Product News
03/01/2007
Revamped optical overlay metrology
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A redesign of the company’s optical overlay metrology system, the Archer 100 offers >30% improvement in precision to 1.4 TMU (total measurement uncertainty) with system throughput exceeding 80wph using typical production sampling, the company claims. Optics have been redesigned for better side-by-side matching, with low aberration to meet tight 45nm overlay requirements. A new imaging system helps improve signal-to-noise ratio with low-contrast films and lower pixel distortion. A “MicroAIM” target option provides more information to the overlay tool by closely simulating overlay-sensitive chip structures. A new illumination system improves measurement accuracy and robustness in 45nm and below high-volume memory production, and reduces tool-induced shift. KLA-Tencor Corp., San Jose, CA; ph 408/875-9037, www.kla-tencor.com.
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Metal etch for sub-70nm memory
The Opus AdvantEdge metal etch system, for etching sub-70nm aluminum interconnects in NAND flash and DRAM memory devices, offers a process-optimized five-chamber configuration (three etch, two strip) vs. standard four-chamber metal etchers. CD uniformity is improved by 50% (<5nm, 3σ), with 2× faster strip rate with enhanced corrosion resistance, and 50% higher throughput. Features include proprietary wafer temperature tuning, a tunable RF source, and specialized etch chemistry. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647, www.amat.com.
MOCVD for GaN LEDs
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The TurboDisc K-series metal organic chemical vapor deposition (MOCVD) gallium nitride (GaN) platforms target production of high-brightness blue and green light-emitting diodes (LED) and blue lasers. The K300 version features Veeco’s GaNzilla II reconfigurable reactor and source modules designed to accommodate future reactor technologies, with a fully automated transfer system for high throughput and a four-port expansion-ready hub for future multimodule processing and measurement modules. The K465 system uses the same platform, and offers the highest available production throughput today, the company says. Veeco Instruments Inc., Woodbury, NY; ph 516/667-0200, www.veeco.com.
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TEOS for SiO2 deposition
This module, available as an upgrade to Oxford’s Plasmalab System100 and System133 PECVD tools, enables delivery of TEOS (tetraethoxysilane, tetraethyl orthosilicate)-based plasma-enhanced chemical vapor deposition (PECVD) of silicon dioxide (SiO2). TEOS is used as an alternative PECVD precursor to silane (SiH4), for applications such as photonics, dielectric layers, and other structures. Features include optimized heat delivery lines, an optional glovebox, and ability to connect into a cleanroom extraction system, as well as flexible mounting options. Oxford Instruments Inc., Bristol, UK; ph 44/1934-837-000, www.oxinst.com.
CMP polishing pad
The Epic D100 CMP polishing pad for 200mm-300mm dielectric, shallow trench isolation, tungsten and copper processes can be customized to match grooving requirements in the US and Asia. Pad life is increased by 30% due to new material characteristics. A single polymer material is produced via a continuous single-sheet manufacturing process, to eliminate batch-to-batch and pad-to-pad inconsistencies found in the conventional pad. Cabot Microelectronics Corp., Aurora, IL; ph 630/375-5412, www.cabotcmp.com.
DRAM wafer probe card
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The Harmony XP wafer probe card, designed to optimize resources from today’s most advanced testers (x384 and higher die-under-test), enables testing of 300mm 1GB DRAM wafers in as few as two touchdowns. It incorporates the company’s MicroSpring technology to accommodate more than 50,000 contacts, which also provide low contact resistance and require minimal cleaning. The architecture enables pad pitches as small as 60µm and sizes as small as 55µm. Support for test frequencies up to 300MHz is optional. FormFactor Inc., Livermore, CA; ph 925/290-4681, www.formfactor.com.
Wirelessly “teaching” wafer transfers
The WaferSense ATS uses machine vision to “see” inside semiconductor equipment to find targets that mark 200mm-300mm wafer transfer locations, such as load locks and process chambers, and wirelessly relay video and real-time coordinate data to the user for robotic handling. Accuracy is to +0.1mm (x and y positions) and +0.5mm (z position). The teaching wafer can withstand exposure to 120°C for five minutes or less, if not in direct contact with the heat source. CyberOptics Semiconductor, Beaverton, OR; ph 503/495-2242, www.cyberopticssemi.com.
Deep UV mirrors
These deep UV enhanced mirrors, manufactured from an aluminum-based coating on a laser-quality substrate, are used for steering light sources at wavelengths through the UV, visible, and IR. Reflectance is >85% through the wide wavelength range from 170nm in the deep UV through 11µm in the IR. The substrate features a wavefront distortion of 1/10th wave (@633nm), low coefficient of thermal expansion, and laser grade surface quality and scattering profile. Edmund Optics, Barrington, NJ; ph 800/363-1992, www.edmundoptics.com.
Vacuum gauge module
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The IBM 401 “Hornet” ionization vacuum gauge module measures pressure from 1 × 10-9 to 5 × 10-2 Torr. An electrometer auto-zeroes to ensure that the readings are not subject to temperature drift. Filament current, emission current, and ion current can be monitored in real time on the research screen. Users can select from 16 common gases without having to apply manual correction factors; sensitivity and degas time can be user-adjusted. This gauge is also a direct drop-in plug-compatible replacement for the Granville-Phillips Micro-Ion gauge. InstruTech Inc., Longmont, CO; ph 303/651 0551, www.instrutechinc.com.
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Fluid dispenser
The Axion X-1000 series dispensing system for Class 100 cleanrooms is configurable for single or dual-valve dispensing to accommodate a wide variety of fluids, processes, and applications. Features include mass-flow control and calibrated process jetting to control critical aspects of fluid dispensing in a closed feedback loop. Pneumatic valves are exhausted to the machine’s base to optimize ventilation. Particle generation is minimized through the system’s cable track and an optional HEPA filter for downward air flow. Asymtek, Carlsbad, CA; ph 760/431-1919, www.asymtek.com.
SLR imager for microscopes
The E-330 micro-imaging system for microscopy includes a digital SLR camera (based on a 7.5 megapixel CMOS sensor) to show real-time frame images. Features include a 1.2× adapter, RM-1 multifunction remote control, and a multicable to link to either a TV monitor or PC. A dust reduction system shakes at 35,000 vibrations/sec when the unit is turned on to remove dust and debris from the camera sensor. Olympus Life and Material Science Europa GmbH, Hamburg, Germany; ph +49/40237-735426, www.olympus-europa.com.
Liquid dispense module
The TakLDM FractalFill liquid dispense module incorporates controller, analytical, and delivery technologies for implementing real-time closed-loop control and dispense of multivariant chemistries for semiconductor wafer cleaning and etching processes. Tools can be manufactured to fit multiple blending systems into one. Multiple interface ports are provided for tool interface and automation, and the system can be integrated into any spray or immersion-type cleaning system. Capabilities include blending chemistry and closed loop maintained to ±0.05wt% (APM), and blended chemistry binary to ±10ppm. Tres-Ark Inc., Austin, TX; ph 512-804-0700, www.tresark.com.