Product News
05/01/2007
Gas abatement systems
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The ATLAS family of gas abatement systems solves three process-related abatement problems. ATLAS TCS addresses the common CVD gases; ATLAS TPU addresses PFC gases in CVD and etch processes; and ATLAS Kronis addresses the low-k CVD gases in next-generation processes. The ATLAS system consumes half the fuel of previous-generation gas abatement systems, reducing running costs. It features one to six inlets with a number of options, including a temperature management system, and a flow capacity of up to 600slm. The new ATLAS system retains the same inward-firing Alzeta combustor technology as previous-generation gas abatement products; however, the layout has been redesigned to give maintenance engineers easier access. A large, color touch-screen display has also been added. BOC Edwards, Wilmington, MA, US; ph 800/848-9800, www.bocedwards.com.
Profiler application server
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The PAS-T4 profiler application server provides optical digital profilometry metrology results for real-time process monitoring and control. A proprietary library search engine is a key component in Timbre’s optical digital profilometry (ODP) platform, which is widely used in photo, etch, CMP and deposition applications for both stand-alone and integrated metrology systems. The PAS-T4 is optimized for Timbre’s ODP 2006 optical metrology platform and has an automatic data loss prevention system. The new T4 system will also provide speeds up to two times faster than previous PAS generations. The speed enhancements accommodate the trend toward higher sample rates and for complex applications such as BEOL, FinFet and advanced STI structures. T4 has full backward compatibility with previous versions of PAS and will support all advanced features. Timbre Technologies Inc, a TEL subsidiary, San Jose, CA, US; ph 408/200-1400, www.timbrecom.com.
Photomask inspection system
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The TeraScanHR system is a production-capable 45nm-generation photomask inspection system for the 45nm node and beyond. The system is highly configurable with a broad range of pixel sizes for optimizing productivity and cost-effectiveness in day-to-day production across several chip generations. The TeraScanHR features an image acquisition system with high NA, ultra-low aberration optics, a high-precision autofocus capability, and an improved stage with lower vibration. In addition, new database modeling algorithms improve the handling of complex OPC shapes. Integrating the latest generation of supercomputer technology, the system operates with higher throughput when using the highest-quality inspection modes. The system can be configured to inspect critical and noncritical photomasks. Its larger pixels permit faster scan times for 130nm to 65nm nodes while the highest-resolution 72nm pixel is aimed at 45nm and below photomasks. KLA-Tencor Corp., San Jose, CA, US; ph 408/875-9037, www.kla-tencor.com.
Metal hardmask system
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The Applied Endura metal hardmask system with new Versa TTN PVD technology delivers an advanced TiN hardmask film used for patterning copper/low-k interconnects and high-aspect-ratio contact structures. An integral component of a patterning stack, this metal hardmask film enables profile control while preserving the k value of ultralow-k dielectric materials for increased chip speed and yield. For dielectrics with k ≤2.5, a metal hardmask patterning scheme preserves the k value integrity by minimizing damage caused by the plasma and strip processes, and reducing the thickness requirement for the underlying barrier film. The TiN hardmask, with significantly higher etch selectivity to the dielectric compared to photoresist, enables a thinner patterning film stack, and enables superior CD and profile control. The system is designed for high volume manufacturing at the 45nm and 32nm nodes and provides a throughput of up to 85 wph. Applied Materials Inc., Santa Clara, CA, US; ph 408/727-5555, www.appliedmaterials.com.
Particle filters
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This line of MaxP particle filters are designed to improve the reliability, useful life, and mean-time-between-maintenance of mass spectrometer helium leak detectors and associated vacuum pumps. They are used in Alcatel, Balzer, DuPont, Edwards, Leybold, Varian, Veeco, and VIC systems. The reusable stainless steel filters are installed by replacing the centering ring in the inlet port. Helium Leak Testing Inc.,Northridge, CA, US; ph 818/349-5690, www.heliumleaktesting.com.
Advanced packaging films
These advanced packaging film products include two new families of permanent dielectric films, the SINR-series and the SPS-series, as well as the next-generation photoresist in the current SIPR-7120 series. The SINR and the SPS series are photodefinable films. The SINR is based on siloxane polymer chemistry and can be cured at 180°C or lower. The SPS is based on polyimide silicone chemistry. These new materials are TMAH-developable and can be integrated into existing processing lines that use conventional developers. The SIPR-7126 is a positive-tone, chemically amplified, TMAH-developable photoresist capable of up to 100µm film thickness in a single coat. Shin-Etsu MicroSi, Phoenix, AZ, US; 888/642-7674, www.microsi.com.
Perfluoroelastomer parts
Kalrez 9100 perfluoroelastomer parts are specifically designed for ultra-low contamination in aggressive plasma environments. They are for static and dynamic sealing applications in deposition as well as certain etch and ash processes. Kalrez 9100 parts have resistance to dry process chemistry, including oxygen and fluorine-based plasmas, and have thermal stability with maximum continuous service temperature of 300°C. The parts extended the PM cycle time from two to three times in HDPCVD, PECVD, etching, and ashing applications. DuPont Performance Elastomers LLC, Wilmington, DE, US; ph 800/853-5515, www.dupontelastomers.com.
193nm reticle haze prevention system
This Clarilite Certified 193nm reticle haze prevention system helps semiconductor manufacturers reduce reticle haze in 193nm lithography. Haze is formed when impurities deposit on a reticle due to the presence of airborne molecular contaminants and moisture in the reticle environment. To prevent haze, reticles must continuously reside in an extremely clean and dry environment. The Clarilite Certified system provides a continuous cleansing environment for the reticle using chemically purified gas. This solution includes products and services for work-flow analysis, engineering, gas microcontamination, microenvironment control and testing. Entegris, Chaska, MN, US; ph 952/556-3131, www.entegris.com.
300mm silicon wafer packer
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The high-speed, second generation AWP 300-2 silicon wafer packer has a dual-robot design that achieves throughput of 150wph along with safe handling. This fully upgraded 300mm wafer packer has a patented end-effector technology for safe handling and placement of interleaf materials. Complete with newly designed internal wafer buffers and integrated material reject bins, the packer has full wafer-sorting functionality. Its modular design is compatible with a wide variety of carriers, wafer packs, FOUPs, FOSBs, and open cassettes. Integrated Dynamics Engineering (IDE), Randolph, MA, US; ph 774/270-0782, www.ideworld.com.
FE analytical SEM
The JSM-7001F thermal field emission analytical scanning electron microscope (SEM) acquires high-resolution micrographs at up to 1,000,000× for applications ranging from semiconductors, metals, minerals, and materials to ceramics. It features an in-lens field emission gun that delivers more than 200nA of beam current to the sample. A small probe diameter at low kV and high current characterizes nanostructures with a resolution of 1.2nm at 30kV. The SEM can be used in low accelerating voltage X-ray spectroscopy and crystallography at and below the 100nm scale. The large specimen chamber designed for samples up to 200mm in dia. can accommodate a variety of detectors simultaneously. JEOL USA Inc., Peabody, MA, US; ph 978/536-2309, www.jeolusa.com.
Carbon nanotube analysis
This Dimension-P2 Raman system has now been specially configured for critical carbon nanotube analysis. It is integrated with laser attenuation capability and an xyz-mounted probe accessory for quality control and process monitoring of a broad range of carbon nanotube formulations and products from graphite powder to films. The system has 4cm-1 coverage from 140-2000 cm-1, laser power from 1-300mW, good sensitivity for rapid research quality analysis of radial breathing modes, metallic characteristics, G-translational mode for C-C stretching, and D-disorder mode and multiwalled structures. Lambda Solutions Inc., Waltham, MA, US; ph 781/478-0170, www.LambdaSolutions.com.
CD and overlay metrology system
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The IVS 185 system can make critical dimension (CD) and overlay measurements using the same metrology recipe while improving productivity. The tool targets 50mm to 200mm wafer production requirements. The IVS 185, an extension of the IVS 165 system, has a footprint that is 20% smaller than its predecessor and has a guaranteed 1800 hrs MTBF. It also has a multi-z element, which enables measurement of up to four planes in a consistent field of view inside a single measurement sequence. The multi-z component can also perform as many as 10 separate measurements at the same time, maximizing data collection and throughput. Nanometrics, Milpitas, CA, US; ph 408/435-9600, www.nanometrics.com.
X-ray diffraction software
The X´Pert Stress Plus 2.0 software package analyzes residual stresses in polycrystalline coatings. The new software includes the existing X´Pert Pro hardware platform and the recently extended stress measurement possibilities of X´Pert Data Collector 2.2. This package now enables residual stress analysis of any combination of substrate and polycrystalline coating material. Dedicated techniques allow measurement of nanocrystalline, randomly orientated or highly textured polycrystalline coatings. The substrate can be amorphous, polycrystalline, or single crystal. The software supports all data used for the analysis of polycrystalline coatings, including grazing incidence measurements. PANalytical, Almelo, The Netherlands; ph 31/546-534-444, www.panalytical.com.
Ultra-high purity diaphragm valve
The 20 series fluoropolymer diaphragm valve can control the flow of slurry and aggressive fluids in semiconductor and clean-area applications. It has a flow path and valve seat area that optimize fluid flow dynamics for minimal pressure drop and enhanced flow rates, and resistance to aggressive media. As a result, the 20 Series valve offers a life of more than a million cycles in slurry applications. Compliant with the SEMI-F57-0301 standard for polymer components, the valve has a body machined from virgin 100% ultra-high purity PTFE for superior chemical resistance. Parker Hannifin Corp., Tucson, AZ, US; ph 520/574-2600; www.parker.com/partek.
Mass spectrometer
The PrismaPlus mass spectrometer for qualitative and quantitative gas analysis and leak detection has a robust, compact design and simple systems integration. With the ability to select mass ranges, detectors, ion sources and interface options, this mass spectrometer can be employed in areas such as industrial and analytical environments and semiconductor production. The PrismaPlus delivers results in three different mass ranges (1-100, 1-200, and 1-300amu) down to a detection limit of 1×10-14 mbar. With available Faraday and electron multiplier detectors, low-level contamination in the vacuum system can be quickly identified. Pfeiffer Vacuum Inc., Nashua, NH, NH; ph 603/578-6500, www.pfeiffer-vacuum.com.
Mini-CRDS gas analyzer
The Halo mini-cavity ring-down spectroscopy (CRDS) device is a compact gas analyzer for calibration-free measurement of dedicated analytes in the parts-per-billion to parts-per-million range. Based on a patented continuous wave (CW) CRDS technology, the Halo can be used to measure an array of analytes, including moisture, methane, acetylene, hydrogen cyanide, formaldehyde, and ammonia. The device requires no consumables. The gas analyzer is environmentally friendly because it removes the need for fossil-fuel based standards to calibrate its equipment. Tiger Optics LLC, Warrington, PA, US; ph 215/343-6600, www.tigeroptics.com.