Product News
12/01/2007
Interface A client-side software library
This Interface A software solution, EDAConnect, is a client-side software library designed to assist integrated device manufacturers (IDMs) and third party software providers in creating applications that can utilize the data available via the new Interface A connectivity standards commonly known as equipment data acquisition (EDA). EDAConnect allows IDMs to upgrade existing fab software systems or create new systems to make use of the Interface A data. Third party software equipment engineering systems providers can also use EDAConnect to upgrade their software to be Interface A enabled. EDAConnect can be used to generate Interface A testing solutions. The product is designed using Microsoft .NET 2.0 and 3.0 technologies. Its abstraction layer, which allows for SEMI standard version independence, provides both the user and the equipment the ability to use the same versions of the SEMI Interface A standards. The EDAConnect abstraction layer creates a migration path as the Interface A standards are upgraded as well as the ability to handle mixed standards versions within the same fab. Cimetrix, Salt Lake City, UT United States; ph 801/256-6500, www.cimetrix.com.
Compact UV laser for wafer inspection
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The new Paladin Compact 355-4000 is reportedly the first solid-state, ultraviolet laser to deliver 4W of quasi-CW output (at 355nm) in a small footprint package. This laser is specifically designed for OEMs that will benefit from its combination of reportedly low COO, small size, high-quality output, and operational simplicity. In addition, because it can be either air-cooled or water-cooled, the Paladin Compact 355-4000 offers system builders enhanced flexibility. To make it easier to use the system with existing optical designs, its beam parameters (beam diameter = 1mm, M2 is <1.2) are identical to the larger-sized 4W Paladin model. The Paladin Compact 355-4000 requires only a single, long-lived pump diode (which is the main consumable in this type of laser), rather than two pump diodes. Coherent Inc., Santa Clara, CA United Status; ph 408/764-4000, www.coherent.com.
Link-processing system
The model 9850 dual-beam, ultraviolet (UV) laser link-processing system can be used in advanced memory-repair applications. It is reportedly the world’s first dual-beam, ultraviolet laser link-processing system designed for the most advanced nodes of DRAM and NAND Flash memory applications. The system is a memory-repair system that unites this company’s proprietary dual-beam architecture with its patented ultraviolet laser technology in one tool. The 9850UV produces a 0.8µm spot size by utilizing ESI’s new 100kHz ultraviolet laser, which was developed specifically for advanced DRAM and NAND Flash applications. The system is able to process small link pitches and can handle two banks of links in parallel due to the proprietary dual-beam architecture-effectively halving the number of links to process on a wafer. ESI Inc., Portland, OR United States; ph 503/672-5760, www.esi.com.
300mm wafer probe card for burn-in test
The latest addition to its Harmony family of full-area, 300mm wafer probe solutions-the Harmony wafer-level burn-in (WLBI) probe card-is reportedly designed to maximize throughput, as well as ensure higher quality and reliability of semiconductor devices. The Harmony WLBI probe card can contact ~40,000 test pads in one touchdown, enabling the testing of an entire 300mm wafer at high temperature (up to 130°C). The Harmony WLBI probe card incorporates advanced electronics and a new 3D MEMS MicroSpring contactor, which is designed to withstand the rigors of high-temperature burn-in testing and minimize cleaning, further increasing probe card availability and test cell productivity. FormFactor Inc., Livermore, CA United States; ph 925/290-4681, www.formfactor.com.
Remote analysis station for optical critical dimension metrology
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The NanoStation remote analysis station is for optical critical dimension (OCD) metrology and incorporates the latest generation rigorous coupled-wave analysis-based OCD software. The station features state-of-the-art multicore CPU technology and advanced ADAP scatterometry modeling software. It enables process engineers to utilize the full power of optical critical dimension measurement technologies, including both normal incidence reflectometry and spectroscopic ellipsometry methods, and quickly transfers data between standalone and integrated platforms. Nanometrics, Milpitas, CA United States; ph 408/545-6000, www.nanometrics.com.
Curing equipment with convection and long-wave IR heat sources
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The SCS Precision IRT, a curing system designed to quickly and safely cure a wide variety of coatings using both convection and long-wave infrared (IR) heat sources, combines both heat sources to provide an energy-efficient process that is less expensive and faster to run than many other types of curing systems. Features of the Precision IRT include: independently controlled convection and infrared heating modules; a four-corner pneumatic lift for safe, easy access; removable drip pans for fast and easy maintenance; and large area filters and stainless steel filter frames for long life and impromptu replacement. Also, using this system reportedly reduces the potential for solvent entrapment, bubbling, or blistering. Specialty Coating Systems Inc., Indianapolis, IN United States; ph 317/244-1200, www.scscoatings.com.
Desktop silicon validation and diagnostic platform
The V550 desktop platform is part of a unified system that integrates design, test, and diagnostic environments, leading to the rapid detection and repair of failures. It allows design and DFT engineers to quickly validate initial silicon with their test programs. The V550 can handle devices with up to 512 channels and can reportedly provide more memory per channel than other desktop systems. When driven with Teseda’s TWB software, it allows design teams to drastically cut validation and diagnostic time, and FA teams to quickly pinpoint failure candidates. The V550 also drives this company’s Diagnostic Manager (DM) suite of software tools, ScanXY, CellXY, and SecureXY. The DM tools link logical test mismatch data to the physical domain for rapid identification of defects and hot spots. Teseda, Portland, OR United States; ph 503/233-3315, www.teseda.com
Blended-product polymer
A new proprietary range of blended products, MAX-Series polymer, is designed to perform in demanding environments, specifically in applications requiring a combination of high temperature mechanical performance and dimensional stability. The polymer is a blend of Victrex PEEK polymer and genuine Extem UH thermoplastic polyimide resin from SABIC Innovative Plastics, two complementary, unfilled materials. It was created with the ability to perform at temperatures in the range from 150-275°C and offers better controlled coefficient of thermal expansion (CTE) over the whole temperature range than other polymers. It is a melt-processable material and has good chemical resistance and high purity. The new product will initially be launched with two grades: MAX-Series M1000 polymer and M2000 polymer, each containing different proportions of PEEK and Extem resin. Victrex plc, Thornton Cleveleys, Lancashire, UK; ph 44/1253-897700, www.victrex.com.