Product News
04/01/2007
Computational litho platform
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The Tachyon 2.0 second-generation hardware-accelerated image-based (optical proximity correction) OPC and OPC verification platform supports customer roadmaps for 45nm and 32nm nodes. Tachyon 2.0 offers a 4× increase in modeling power and a speedup in OPC and OPC verification. With improved process-window accuracy and speed, a single Tachyon 2.0 system rack provides the same production capacity as four first-generation Tachyon racks. It supports up to 256 complex optical simulation kernels and up to an 8µm dia. optical interaction range for 45nm designs. Tachyon 2.0 also reduces power consumption by more than 50% when compared with a first-generation Tachyon system with equivalent computational throughput. Advanced capabilities include 3D photomask lithography simulation. Built with IBM components, Tachyon 2.0 gives users the advantages of a single-source supply for both the hardware and software elements of an OPC correction and design verification system. Brion Technologies Inc., Santa Clara, CA; ph 408/653-1500, www.brion.com.
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Quanta 3D SEM/FIB Dual Beam
The analytical DualBeam for advanced 3D research and development, the Quanta 3D FEG, combines the company’s latest advances in ion and electron optics and the environmental SEM technology of the Quanta family of products. The new system eliminates the boundaries imposed by traditional high vacuum systems. The Quanta 3D FEG expands the range of DualBeam solutions for nanoresearch and industry, nanobiology, and nanoelectronics. The system provides users with improved versatility and flexibility. The system features a high current ion column for rapid, site-specific cross-sections of samples to reveal subsurface structures and features while the system’s electron source design delivers improved SEM imaging. Increased electron beam current enables higher throughput spectroscopy. FEI Co., Hillsboro, OR; ph 503 726 7500, www.fei.com.
Precision imprint litho tool
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This Imprio 1100 high-throughput, whole-wafer, precision imprint lithography system is targeted at compound semiconductor and data storage applications. Primary applications of the technology are: patterning of photonic crystals for increased directionality of light extraction from LEDs; low-cost nano-patterning of compound semiconductor growth substrates; precision patterning of high-value subwavelength structures to form optical components for laser diodes and optical communication systems; and patterning of magnetic hard disk drives (HDD). The system delivers sub-50nm resolution, with the precision and CD control of e-beam lithography. MII has adapted its S-FIL process to the needs of compound semiconductor manufacturing, including imprinting on non-flat substrates using a proprietary low force imprint scheme and a thin flexible template ideal for fragile compound semiconductor substrates. Molecular Imprints Inc., Austin, TX; ph 512/339-7760, www.molecularimprints.com.
Sindre manufacturing system for NIL
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Sindre, a high volume manufacturing system for nanoimprint lithography (NIL), offers a manufacturing level solution to producers of consumer products such as cameras, mobile phones, palmtops, flat screens, and next generation hard-disk drives, as well as optical storage media like HD-DVD and Blu-ray. Two key technologies have been developed into the system. The first, IPS, is the inversion of a hard master into an intermediate polymer stamp (used once for imprinting and then discarded), which limits contamination risk and increases master life-time. The second, STU, simultaneously combines UV and thermal NIL, allowing the complete imprint sequence to be performed at a constant temperature. The Sindre system is able to imprint 30 wafers/hr on up to 8-in. dia. substrates. A subsequent model will be capable of up to 90 wafers/hr. Obducat, Malmö, Sweden; ph 46/4036-2100, www.obducat.com.
Programmable pulse power supplies
The Pro series of programmable pulse power supplies-also called rectifiers-enable precision plating in applications where geometries are 0.1μm or smaller. Frequently used in semiconductors and medical devices, the Pro Series line includes DC, pulse and pulse periodic reverse power supplies. Configurations are available in single or multiple channels of output, multiple output cells, and a wide variety of output current and voltage ranges. The Pro series features an HTML browser-based control program, optional Windows-based control software, and an integrated communication protocol. Other benefits include multiple rectifier control, data logging, and local/wide area network support. Dynatronix, Amery, WI; ph 715/268-8118, www.dynatronix.com.
Gas detector for industrial applications
The Series 3000 XPIS (explosion proof, intrinsically safe) robust gas detectors utilize existing two-wire systems to monitor for toxic and oxygen gas hazards in potentially flammable environments. The gas detectors require minimal sensor replacement/downtime. The gas sensors available for the Series 3000 XPIS include oxygen, hydrogen sulfide, carbon monoxide, ammonia, and sulfur dioxide. The remote sensor can be mounted up to 50 feet away from the detector. Honeywell, Palatine, IL; ph 800/538-0363, www.honeywellanalytics.com.
Probe card analyzer
The new PB6800 analyzer has a 12 in. dia. tungsten carbide measurement chuck with dual cameras and extended stage travel that allows probe arrays as big as 300mm in dia. to be touched down without overhanging the chuck surface. Probilt’s measurement system can be expanded up to 12,000 test channels with optional software selected relay or FET drive available on all channels. The high chuck lift capability is 400lb (180kg). The complete line of ITC Probilt probe card analyzers provide repeatable test data for all types of probe card technologies. ITC - Integrated Technology Corp., Tempe, AZ; ph 480/968-3459, www.IntTechCorp.com.
PROLITH litho optimization
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The latest version of the PROLITH lithography optimization product, PROLITH 10, enables users to predict lithography process windows for integrated circuit (IC) designs down to 32nm. Its predictive capabilities have advanced as the industry has embraced OPC to solve its sub-wavelength challenges. PROLITH 10 enables detailed, predictive model-based OPC, with next-generation shape definition, for immersion lithography-based designs; this provides design for manufacturing (DFM) insight early in the development cycle. Used as a virtual lithography cell, PROLITH 10 lets designers and process engineers experiment with a wide variety of lithography process and OPC conditions and corrections, even before resists or scanners or other tools are available for the new node. KLA-Tencor Corp., San Jose, CA; ph 408/875-9037, www.kla-tencor.com.
Epoxy for bonding, casting, coating, and potting
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The EP30HT transparent epoxy for general purpose bonding, casting, coating, and potting combines physical strength, resistance to elevated temperatures and humidity, and chemical resistance properties with an optical clarity of over 97% spectral transmittance. The service temperature ranges from −50°C to over 205°C. The bonded assemblies exhibit dimensional stability, and shrinkage after cure is −0.0003 inches/in. EP30HT produces strong bonds that are resistant to chemicals including water, oil, and most organic solvents. It adheres to both similar and dissimilar materials including metals, glass, ceramics, vulcanized rubbers, and many plastics, with shear bond strengths over 3200psi being attained. The hardened adhesive has a volume resistivity >1015 ohm-cm, a dielectric strength of 440V/mil and a dielectric constant of 3.46 at 1MHz. Master Bond Inc., Hackensack, NJ; ph 201/343-8983, www.masterbond.com.
Sapphire wafer carriers
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These custom-fabricated sapphire wafer carriers are durable and transparent for the thinning of GaAs, indium phosphide, silicon, and other semiconductors. They are available in sizes from 2˝ to 6˝ in dia. and can be manufactured as thin as 0.018˝, depending on their diameter. These optical-grade, high-purity sapphire wafer carriers have flatness and parallelism to 0.0025mm and incorporate flats and laser markings. They are supplied polished or ground and custom-perforated with patterns for vacuum hold-down or delamination, and are designed for repeated use. The sapphire is resistant to chemicals, chips, and scratches. Meller Optics Inc., Providence, RI; ph 800/821-0180, www.melleroptics.com.
Dieletric gels for chip package encapsulation
These three low outgassing, dielectric gels, the EPM-2480, EPM-2481, and EPM-2482, were designed for the encapsulation of chip packages in devices where outgassing-related contamination poses a problem. These products cure into a soft, compliant silicone, which helps reduce stress on electronic assemblies during temperature cycling, and protects against environmental factors and shock. EPM-2480 and EPM-2481 are based on dimethyl silicone systems, while the EPM-2480 is a lower viscosity, firmer gel than the EPM-2481. The EPM-2482 is based on a diphenyl dimethyl silicone system for added temperature stability. NuSil Technology, Carpinteria, CA; ph 805/684-8780, www.nusil.com.
Hybrid nanopositioning translation stage
The M-511.HD hybrid nanopositioning translation stage overcomes the limitations of conventional precision positioning systems by combining the piezoflexure drive advantages of unlimited resolution and rapid response with long travel ranges of up to 100mm and high holding forces of a servo-motor/ballscrew arrangement. It has 4nm linear encoder resolution, nanometer level increments, millisecond settling time to nanometer accuracy, active compensation of stick/slip during startup and settling, active backlash compensation, and 100kg load capacity. The C-702 hybrid nanopositioning controller reads the stage position from an integrated, 4nm resolution linear encoder and continuously actuates both the piezoelectric and servo motor drives. The hybrid controller is equipped with a high-speed encoder interface and can handle encoder count rates of 100 million pulses/sec. PI (Physik Instrumente), Auburn, MA; ph 508/832-3456, www.pi-usa.us.
Micro-objective focusing system
The MIPOS 500 UD micro-objective focusing system is for applications requiring upside-down operation such as inverted microscopes. Its design, which is free of mechanical play, provides a total travel of 500µm and provides a high resolution in the range of nanometers. As with others in the MIPOS series, the mounting of this system entails screwing the FLEX-Adapter thread-ring into the imaging system (e.g. a microscope) and mounting the MIPOS 500 UD on this ring with a clamping screw. Integrated position sensors enable positioning without hysteresis and drift. Piezosystem Jena, Jena, Germany; ph 49/3641-6688-0, www.piezojena.com.
Thermoplastic material for CMP rings
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PEEK thermoplastic materials can be used in CMP (chemical mechanical planarization) retaining rings. These materials have inherent purity, strength, chemical resistance, and wear resistance. The PEEK polymer can be machined to tight tolerances and is compatible with process components such as slurries. Its design and processing flexibility allows it to be used in many types of applications, and it is available in finished form such as stock shapes, films, and coatings. Ultra-high purity PEEK meets requirements for extractables in cleanroom, wet processing, and pharmaceutical environments. These products are designed to be melt-processable. The polymer, a repeat unit that consists of oxy-1, 4-phenylenoeoxy-1, 4-phenylene-carbonyl-1, 4-phenylene, is semi-crystalline. Vitrex USA Inc., West Conshohocken, PA; ph 484/342-6001, www.vitrex.com.