Product News
02/01/2006
MOPA-based light source offers high repetition rate
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The XLA 400 fifth generation MOPA-based light source offers chipmakers a high repetition rate at 6kHz and 90W of output power, to drive the volume production of semiconductor devices at the 65nm node and enable design flexibility for hyper NA (> 1.0) immersion lithography tools at the 45nm node and beyond. The source offers increased power to support various illumination schemes, permitting tighter dose stability and more stringent critical dimension (CD) control. Cymer Inc., San Diego, CA; ph 858/385-7300, e-mail [email protected], www.cymer.com.
Ultraviolet thermal processing platform
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The SOLA ultraviolet thermal processing platform blends industry-standard lamp-based UV light sources with the company’s multistation sequential processing architecture. With transistor and interconnect fabrication applications that require 5-10 min of total annealing, the SOLA (sequentially optimized luminescent anneal) tool should deliver 20-40 wafers/hr proportional throughputs. Based on the Vector platform, the 300mm tool features four stations through which each wafer passes in series. Each station allows for different temperatures, light frequencies, and lumen intensities to be set, so that multistep anneals can be performed although the time at each station remains constant. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, e-mail [email protected], www.novellus.com.
3-D software suite streamlines process documentation
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The SEMulator3D software suite connects semiconductor processing to design especially in training and documentation. The suite allows companies to quickly generate 2D cross sections from 3D models used in semiconductor process documentation, which improves training classes for fabrication personnel and internal communication. SEMulator3D is also useful to design and analysis groups, as well as semiconductor equipment companies. The 3D visualization capabilities of SEMulator3D aids in the yield, excursion, and optimization of semiconductor devices. Coventor Inc., Cary, NC; ph 919/854-7500, e-mail sales@ coventor.com, www.coventor.com.
Vacuum platform for process and metrology equipment
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Marathon 2 is a vacuum platform for process and metrology equipment. It features a high performance, configurable design with CenterSmart technology to enable precise, repeatable wafer placement in vacuum with real-time automatic trajectory correction to offset process-induced wafer shifts that could lead to wafer damage during subsequent handling. Available in compact and cluster configurations, Marathon 2 provides increased performance and shorter integration and cycle times for vacuum applications at 90nm technology nodes to sub-45nm nodes. Brooks Automation Inc., Chelmsford, MA; ph 781/455-8250, e-mail [email protected], www.brooks.com.
Advanced product suite for 45nm and 32nm manufacturing
A new suite of test products from Sematech is designed for calibrating tools and testing wafer products that will serve the 45nm and 32nm microchip generations. The SPIDER-300 300mm test wafer for the ≥65nm node evaluates the effects of process-induced degradation on the functionality of advanced transistor gate, logic circuits, and memory cells. The 888N CoMPetitor advanced test reticle for CMP has 100nm line spaces and is available on both 200mm and 300mm wafers. The NanoPattern, a 300mm test wafer with 40nm half-pitch lines, is aimed at manufacturers of etch and cleaning tools for testing extremely small features. ATDF, Sematech, Austin, TX; ph 512/356-7186, www.atdf.com.
Large-format beam switching module for UV laser processing
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A new large-format, laser-beam switching module enables the user to quickly and accurately switch the entire beam from one path to another, e.g., between two different experiments or between two separate processes. The switching module features a large-format design with a 50×50mm clear aperture that allows passage of a larger-diameter homogenized beam without beam corner clipping. Additionally, it is a vacuum UV product; thus, it can be used with short-wavelength UV excimer beams including 157nm, 193nm, and 248nm. The module is an industrial-grade product designed for continuous service and features remote control. JPSA, Hollis, NH; ph 603/595-7048, www.jpsalaser.com.
Microspot wafer analyzer system
The Semyos wafer analyzer has been designed for on-product thin film metrology in in-line process control applications for both the semiconductor and data storage industries. With its <23µm FWHM microspot, it is able to measure in the scribelines on production wafers. The wafer analyzer simultaneously determines film thickness and composition and characterizes single films and multilayer stacks. The x-ray optical design has a Peltier-cooled Si drift detector that achieves a resolution of 143eV. It features a versatile equipment frontend module that can be configured to individual fab and lab requirements. Available in either a single or double load-port configuration, it comes with one or two 300mm FOUP openers, one or two 200mm SMIF POD openers, or 100-300mm open cassette load modules combined with a FOUP or SMIF. PANalytical, Almelo, The Netherlands; ph 31/546-534-386, www.panalytical.com.
Materials metrology system
Built on the capabilities of this company’s RVX 1000 system, the VeraFlex materials metrology system is a flexible, nondestructive system used to monitor, measure, and control critical materials processes at the 65nm and 45nm modes from development through production on product and monitor wafers. Its measurement capabilities include thickness, composition, profile, bonding states, interface quality, and surface condition for a wide range of emerging materials metrology requirements. The transition and changeover from one application to another is reportedly seamless. ReVera Inc., Sunnyvale, CA; ph 408/530-3600, www.revera.com.
Vertical thermal processing system
The TELINDY 300mm vertical thermal processing system integrates the benefits of the company’s TELFORMULA sequential processing of varied film stacks and the productivity of its Alpha 303i. The system demonstrates high productivity through the combined advantages of minimized overhead time, an optimized gas delivery system, and a larger load size of 125 wafers. The new concept also offers high-speed robotics, a faster ramp-up, and a rapid cooling system. The TELINDY is capable of processing nitride and oxide films. Additional advanced films, such as low pressure radical oxidation, are planned for release later this year. The system has the same footprint as the Alpha 303i. Tokyo Electron Ltd., Austin, TX; ph 512/424-1000, www.tel.com.
IR spectrometer
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The InterceptIR spectrometer provides research-grade performance, speed, and sensitivity for trace gas analysis and monitors the air separation unit for hydrocarbon buildup. The Intercept IR spectrometer is based on this company’s Nicolet Antaris industrial gas system, an FT-IR analyzer that provides repeatable gas analysis with the capability of simultaneously analyzing over 100 gas species. The InterceptIR provides real-time, species-specific analysis of a product stream and configures alarms on a component-by-component basis so that appropriate actions can be taken should a hydrocarbon release occur near an air separation unit. An important advantage of IR spectroscopy for this application is that nitrogen, oxygen, and argon do not interact with IR light and are thus transparent. Thermo Electron, Waltham, MA; ph 781/622-1111, www.thermo.com.
Microscope with integrated heating system
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The MS-E1S microscope integrates a compound optical microscope with an infrared gold image furnace hot stage and a video recording and display system for the direct observation of the melting and recrystallization behavior of materials. Samples can be maintained in virtually any gas environment, pressure or vacuum level, and can be brought to high temperatures (1000°C in one min.) and then cooled to room temperature quickly. Images can be recorded in NTSC video format at 100×, 200×, or 400× magnification using the CCD camera and VHS or DVD recorder. Samples can be solid, liquid or powder with a choice of air, inert gas, and vacuum atmospheres. Ulvac Technologies Inc., Methuen, MA; ph 978/686-7550, www.ulvac.com.
XY nanopositioning stage
The new P-542 xy nanopositioning stage was designed for biotechnology and nanotechnology applications. Its frictionless flexure-guided design provides a travel range of 200×200µm. High-performance piezo-drives allow fast multiaxis motion with response times in the millisecond range. Capacitive feedback is integrated for closed-loop operation with subnm precision and motion linearity with <0.03% errors. The stage is suited for imaging, alignment, and nanomanipulation such as required in nanoassembly and nanomaterials testing. A large aperture of 80×80mm makes for easy integration into high-resolution microscopes and other probing instruments. It is available in xy, z, and xyz combinations, and in aluminum-, invar- and vacuum-compatible versions. PI (Physik Instrumente) L.P., Auburn, MA; ph 508/832-3456; www.pi.ws.