Product News
04/01/2006
Turbopump can pump up to 2000sccm of argon
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The Adixen ATH2300M high-flow maglev turbopump designed for semiconductor etch processes has 2000 liters/sec performance and is capable of pumping up to 2000sccm of argon for sub-90nm applications. It has five active axes, an automatic balancing system for any rotor imbalance compensation, an integrated heating system up to 75°C to eliminate by-product condensation, and inert gas purge to prevent particle build-up. The turbopump is maintenance-free and battery-free and is dedicated to metal, dielectric or poly-etch, ion implantation, sputtering, and plasma deposition. Alcatel Vacuum Technology France, Annecy, France; ph 33/45065-7777, www.adixen.com.
Software suite allows design modeling and analysis
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The Virtuoso resolution enhancement technology (RET) suite integrates lithography awareness directly into the previously released Virtuoso custom design platform, a design environment for custom ICs. Designers targeting sub-90nm manufacturing technologies can create layout designs that are less sensitive to critical yield-degrading lithography issues and are desensitized to common lithography process variations. The suite allows designers to analyze and optimize designs for both performance and yield by examining how target layout structures will appear in silicon by modeling the distortions that are inherent in sub-wavelength lithography. The suite includes interactive model-based simulation of layout designs, batch and interactive lithography rule checking, lithography-yield analysis and optimization, and trial-based optical-proximity-correction (OPC) capabilities utilizing critical lithographic parameters, including illumination mode, exposure, and focus. The Virtuoso RET Suite offers the same intuitive user interface and use model of the Virtuoso custom design platform. Cadence Design Sytems Inc., San Jose, CA; ph 408/943-1234, www.cadence.com.
Ultra-flat, ceramic vacuum wafer chucks
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These ultra-flat, high-purity ceramic vacuum chucks are three to five times stiffer than glass or metal alternatives. Available in several of this company’s materials including UltraSiC silicon carbide, PureSiC CVD silicon carbide, PlasmaPure alumina, and StatSafe ESD alumina, these chucks feature corrosion resistance, low thermal expansion, and high thermal conductivity. An array of surface profiles designed to meet specific customer requirements, for example, the ability to create specialized micro-bumps, is available. The company created a sophisticated 3-D method for mapping surface flatness, shown effective for extremely large components, which allows it to verify the controlled depth standard. CoorsTek Inc., Golden, CO; ph 303/271-7000, www.coorstek.com.
Photomask inspection systems for XRETs
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The Starlight-2 next-generation photomask inspection system provides contamination inspection for photomasks, including extreme resolution enhancement technique (XRET) ones, at the 65nm node and below. The system reportedly uses revolutionary image processing technology compared to the previous-generation Starlight, and its capabilities are designed for the detection of progressive defects. With this system, fabs can implement a photomask-requalification strategy that maximizes production yields by maximizing the window size in advanced lithographic processes. Its smaller pixel sizes (125nm and 90nm) provide the resolution and sensitivity to detect mask contaminants on device layers with the smallest pattern features. Starlight-2’s improved algorithms enable contamination detection in high-density patterned areas and its full-field inspection capability allows inspection in scribes and borders as well as on both single- and multidie photomasks. The Starlight2 maintains the speed of previous-generation Starlight platforms. KLA-Tencor Corp., San Jose, CA; ph 408/875-3000; www.kla-tencor.com.
Mass spectrometer product line
The Agilent 6000 series LC/MS portfolio of chromatography-based mass spectrometry systems includes five classes of instruments: a triple quadrupole (triple quad), a quadrupole time-of-flight (Q-TOF), a single quadrupole, an ion trap, and a time-of-flight (TOF) mass spectrometer. Each includes this company’s proprietary autotune technology with automatic calibration; compatibility with this company’s multimode source and HPLC-chip technology; and integrated LC and MS software for instrument control and data analysis. Application-specific software and other workflow elements are also offered. Agilent Technologies Inc., Palo Alto, CA; ph 877/424-4536, www.agilent.com.
SiC single-crystal wafer
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The PureBeta-S product fuses high-purity SiC powder technology, a good crystal growth method, and precise machining technology to produce high-quality, high-performance SiC single crystal wafers for high-power, high-frequency devices and optoelectronics. PureBeta-S ultra high-purity SiC sintered products are also useful in dummy wafers (50-300mm), heater-related products, and equipment parts for dry etch, ion implant, CVD, cleaning, and inspection. Density of the product is 3.15g/cm3; bending strength is 600MPa; and elascticity is 390GPa. Due to the high-purity SiC, PureBeta experiences little deformation and contamination under repeated processing. Bridgestone, Advanced Materials Division, Tokyo, Japan; ph 81/42-342-6486, www.purebeta.com.
High-purity optical lens material
The HPFS 8650 high-purity optical lens material for semiconductor microlithography is designed to support the performance and throughput requirements of polarized 193nm immersion lithography systems. This stable, predictable material exhibits high resistance to laser damage at 193nm, low compaction, no expansion, and low polarization-induced birefringence. In addition, the new material offers improved index homogeneity, low initial birefringence with no systematic pattern, and high transmission. Corning Inc., Corning, NY; ph 607/974-9000, www.corning.com.
Reticle inspection system
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The ES-240 automatic inspection system is designed for inspecting reticles, flat panels, and color filters, and for backend inspection of wafers before and after dicing on film. Features include batch loads, multiple illumination modes, including transmitted or reflected dark- or bright-field illumination, and flexibility in inspecting parts from 10mm × 10mm to 250mm × 250mm. Also available are numerous inspection algorithms, precision metrology, pattern inspection, and defect detection. The system will detect pattern defects, surface particles, inclusions, scratches and stains that range from 0.5 μm to >100 μm. Eutecnics, Acton, MA; ph 978/263-9998, www.eutecnics.com.
Multi-axis, x-ray inspection system
The Concept FX is a multi-axis, x-ray inspection system with 80/90/130kV x-ray source options, six axes of motion control, ergonomic design, and a no-clamp sample tray for fast load and unload. The x-ray source and detector tilt off-axis in relation to the sample, providing oblique object viewing in real-time. The system has a 46 × 52 in. footprint, yet can inspect large PCBs up to 20 × 24 in. Applications include failure analysis of bare boards, assemblies and parts, component interlayer prototyping, manufacturing process validation, and rework verification. FocalSpot Inc., San Diego, CA; ph 858/536-5050; www.focalspot.com.
GaN-on-diamond semiconductor wafer
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The gallium-nitride (GaN)-on-diamond Xero Wafer uses technology that enables the GaN layer to be atomically attached to a freestanding, proprietary polycrystalline chemical-vapor-deposited (CVD) diamond substrate (25 μm thick). The GaN exposed is an atomically smooth surface finish that is ready for further epitaxial deposition. The wafer is shipped freestanding or optionally on a disposable, silicon-wafer mount to permit easy handling during wafer processing. The GaN-on-diamond wafer extricates heat from the chip’s core almost at the instant that it is generated due to the subnm proximity of the chip’s active region to diamond. Group4 Labs LLC, Menlo Park, CA; ph 650/688-5760, www.Group4Labs.com.
Surface science research instruments
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The Nanovea series of surface science research instruments includes nano- and micro-hardness instruments, scratch and adhesion testers, and tribometers. Exclusively integrated in the nano-indentation instrument is the IBIS nano-indentation module with the multifrequency indentation technology feature. The Nanovea indentation and scratch platforms utilize a user-friendly, automatic z-approach that eliminates the manual process of lowering the tip to the surface. A sensor automatically senses and controls contact with the surface, preventing the tip from crashing and damaging the sample. The high clearance and automatic approach make it possible to accommodate samples up to 8 in. Micro Photonics Inc., Allentown, PA; ph 866/334-4674, www.microphotonics.com.
Line of electronic packaging materials
This expanded line of EPM electronic packaging materials have low outgassing properties to prevent contamination and have undergone extensive processing to maintain weight losses of <1% after exposure to temperatures exceeding 275°C for 1 hr. Among the new offerings are potting and encapsulating materials; static-dissipative and glop-top materials; dielectric gels; and thermal interface materials, which come in grease, adhesive, and gel forms. NuSil Technology, Cupertino, CA; ph 805/684-8780, www.nusil.com.
Wafer-flip module
This wafer-flip module, designed for 200- and 300mm wafers, is compatible with both edge-grip and vacuum-paddle end effectors. It has two motors, one for flipping and one for the wafer gripper mechanism. A 180° rotation of the wafer can be performed in <2 sec. The flipper is designed so that no particles (≥0.10.μm) are detected in the wafer path during airborne dynamic motion tests. All motors and motion mechanisms are contained in a purged enclosure. The system complies with all Semi and CE standards and mounts to pre-existing M6 holes in standard EFEMs. Owens Design Inc., Fremont, CA; ph 510/659-1800, www.owensdesign.com.
Compact computed tomography x-ray system
The nanotom high-resolution x-ray analysis system consists of a granite-based CT-construction with a 160kV high-power nanofocus x-ray tube and a special digital detector to reach a voxel resolution of <500nm (0.5µm). The fully digital detector has 5 Mpixel resolution and a measurement range expansion. The nanotom can examine samples with diameters up to 120mm and a weight up to 1 kg. The special door construction and the advanced sample fixture permit simple and precise positioning of the samples. Phoenix|x-ray Systems + Services Inc., St. Petersburg, FL; ph 727/456-1465, www.phoenix-xray.com.
Fiber-optic laser encoder system
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The RLE20 fiber-optic laser encoder system provides subnm nonlinearity and resolution capability of 38pm. Fiber-optics deliver the laser light directly to two measurement axes from a single laser source, eliminating the requirement for multiple remote-beam splitters, benders, and adjustable mounts. Differential measurement capability and 2ppb laser frequency stability assure high precision control over x-y axes. Subnm resolution capability is possible at velocities up to 1 m/sec and axis lengths up to 4 m. The laser system delivers positional output signals in differential digital RS422 and/or 1Vpp sine/cosine formats. Renishaw Inc., Hoffman Estates, IL; ph 847/286-9953, www.renishaw.com.
Ultra-low pressure documenting calibrator
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The Micro-Cal model 869 ultra-low pressure documenting calibrator has been designed for air-handling processes in critical environments that require portable, high accuracy, and low-pressure documenting calibration to certify pressure needs. This calibrator performs checks on sensors with accuracies as high as 0.00025 in. W.C. The Micro-Cal was engineered to be lightweight and compact for use in cramped or remote locations. This battery-powered unit provides a minimum of 8 hrs of operation, with recorded calibration times as fast as 5 min./unit. Setra Systems, Boxborough, MA; ph 800/257-3872, www.setra.com.
Precision UVC cure unit
The SCS Precision UVC ultraviolet cure unit offers full-spectrum UV curing, either integrated with the SCS Precisioncoat or as a stand-alone system. When coupled with either the SCS Precisioncoat or Precisioncoat EL, components move from the spray-coating system to the cure unit automatically, with the coating system PC controlling the cure cycle. The system has three intensity settings for curing a wide variety of coatings, inks, and solder masks, and can accommodate substrates from 2 to 20 sq. in. The drive system can be adjusted between 2 and 20 ft/min., and the UV arc is 25 in. wide. Specialty Coating Systems, Indianapolis, IN; ph 800/356-8260; www.scscoatings.com.
Residual gas analyzer
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The Qulee quadrupole mass spectrometer with integrated measurement display and control electronics has a removable front-end electronics package. With the electronics removed, the analyzer head can be baked at temperatures up to 250°C. An integrated control display on the electronics box eliminates the need for a PC to operate the unit. One-touch control displays the partial pressure readout of He, H2O, N2, O2, O2/N2 ratio, and a user-selectable channel from mass 1-50 amu. Maximum operating pressure is 2 Pa, and minimum detectable partial pressure is 1×10-10 Pa. ULVAC Technologies Inc., Methuen, MA; ph 978/686-7550, www.ulvac.com.