New Products
11/01/2007
Phase metrology system
The Phame phase metrology system enables high-resolution, in-die phase shift measurement of photomasks for 193nm lithography. It measures and analyzes the phase-shift of high-end PSMs and offers the ability to measure the much smaller production features on the mask used for printing the actual device features on the wafer. The system captures mask effects such as polarization, rigorous 3D mask effects, and diffraction. With its new capabilities, the system allows for improved process control in the mask design process and mask manufacturing. The architecture of the Phame system is based on the AIMS platform. The newly developed optical beam path enables phase-shift measurement under scanner-relevant optical conditions. The tool’s high precision imaging optics has a 0.4 NA, being 1.6 NA scanner equivalent, and enables full compatibility with current and future 193nm immersion scanners down to the 32nm node. On- or off-axis illumination can be used depending on the PSM type: AA-PSM, EA-PSM, or CPL. Carl Zeiss SMT AG, Oberkochen, Germany; ph 49/7364-200, www.smt.zeiss.com.
200mm auto gapping system
The AGS200 200mmWaferSense auto gapping system is a wireless, wafer-like device that improves film deposition, sputter, and etch processing. The system was designed to measure the gaps between the shower heads and wafers, and then report the data in real time so that defects related to reduced tool productivity and yield loss can be quickly identified and remedied. Designed for use in fabs manufacturing 200mm wafers, the wafer-like WaferSense AGS200 device wirelessly travels through deposition, sputtering, and etch equipment to measure gaps between the shower heads and pedestal, reporting data in real time so that defects related to reduced tool productivity and yield loss can be quickly identified and remedied. The WaferSense AGS200 uses Bluetooth technology to wirelessly send data to its application software for logging and analysis, and can operate for up to 4 hrs between recharging. It uses contactless sensors to measure gaps at three places between shower heads and the pedestal. It measures gaps from 9 mm to 20 mm. Gap accuracy is ±0.025mm with gaps of 9.5mm to 17mm. CyberOptics Semiconductor, Beaverton, OR United States; ph 800/366-9131, www.cyberoptics.com.
Photovoltaic metallization paste materials, system
A new series of screen printable thick film materials enables solar cell manufacturers to reduce their cost per watt by reportedly achieving higher cell efficiencies, higher production yields, and lower material consumption. The Solamet thick film metallization product range developments have improvements in n-type emitter frontside silver contacts, high coverage solderable tabbing silvers and silver aluminum inks, and low bow high electrical performing aluminum metallization. The frontside n-type silvers exhibit low contact resistance, high conductivity, high aspect ratio, and high print speed. Depending on the cell configuration, the new front side silver is also available in cadmium and lead-free variants. For backside solder applications, there is silver metallization with lower material consumption, and good initial and soldered aged adhesion, employing leaded and lead-free solders. The new material system is completed by a series of new Al compositions for wafer thicknesses down to 180µm. The new Al compositions are designed for low bow below the industry standard of 1.5mm of 6 in. × 6 in. cell sizes. DuPont Microcircuit Materials, Bristol, UK; ph 919/248-5598, mcm.dupont.com.
Thin-film measurement system
The F20-UVX thin-film measurement system uses the wavelength range of 200nm to 1700nm for increased thin-film analysis capabilities. This new system can measure the thickness of films from 30Å to 450µm thick and optical constants of films from 500Å to 10µm thick. While the F20-UVX system is often used for semiconductor processing applications, hundreds of other applications that have a smooth optically transparent film can be measured. Many accessories are available, which allow for the measurement of round, cylindrical, or freestanding films, as well as flat samples. Applications include photoresist and other semiconductor-specific films, dielectric films, polymers, and ophthalmic coatings. The F20-UVX determines thickness by illuminating the sample with white light and measuring the reflectance spectrum off the film. Once the spectrum is collected, the software analyzes it to determine thickness, optical constants, and other user-selectable parameters. Filmetrics, San Diego, CA United States; ph 858/573-9300, www.filmetrics.com.
Dicing die attach films
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The Hysol QMI5100 and Hysol QMI5200 dicing die attach film products are designed to streamline the die attach process, particularly for stacked die applications. Hysol QMI5100’s and Hysol QMI5200’s formulations combine the properties and functions of die attach film and dicing tape into one product. With these dual-structured materials, one need only laminate the film to the backside of the wafer, dice the wafer, pick the die, and move to die placement. Using these high performance films essentially removes the need for any dispensing or curing equipment or process steps, as paste dispensing is not required and curing takes place during the standard molding process. The materials leave no burrs after dicing and eliminate the common bleed issues associated with die attach pastes. Hysol QMI5100 is a 10µm thick material and is most commonly used on the DAX levels of the die stack. Henkel Corp., Düsseldorf, Germany; ph 949/789-2500, www.henkel.com/electronics.
Microspectroscopy system
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The MSV-300 series microspectroscopy system is a UV/VIS/NIR microspectrophotometer that provides transmittance
eflectance measurements of microscopic sample sites for a wide range of wavelengths, from the ultraviolet to the near infrared. Conventional measurements require samples with dimensions comparable to a mm-sized optical beam. The MSV-300 series can measure color, film thickness, and other spectral properties of a microscopic area for either large or small samples with a minimum spatial resolution of 30µm. The optional automated X-Y-Z stage provides multipoint or mapping measurements for surface analysis of samples. The systems feature a wide spectral measurement range, offering continuous measurements between 250 and 2000nm (MSV-370) using a spectrometer integrated with a microscopy accessory. Utilizing dual Cassegrain objective/condenser mirrors, the sample can be easily visualized for transmission or reflection measurements. An integrated CCD camera allows verification of the analysis site and sample position while defining the sample aperture on the software system. Jasco Inc., Easton, MD United States; ph 800/333-5272, www.jascoinc.com.
Precision motion slides
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The RGSW and RGSWX series slides provide linear motion performance to engineers in demanding industries such as packaging, assembly, medical and life sciences, semiconductor manufacturing, and factory automation. Like the original RGS slides, the RGSW and RGSWX slides offer precision motion in a convenient package. Their patented design allows high linear speeds without critical speed concerns. These slides offer thicker and wider bases than the original, more compact RGS slides. Both the RGSW and RGSWX series include direct sensor mounting systems and the RGSWX slides with direct motor mounting can accept NEMA-frame motors without any modifications or additional fabrication. Requiring no maintenance or lubrication, the anti-backlash slides can be manufactured in lengths up to 8 ft. Longer lengths are possible on a custom basis. Kerk Motion Products Inc., Hollis, NH United States; ph 603/465-7227, www.kerkmotion.com.
Optical and portable profilometers
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The NJ-Optimal and NJ-Portable profilometers are designed for high-precision measurement of micro- and nano-surface geometry and 2D/3D surface texture. The NJ-Portable is light and compact and can be placed over the surface under study. It is capable of measuring 25 × 25mm areas on cumbersome objects. Its chromatic confocal optical gauge has a vertical range of 480µm and vertical resolution down to 2nm. The NJ-Optimal complements this company’s existing range of 2D/3D high precision profilometers. It has a measurement envelope of 100 × 100 × 50mm, with motorized x and y axes and a manual z axis. nanoJura, Besançon, France; ph 33/3-8125-5368, www.nanojura.com.
Ultra-low defectivity CMP pad
The EcoVision 4000 ultra-low defectivity performance CMP pad is designed specifically for advanced copper barrier processes for 45nm technology nodes and beyond. Its design and chemistry is said to allow users to achieve a reduction in cost of ownership with consistent performance over the product’s lifetime. Users can change the pads on all platens at the same time, minimizing the costs associated with downtime and qualification processes. The pad’s manufacturing process produces a surface that results in increased contact area between the pad and the wafer. This reduces defects and improves die yields by minimizing scratches and chatter marks across the wafer. resulting in good defectivity performance. Unlike soft pads, the EcoVision 4000 pad is conditioned, allowing for pad surface regeneration to achieve optimal polishing results that are consistent throughout the pad’s life as well as from pad to pad. Rohm and Haas Electronic Materials, Philadelphia, PA United States; ph 877/288-5881, www.rohmhaas.com.
Universal bond tester
The system 650 universal bond tester is a dependable, compact test system with expandability to support advanced packaging requirements. The System 650’s quick-start test modules permit rapid changeover between wire pull, tweezer pull, ball bond shear, cold ball pull, or die shear tests. All interchangeable test modules can be range-selected over a broad scale, permitting measured force resolution of <1 mg. Calibration accuracy between different machines is maintained within overall system accuracy of 0.15%. The System 650 conforms to SEMI S2 ergonomic standards, with comfortable joystick controls and “one touch” motorized constant focus microscope height adjustment. The overall system footprint is 560 mm high × 432mm wide × 585mm deep. The System 650 complies with a wide range of industry standards including Mil Std 883, ASTM F 1269, EIAJ ET-7407, JESD22-B117, and JESD22-116 CE. The bond tester is also ROHS WEEE compliant. Royce Instruments Inc., Napa, CA United States; ph 707/255-9078, www.royceinstruments.com.
Automated wafer packing/sorting system
The WPC EVO wafer handling/packing/unpacking machine is a next-generation 300mm tool that provides the capability to fully automate wafer packing, unpacking, and sorting processes between industry standard cassettes, FOUP/FOSB and horizontal wafer shippers. The machine completely manages the logistics process (100% traceability), can handle full range (thick or thin) wafer handling, and operates in a fully automated environment, with SECS/GEM300 Standard. It also reportedly reduces wafer breakage and cosmetic defects caused by manual handling processes. NBS Technologies Inc., Toronto, Ontario, Canada; ph 480/459-5600, www.nbstech.com.
Electroplating tools for WLP development
Two new development electroplating tool versions leverage this company’s Ascent 200mm and Leapfrog 300mm scalable plating tool platforms. These new development tools are designed to enable more companies to enter and support the market for wafer level packaging (WLP) by providing the basic metal deposition engines along with control and chemical delivery systems. The tool combines traditional single-bath, multiple-tank plating approaches into a single-cell process with software recipe control of all metal deposition. The plating computer’s sensors enable accurate, real-time monitoring and control while providing a development architecture to add statistical and chemistry monitoring routines. Surfect Technologies Inc., Tempe, AZ United States; ph 215/693-6240, www.surfect.com.
CMP slurries for low-k devices
This company has improved its B6600 platform of barrier CMP slurries for an integrated solution for copper barrier CMP at advanced technology nodes. The barrier slurry platform is tunable, enabling the products to be customized to deliver good planarity and defect performance across a wide range of integration schemes. The update has reportedly very good low-k dielectric and copper removal rate control, resulting in very good electrical performance. The B6600 barrier slurry products are being produced and used for technology nodes from 90nm through 45nm. Cabot Microelectronics Corp., Aurora, IL United States; ph 630/375-5412, www.cabotcmp.com.
Custom-grown single crystals
These single crystals of more than 30 metals and alloys can normally be grown to order using a range of techniques, for example, Bridgman or Czochralski. Crystals can be supplied with specific or random orientations and in a variety of shapes and sizes. Also available are single crystals and wafers cut from single crystals of semiconductors (e.g., Si, Ge, GaAs, and InP), a wide variety of pure and doped crystals, and a selection of SrO, BaO, CaO, and ZrO2 crystals. Custom fabrication and finishing services are also available. Goodfellow Corp., Oakdale, PA United States; ph 800/821-2870, www.goodfellow.com.