Issue



Featured Products


11/01/2007







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The CenTurio high efficiency wet processing system features an 8-in. system design with half-space technique for maximized throughput and efficiency. This fully automated wet process bench is equipped with the CenTurioDry drying tool and an effective rinse process. It is designed for all common etching and/or cleaning processes performed on many different substrate materials. In addition, CenTurio requires less space, is versatile, and is easy to operate with a low rate of product error. With optimized process design, 100 instead of 50 wafers per batch can be processed, raising the throughput by up to 80%. AP&S International GmbH, Donaueschingen/Aasen, Germany; ph 49/0 771-8983-149, www.ap-s.de.

Two coating/dispensing technologies

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Two coating/dispensing technologies apply catalyst inks onto membranes in electrode assemblies of proton exchange and direct methanol fuel cells: spray coating and discrete dot dispensing. DispenseJet technology deposits the ink with a uniform thickness and density so lines and patterns are reportedly smooth, even, and the same consistency throughout. Spray coating is for large areas, for controlled thicknesses, and even film thicknesses. Discrete dot dispensing is used for specific patterns with high edge definition and exact film build-up of volatile inks. The jet deposits the ink precisely where it is programmed to be placed, so waste is limited; masking is not needed. Discrete jet dispensing allows material application in tight spaces as small as 175µm with final dot diameters as small as 200µm. The system jets “on the fly” with no stopping between dots required at a rate of 200 dots/sec. Asymtek, Carlsbad, CA United States; ph 760/431-1919, www.asymtek.com.

C-V measurement instrument

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The model 4200-CVU instrument comes as a module that plugs into any available instrument slot of the model 4200-SCS semiconductor characterization system, allowing fast and easy capacitance measurements from femtoFarads (fF) to nanoFarads (nF), at frequencies from 10kHz to 10MHz. This design provides intuitive point-and-click setup, simple cabling, and built-in element models that eliminate the guesswork in obtaining valid C-V measurements. The model 4200-CVU includes an extensive set of test libraries. The system’s flexible and powerful test execution engine makes it simple to combine I-V, C-V, and pulsed tests into the same test sequence. The model 4200-CVU also comes with a variety of advanced diagnostic tools to help ensure the validity of C-V test results. Keithley Instruments Inc., Cleveland, OH United States; ph 800/688-9951 or 440/248-0400, www.keithley.com.

Laser interferometer encoder

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The RLE20 differential interferometer-based encoder system reduces noise-induced positional errors in the Vistec VB300 e-beam lithography tool through improved mechanical rigidity. These errors are reportedly expected to be <3nm. The VB300 tool provides the ability to load and expose piece parts as small as 5mm through to full 300mm wafers with corresponding mask plate substrate sizes. The RLE20 system includes three differential interferometers: two to measure position between the e-beam column and the wafer stage on the x and y axes and the third to measure yaw. The RLE laser interferometer system produces 1Vpp sine and cosine signals with each 360° period representing 158nm. Renishaw Inc., Hoffman Estates, IL United States; ph 847/286-9953, www.renishaw.com.