PRODUCT NEWS
08/01/2007
Inspection system
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The Puma 9150 inspection system features optical modes that enable capture of a broad range of yield-critical defects for 45nm production. The system provides high darkfield production throughputs and enhanced capture of low-profile, large-area defects, such as underpolish and slurry residues from copper CMP. It also improves darkfield defect capture in etch applications, such as microbridges and partially or fully blocked vias. The system is being used for 65nm production, 45nm ramp, and sub-45nm R&D. Multiple optical modes provide improved defect type capture across an extended application space and allow for increased sensitivity to bridging, shorts, and other pattern defects in the etch process. KLA-Tencor Corp., San Jose, CA United States; ph 408/875-9037, www.kla-tencor.com.
Dry vacuum pump for medium vacuum applications
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The XtraDry dry vacuum pump is suitable for all medium vacuum applications down to 10-1 mbar where there is a need to pump dry, inert, and nonreactive gases. Operated as either a stand-alone or backing pump, XtraDry operates free of hydrocarbons and particulate matter, preventing contamination of the process or environment. It can be used in load locks and differential seals and as a backing pump for turbo pumps in high vacuum systems. A unique seal design prevents gas backstreaming within the pumping system, enabling gases to be pumped regardless of molecular weight. An automatic standby mode reduces the speed of the pump by more than 30% during operation near ultimate pressure. Pfeiffer Vacuum Inc., Nashua, NH, United States; ph 603/578-6500, www.pfeiffer-vacuum.com.
Cluster tools
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The Alcatel AMS 3200/AMS 4200 cluster tools provide recent process capabilities in DRIE for etching silicon materials and glass-like materials, as well as PECVD solutions for SiO2 and Si3N4 isolation layers. Wafer handling modules are based on BROOKS field-proven stations. Process modules are equipped with a high-density, low-pressure ICP plasma source for Bosch DRIE silicon etching and etching of deep SiO2, quartz, fused silica, borosilicate, and glass, and PECVD deposition of SiO2 and Si3N4 at room temperature. These cluster tools are dedicated to volume production of MEMS and 3D semiconductors. Alcatel Micro Machining Systems, Annecy, Cedex, France; ph 33/5065-7777, www.adixen.com.
Reticle etch system
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The Applied Centura Tetra III advanced reticle etch system controls trench depths across quartz masks to less than 10Å and reduces critical dimension (CD) loss to less than 10nm, reportedly enabling the use of alternating phase shift mask (PSM) and aggressive optical proximity correction techniques in users’ most critical device layers. The system offers virtually zero defect, high productivity etch processes for chrome, quartz, molybdenum silicon oxynitride (MoSiON), and various new materials for next generation lithography applications. The Applied Centura Tetra III system has an ultra-clean and extendible platform. By etching a wide variety of masks, the system can minimize dependence on process libraries, tool operation complexities, and development cycle times. Applied Materials Inc., Santa Clara, CA, United States; ph 408/727-5555, www.appliedmaterials.com.
Gas abatement system
The Helios 6 gas abatement system can be used for high hydrogen flow processes, such as Si and SiGe epitaxy, LPCVD tungsten and compound semiconductor MOCVD, has six inlets for process gases, plus an additional inlet for gas box purges or other ancillary operations. The Helios 6 gas abatement system is based on an inward-fired combustion technology and can reportedly reduce hydrogen concentrations below the lower explosive limit in flows as high as 200slm. BOC Edwards, Wilmington, MA, United States; ph 978/658-5410, www.bocedwards.com.
Single-wafer cleaning system
The SS-3100 300mm single-wafer cleaning system features an ~15% smaller footprint than its predecessor and incorporates a newly developed high-speed wafer transfer system for processing of 300 wafers/hr. The system is equipped with eight cleaning units (chambers), each of which can be equipped with bevel cleaning and Nanospray2 functions to supplement conventional scrubbing techniques. Dainippon Screen Mfg. Co. Ltd., Kyoto, Japan; www.screen.co.jp.
Table-top SEM microscope
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The Phenom microscope bridges the gap between optical and scanning electron microscope (SEM) technologies. Operated via its touch screen, the microscope can be used in many locations and does not require specialized facilities or highly skilled operators. Capable of yielding magnification up to 20,000×, the Phenom addresses a wide variety of industrial and academic applications, including quality assurance, product development, research, and teaching. FEI Co., Hillsboro, OR, United States; ph 503/726-7500, www.fei.com.
Microscope inspection
The NAT-31 42X-540X microscope inspection system with a Universal Serial Bus 2.0 camera resolves ≤1µm features when added to this company’s probe station. The system’s zoom optics have a 0.7×-4.5× objective lens that provides magnification of 42×-270× for probe placement and device under test alignment with the standard 0.5× auxiliary lens. Removal of the auxiliary lens changes the range of magnification to 84×-540× for inspection and fine geometry probing. J microTechnology Inc., Portland, OR, United States; ph 503/614-9509, www.jmicrotechnology.com.
Post-litho pattern enhancement system
The 2300 Motif post-lithography pattern enhancement system is designed for production of next-generation feature sizes using current lithography technology. Employing a proprietary plasma-assisted process, the new system delivers controlled photoresist hole and space CD shrinks of up to 100nm, creating features as small as 10nm, demonstrating extendibility to the 22nm node and beyond. The Motif process can be tuned for a range of feature sizes in the pattern. Lam Research Corp., Fremont, CA, United States; ph 510/572-0200, www.lamresearch.com.
Vision inspection
The SPM ProberStation 150 combines 3D inspection and modern optical microscopy in a vision inspection system for fast, repeatable AFM and SPM studies. Built on a stable granite stage, the station is said to virtually eliminate undesired movement in the Z direction during large movements in the lateral plane. The travel area of the motorized stage accommodates samples up to 150mm×250mm, and measurements are repeatable ±200nm. Micro Photonics Inc., Irvine, CA, United States; ph 866/333-4674, www.microphotonics.com.
Flow ratio controller
The Delta II flow ratio controller measures, divides, and controls user-specified ratios of mixed gas flows to multiple zones or chambers for optimum process uniformity and repeatability. It reportedly features a wider dynamic ratio control range and faster gas flow response for shorter cycle times and increased throughput. Advanced e-diagnostics are accessible through an embedded Ethernet interface. MKS Instruments Inc., Wilmington, MA, United States; ph 978/284-4000, www.mksinst.com.
Particle counters
The HSLIS M65 UL1604-compatible particle counters allow continuous, real-time monitoring of fluid particle contamination levels in Class I, Division II environments. It also measures particles in solvents, chemicals, and DI water. Sizing sensitivity is 0.065µm. The counter integrates into Facility Net software to monitor multiple flow systems. Particle Measuring Systems, Boulder, CO, United States; ph 800/238-1801, www.pmeasuring.com.
Macro defect inspection
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The NSX 100 automated macro defect inspection system is designed to provide inspection for the back-end manufacturing environment and for front-end quality assurance. NSX inspection tools detect macro defects (defects ≥0.5µm) that can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can impact process yield and product quality by providing feedback on process performance. The NSX 100 handles wafers up to 200mm at throughputs as high as 88wph. Rudolph Technologies, Flanders, NJ, United States; ph 973/691-1300, www.rudolphtech.com.