a new IC implementation methodology, “Automated Chip Creation,” built on Magma’s unified data model architecture, which the company claims lets designers create flat or hierarchical layouts in just a few hours, beginning with as little as 10% of the design RTL available. The software automatically creates multiple floorplans with each subsequent RTL change to enable real-time viewing of their impacts on chip size. A new constraint set, called “Relative Placement Constraints,” enables the user to reproduce desired aspects of a previous floorplan and establish accurate timing constraints, investigate floorplan alternatives, and trade-off package decisions with respect to design speed, area, noise, yield, and power integrity early in the chip design process. Multithreading and distributed processing capabilities allows users to implement very large designs in as little as two days, the company claims, adding that full chip designs ranging from 4 to 15 million gates have been processed through the Talus flow. Magma Design Automation Inc., Santa Clara, CA; ph 408/565-7500, www.magma-da.com.