Product news
05/01/2006
ViPR evolves Piranha to reduce FEOL ashing steps
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The ViPR point-of-use chemical blending subsystem is equipped with FSI’s Zeta batch spray and spin platform for resist strip. Mixing sulfuric acid and hydrogen peroxide results in an exothermic reaction and a corresponding increase in temperature. To achieve 200°C on the wafer, the new technology first raises the temperature of the un-mixed sulfuric and peroxide streams and then mixes them at the right point to achieve maximum reactivity on the wafer surface. Batches of wafers rotate around the spray nozzles, which apply the ViPR chemistry across the surfaces. The moving meniscus of each droplet provides some additional force to assist in cleaning. A variation on the classic H2SO4/H2O2 (sulfuric peroxide mixture, or Piranha) etch/strip process, this process reportedly eliminates 80% of front-end-of-line resist strips at 45-32nm nodes. FSI claims its combination of chemical blending, delivery, and temperature controls eliminates the ashing step on most highly implanted photoresist, including on 1×1017 ions/cm2 plasma-doped photoresist, and lowers material loss. FSI International Inc., Chaska, MN; 952/448-8066, www.fsi-intl.com.
Compact wet bench uses new drying technology
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The MultiStep automated wet bench covers all wet applications including wet etching, layer thinning, surface cleaning, and layer stripping, for IC, MEMS, GaAs, and substrate manufacturing for wafer sizes from 50-300mm. At the heart of the tool is patented AeroSonic drying technology, which introduces an aerosol of nitrogen and isopropyl alcohol droplets into the process chamber via an ultrasonic oscillator nozzle atop the process chamber. Billed as a compact wet bench platform, the tool’s footprint is 3000×1640×1800mm for 200mm substrate processing. The drying technology is available as a standalone tool as well as an OEM version. AP&S GmbH, Donaueschingen, Germany; ph 49/771-8983-0, www.ap-s.de.
Upgraded tool for 300mm brightfield monitoring
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This fifth-generation broadband UV/visible brightfield inspection system captures yield-impacting defects on critical layers. The 2367, an extension of the 23xx series and intended complement to the 2800 series full-spectrum DUV/UV/visible brightfield inspection platform, incorporates algorithms from the 2800, such as advanced binning and classification, enhanced edge contrast, and multidie auto threshold. Also, a new image computer and time delay integration sensor enable a 2× faster data transfer rate. The tool shares a user interface and recipe commonality with other of this company’s platforms, includ-ing the 2800, Puma 9000 darkfield inspector, and eS32 e-beam inspection tool. KLA-Tencor Corp., San Jose, CA; 408/875-5473, web site: www.kla-tencor.com.
Controlling thin-film deposition rate and thickness
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The XTC/3 is a thin-film deposition controller for highly accurate monitoring of deposition rate and thickness. A patented oscillator technology, ModeLock, prevents film thickness errors caused by mode-hopping. Two models are available: a single-layer model supporting up to nine films, two sensors, and two sources, and a multiple-layer model with capacity for up to 99 processes, 999 layers, 32 films, two sensors, and two sources. The tool supports Inficon’s Crystal 12, Crystal Six, and dual-sensor automatic crystal switching. The half-rack box comes freestanding or with PC control. Inficon, East Syracuse, NY; ph 315/434-1100, www.inficon.com.
Frontend metrology tool for 45nm manufacturing
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The Z3D 7000 optical metrology tool is a fully automated standalone system built for semiconductor high-volume manufacturing process control at multiple process steps, including lithography, etch, film deposition, and planarization. The tool reportedly performs high-resolution surface topography mapping of semiconductor wafers at throughputs exceeding those achievable with existing mechanical profiling techniques such as atomic force microscopy. An advanced scripting capability allows users to automate image analysis, thereby extracting information about critical process control parameters in all three dimensions. Zygo Corp., Middlefield, CT; ph 860/704-3955, www.zygo.com.
Remote plasma source platform
The Litmas RPS is a fully integrated, remote inductive plasma source and power delivery system for delivery of reactive gas species for process applications such as wafer pre-clean, photoresist strip, and atomic-layer deposition (ALD), as well as for post-process exhaust gas abatement. A solid-state power-matching design delivers up to 3kW of stable radio-frequency (RF) power in less than 3msec, enabling faster changing, sub-90nm and 300mm processes. Advanced Energy Industries Inc., Fort Collins, CO; ph 970/407-6280, www.advanced-energy.com.
Organizing fab metrology data
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FabVision is a fab-wide data analysis system, incorporating a server, workstation, and software package to enable wafer manufacturers to easily store, retrieve, and analyze critical metrology and inspection data from production tools distributed throughout the process. Reports and data are generated and sent automatically to better manage operations at the fab, process, or customer level. The system combines data from multiple generations of ADE’s flatness, surface inspection, nanotopography, and film-mapping equipment. ADE Corp., Westwood, MA; ph 781/467-3500, www.ade.com.
Design-stage yield analysis tool
Yield Analyzer 2.0 provides automated yield analysis, enabling optimization of a design prior to tape-out by revealing yield-sensitive areas of the design. Different design styles at different stages are supported, including cell-based and custom, as well as different flows such as library, floorplan analysis, and detailed routing analysis using GDSII or DEF formats or Open Access interfaces. Proprietary third-generation analytical engines provide critical area extraction for nanometer technologies, avoiding accuracy loss due to commonly used sampling techniques. Ponte Solutions Inc., Mountain View, CA; ph 650/559-9001, www.pontesolutions.com.
Low-cost single-beam FIB
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The JEOL JEM-9320 single-column focused ion beam (FIB) system prepares thin films and cross sections for nanometric failure and defect analysis using S/TEM, TEM, or surface observation. It features a 30nA/30kV ion beam current for precise milling. Specimens can be observed in situ at a 6nm resolution using SIM imaging. Adjusting the beam current enables the tool to be used for high-speed, pinpoint fabrications. Specimen position is graphically displayed in a wide view mode, or at up to 30,000× magnification. JEOL USA Inc., Peabody, MA; ph 978/536-2309, www.jeolusa.com.
Resist strip for aluminum processes
The BAKER ALEG-380 photoresist stripper and residue remover is offered as an alternative to hydroxylamine-based chemistries in aluminum IC manufacturing processes. The remover cleans bulk photoresists, heavily cross-linked ash/etch residues (particularly those with high titanium content), and sidewall polymers. It can be used as a one-step chemistry in traditional semiconductor processes containing aluminum and silicon dioxide layers, as well as in backend packaging processes including flip-chip and bump applications. Processing time and temperature results are seen in 5-20 minutes, with typical bath life exceeding 24 hours. Mallinckrodt Baker Inc., Phillipsburg, NJ; ph 800/582-2537, www.jtbaker.com/micro.
150mm device measurement platform
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The M150 system is a configurable 150mm device measurement platform for measuring semiconductor wafers, ICs, printed circuit boards, MEMS, and even bioscience devices during R&D and engineering verification. The basic system includes a prober bundle, with interchangeable standard parts and accessories optimized for specific measurement needs, such as failure analysis, GaAs process characterization, PCB test, or millimeter wave packages. System precision is to 25µm, with module precision as low as 1µm. Users can choose an application-specific preconfigured package or build their own system optimized to an application. Cascade Microtech Inc., Beaverton, Oregon; ph 503/601-1000, www.cascademicrotech.com/m150.
Adhesives for die-attach apps
The AAA2300 series of electrically insulating die attached adhesives features a low coefficient of thermal expansion (CTE) that reduces CTE strain. The higher-CTE adhesive is suitable for pyramidal-die-stack on bleed-prone nitride passivated die without polyimide final passivation. The product line’s two lower-CTE adhesives are for same-die-stack applications requiring a gap filling bondline in place of a dummy die, protecting bonding wires from breaking in temperature cycling and thermal shock. Advanced Applied Adhesives, San Diego, CA; ph 858/348-1125, www.appliedadhesives.com.
Metal matrix composite material
The AlSiC metal matrix composite enables a tailored coefficient of thermal expansion (CTE) to eliminate the need for thermal interface stacking, increasing reliability in the field. The isotropic CTE value can be adjusted by modifying the Al-metal/SiC-particulate ratio. A high thermal conductivity prevents bowing and flexing of packaging and substrate material. A near- and net-shape fabrication process produces the composite material as well as fabricates the product geometry, enabling integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes. Ceramics Process Systems Corp., Chartley, MA; ph 508/222-0614, www.alsic.com.
Low-flow pulseless fluid delivery system
This fluid delivery system combines a no-valve fluid control principle with phase-canceling technology for continuous pulse-free fluid metering down to flows of 5 µl/min, and 1% or better accuracy for millions of cycles. Three separate valveless pump heads, uniquely timed, eliminate pulsation; a second stepper motor adjusts piston displacement, allowing for fine adjustment of the shot size by changing the stroke length. A touch screen interface can control up to 16 systems on a single bus. Up to 128 metering devices can be controlled using a PLC or computer. Fluid Metering Inc., Syosset, NY; ph 516/922-6050, www.fmipump.com.
Furnaceware to replace quartz, SiC consumables
The SiFusion suite of polysilicon furnaceware includes boats, towers, injectors, and pedestals for ASM, Aviza, Hitachi-Kokusai, and TEL vertical furnaces. The products are replacements for quartz and silicon carbide consumables in 200mm-300mm processes, including thin-film (LPCVD-silicon nitride and polysilicon), high-temperature (anneal/drive), and high-temperature oxidation. In diffusion applications, the components are clean to <1.0 E10/cm2 for all trace metals, and wafers can be hydrogen annealed up to 1200°C without receiving any metal contamination from the SiFusion fixtures. The boats minimize slip and sagging problems at temperatures up to 1350°C. Integrated Materials Inc., Sunnyvale, CA; ph 408/437-7591, www.integratedmaterials.com.