Featured Products
12/01/2007
PVD system for Gen 8.5 FPD manufacturing
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The AKT-PiVot 55kV PVD system deposits metal and transparent conductive oxide materials on Gen 8.5 (5.5m2) glass substrates. The new system is designed to increase the productivity and reduce the cost of manufacturing large-sized LCD TV panels. The AKT-PiVot system’s module architecture reportedly delivers faster cycle time and nearly 3× higher target utilization than any competitive system, and enables a large variety of configurations to maximize production efficiency. Unlike traditional in-line systems, the AKT-PiVot’s parallel processing capability eliminates bottlenecks caused by different process times for each film layer. The system’s cluster-like arrangement allows continuous operation during individual module maintenance. Each deposition module of the PiVot system features an array of large-volume, rotary targets that have >4× longer lifetime than conventional planar targets. Applied Materials Inc., Santa Clara, CA United States; ph 408/727-5555, www.appliedmaterials.com.
Microscope system
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The Titan3 80-300 is designed to deliver high stability and performance in a commercial scanning/transmission electron microscope (S/TEM). The Titan3 gives users the sub-Å imaging capabilities of a powerful commercially-available microscope. The ultra-high resolution S/TEM performance of this new system has a design that allows the combination of two Cs-abberation correctors and a monochromator on a single instrument. The system’s enclosure reduces environmental interference. The Titan3 features a fully-digital remote control interface that improves ease of use. A digital user interface allows users to operate the Titan3 remotely and in ambient conditions. A high-speed digital camera and smart user interface make operation easier and improves the handling of a wide range of applications. FEI, Hillsboro, OR United States; ph 503/726-7500, www.fei.com.
Small-delay defect test technology
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The TetraMAX small-delay defect automatic test pattern generator (ATPG) is for use by design organizations to improve the quality of manufacturing tests. Small-delay defect ATPG creates patterns to test the smallest defects inside ICs that could lead to failures when the devices are operated at full speed. Targeting these subtle delay-related defects using timing-aware pattern generation can improve the quality of test compared with existing ATPG technologies. Process variations can introduce small delays that adversely affect sensitive paths in a design, leading to circuit failures under certain conditions. This generator reliably detects these small added delays because traditional transition-delay ATPG technologies lacked sufficient timing resolution. The new ATPG technique is consistent with existing design-for-test methodologies and does not require changes to a design. Synopsys Inc., Mountain View, CA United States; ph 650/584-5000, www.synopsys.com.
Wafer edge review module
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This wafer edge review (WER) module is for the LDS3300 C automated defect detection, classification, and high resolution inline review system, which is used for front, back, and edge/bevel inspection and review of 45nm and 32nm devices. The WER module offers high resolution automatic defect review (ADR) capabilities for the classification of edge-related defects. High-resolution optical images in brightfield and color information combined with accurate mechanics enable the module to generate defect images around the wafer edge. The modular concept allows users to configure different process control units in various ways to fit best into their inspection strategy. Defects around the edge can be detected sensitively by equipping LDS3300 C with the WER and WEI module. High resolution defect images with the information needed for effective process control can be generated in a second step. Vistec Semiconductor Systems GmbH, Weilburg, Germany; ph 49/7131-20399-41, www.vistec-semi.com.