Product News
11/01/2004
FIB and ESEM system repairs mask defects
 |
The Accura XT+ combines the VisIONary focused ion-beam (FIB) column and an environmental scanning electron microscope (ESEM) into one system for 65nm-node mask defect repair. The system accommodates current photomasks as well as next-generation lithography techniques such as EUV reflective, LEEPL, nanoimprint, and others. The FIB reportedly offers smaller spot size and more accurate beam placement for imaging and repair, and the ESEM enables e-beam repair and high-resolution imaging while eliminating adverse charging effects. CAD Copy software allows repair of previously irreparable defects on single-die masks, and its open modular architecture supports all mask data formats. FEI Co., Hillsboro, OR; ph 503/726-2695, e-mail [email protected], www.feicompany.com.
Workstation provides ultrahigh-resolution imaging
 |
The CrossBeam EsB FIB/SEM workstation offers energy and angle selective backscattered electron (EsB) imaging at ultrahigh resolution without further column adjustment. A proprietary Gemini field-emission SEM allows high-contrast, material-selective imaging for feature analysis down to the nanoscale level. A compact, five-channel gas injection system and a large, fully eucentric specimen stage support diverse applications such as material analysis, subsurface root-cause failure analysis, TEM sample preparation, nanostructuring, and e-beam lithography. Carl Zeiss SMT, Nano Technology Systems Division, Oberkochen, Germany; ph 49/7364-20-3836, fax 49/7364-20-4970, e-mail [email protected], www.smt.zeiss.com.
Mini-batch ALD system targets advanced films
 |
The Verano 5000 is a 300mm, mini-batch atomic-layer deposition (ALD) system for depositing high-k capacitor dielectric films such as Al2O3, HfO2, and HfSiOx for high-volume applications with quick turnaround time. The system can handle batch sizes from 1–50 wafers without the use of filler wafers, and is available with a six-FOUP stocker. Features such as fast temperature ramping, an isothermal chamber, cross-flow precursor injection, and side-by-side installation reportedly improve throughput and uniformity, reduce cycle times, and save installation time and space. Aviza Technology Inc., Scotts Valley, CA; ph 831/439-6221, e-mail [email protected], www.avizatechnology.com.
Silicon drift detector is LN-free
 |
The UltraDry silicon drift detector is a liquid nitrogen (LN)-free solution for high-throughput energy-dispersive spectroscopy applications. The detector exhibits resolution of 140eV (Mn) at 2500 kcps and 175eV (Mn) at 60,000cps, and can detect light elements down to boron with vibration-free operation. Users can combine the UltraDry with an LN-cooled detector in the NORAN System SIX analyzer to collect, organize, and analyze data from multiple sources. Thermo Electron Corp., Waltham, MA; ph 800/532-4732, e-mail [email protected], www.thermo.com/microanalysis.
Macro defect inspection system
The NSX-115 automated macro defect-inspection solution is optimized for 2D gold and solder bump and probe mark inspection, as well as outgoing fab quality-control applications. The system is 3–5× faster than the previous NSX model, enabling <2µm resolution inspection of probe marks at throughputs of >30wph (200mm). A field upgrade kit based on Windows XP is also available for users of NSX-105s. August Technology Corp., Minneapolis, MN; ph 952/259-1647, e-mail [email protected], www.augusttech.com.
Analog/digital transducer
 |
The HPS Series 999 Quattro transducer integrates the miniaturized hot-cathode ionization sensor, MEMS-based MicroPirani sensor, and a piezo sensor within a single, compact pressure-measurement device. The transducer can be operated by digital communications or as an autonomous analog unit; combined output provides measurement from atmosphere to the 10-10 decade. MKS Instruments Inc., Wilming.ton, MA; ph 800/345-1967, fax, 978/284-4999, www.mksinst.com.
TOC analyzers
The Sievers 900 Series of total organic carbon (TOC) analyzers includes laboratory, on-line, and portable models, as well as the optional 900 Autosampler. Sievers DataPro 900 software integrates the Autosampler with a 900 model analyzer for sampling capabilities without the use of external gases or reagents, requiring approximately 2 hr of maintenance each year. Dynamic range of 0.03–50,000ppb, analysis time of 4 min., and a touchscreen display offer quick access to trend or real-time data. Ionics Instrument Business Group, Boulder, Co; ph 800/255-6964, www.ionicsinstruments.com.
Polarization manager
 |
The PM3000A simultaneously monitors and controls optical polarization with the functionality of the PC1000C polarization controller and PS2300B in-line polarization analyzer in one instrument. An advanced control algorithm automatically sets the output polarization to any state with accuracy of better than 1° (>40dB), and supports analysis routines including PDL, PMD, Jones matrix, and extinction-ratio measurements. Optellios Inc., Ewing, NJ; ph 609/671-9800, fax 609/671-9801, e-mail [email protected], www.optellios.com.
Metal-matrix composite
An aluminum silicon carbide (AlSiC) metal-matrix composite provides tailored CTE and high thermal conductivity for the housing, interconnection, and thermal management of microelectronic, optoelectronic, and power electronic devices. Modifying the Al-metal/SiC particulate ratio allows tuning of the CTE value for matching capability that eliminates thermal interface stacking. A net-shape fabrication process enables high thermal-conductivity inserts (>1000W/mK) or cooling tubes to be incorporated for more advanced thermal management. CPS Corp., Chartley, MA; ph 508/222-0614 ext. 42, e-mail [email protected], www.alsic.com.
Thermal interface materials
Thermally conductive TP-1600 films and TP-2400 pads improve dissipation in electronic components and assemblies and are designed for ease of use and process flexibility. Because they are pre-cured, the fabricated TIMs do not require special application tools, are reworkable, and are available in a wide range of thicknesses. For similar heat-management needs in high-powered CPU applications, TC-5021 thermally conductive grease enables customers to achieve thin bond lines and can be used in high-volume, automated manufacturing environments. Dow Corning, Midland, MI; ph 989/496-1869, e-mail [email protected], www.dowcorning.com.