Product News
10/01/2004
Implant tool shows flexibility in range
 |
The second-generation Ultra tool family is an upgradeable suite of 200–300mm high-current, low-energy implant systems that can operate in a range of beam currents from 4.5–7mA, allowing users to select or upgrade beamlines based on manufacturing needs and productivity goals. Shorter scheduled maintenance time and the Eterna extended-life source reportedly improve tool cost-of-ownership. The multiwafer platform combines fast beam-tuning with 2keV-drift beam current performance based on proprietary electron-confinement beamline technology. Axcelis Technologies Inc., Beverly, MA; ph 617/638-0022, e-mail [email protected], www.axcelis.com.
System inspects up to 150wph
 |
The WaferView 325 system provides automated detection and classification of yield-robbing defects on the front, back, and edge of 300mm wafers, replacing multiple inspection and review systems for lower cost-of-ownership. An onboard integrated ReviewScope microscope offers rapid review, dispositioning, and root-cause analysis for each critical lithography, CMP, and etch process step. The 325 uses two inspection heads that operate simultaneously and independently — one at 5µm sensitivity, inspecting 100% of the front surface of a 300mm wafer at >50wph. Combined with the second, 20µm inspection head, the system can achieve throughputs >150wph. The 325 uses patented automatic defect classification (ADC) technology, with robust new detection and classification algorithms that automatically adapt to normal wafer-to-wafer and lot-to-lot process variations. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, e-mail [email protected], www.rudolphtech.com.
Turbo pumps offer easy peripheral installation
 |
The TPH 1201 turbo pump provides pumping at 1200 liter/sec for N2 and Ar throughput of 22mbar liter/sec. The TPH 2303 provides H2 pumping at 1900 liter/sec and heavy gas throughput at 2750sccm/mbar liter/sec for nitrogen. Both pumps feature an advanced rotor design to improve the pumping performance without drag stages to clog with particulates; the rotor design still allows for backing pressures in the mbar range, making the pumps suitable for fast and void-free deposition in HDP-CVD and ALD wafer processing. The integrated controller permits easy cable connections to peripheral devices that control venting, interlocking backing pump and control, and heat, temperature management, or cooling functions. Users can connect only the peripherals their operations require. Pfeiffer Vacuum Inc., Nashua, NH; ph 603/578-6500, fax 603/578-6550, e-mail [email protected], www.pfeiffer-vacuum.com.
PVD tool is convertible for 200/300mm applications
 |
The Timaris 300mm physical vapor deposition (PVD) tool, developed for MRAM production, shows barrier repeatability/control down 0.1Å and 18wph throughput with two deposition modules. Each module can easily be converted for 200mm or 300mm wafers and can process >12,000 wafers between maintenance cycles. The tool can be configured with an EFEM or loadlocks, linear dynamic deposition for across-wafer uniformity, a high-energy ECWR plasma source, RF bias capability, and UHV modules. An optional in situ four-point probe is available. Singulus Technologies AG, Kahl/Main, Germany; ph 49/6181-9828020, e-mail [email protected], www.singulus.com.
4-in-1 failure system
The Nanome|x high-powered, nanofocus, 4-in-1 failure analysis system performs nondestructive testing on complex semiconductor devices and integrated electronic assemblies, and is also suitable for micromechanics and material testing. The system uses a nanofocus tube that can be operated in four modes to resolve defect details from 200–300nm in FBGAs, CSPs, and flip chips, for example. Qualification of bond wire sweep meets the MIL-STD-883E quality assurance standard. Phoenix|x-ray Systems + Services Inc., Camarillo, CA; ph 805/389-0911, fax 805/445-9833, e-mail [email protected], www.phoenix-xray.com.
Chip component trim system
The TrimSmart W778 is a high-throughput laser trim system specifically for use in adjusting resistive values of current-generation thin-film chip resistors and resistor networks. The system uses a laser wavelength that produces a very low TCR effect for device stability. A fully integrated software package is Windows-based and reportedly does not require programming support. The trim system is claimed to produce narrow cuts with a smaller kerf, smaller heat-affected zone, and less microcracking than previous systems. GSI Lumonics Inc., Wilmington, MA; ph 760/295-4166, e-mail [email protected], www.gsilumonics.com.
Ion beam source
 |
The Diamonex G-2 CD source offers substrate cleaning, etching, ion-assisted deposition, and direct deposition in a high-current, low-energy, broad-beam source. It has a gridless design that provides high densities of low-voltage ions without grid erosion or clogging that contaminates the process. The source has no process-gas restrictions, and extended voltage ranges are available. It uses Semi-certified DC power supplies for long-term stable operation. Morgan Advanced Ceramics, Fairfield, NJ; ph 800/433-0638, fax 973/808-2257, e-mail [email protected], www.morganadvancedceramics.com.
Benchtop x-ray system
The Verifier benchtop x-ray system is an entry-level, low-cost, closed-cabinet solution with a 29×32in. footprint. The system is portable and has a 80kV, 33µm microfocus x-ray tube, and is suited for inspection, failure analysis, and verification of reworked BGAs, µBGAs, chip-scale packages, and other surface-mount devices and connectors. The system can be configured to be adjacent to existing rework equipment, or as a standalone portable unit. Options include automatic defect software and a customized Verifier workbench. FocalSpot Inc., San Diego, CA; ph 858/536-5050, fax 858/536-5054, e-mail [email protected], www.FocalSpot.com.
TEC controller
The Series 850 rack-mounted thermoelectric cooler (TEC) controller offers full PID linear temperature control coupled with autotuning to provide long-term temperature stability of <0.002°C. The TEC can be configured for power requirements up to 600W, and a variety of temperature sensors can be used for feedback. Options include RS-232 and RS-485 serial communications as well as GPIB. Applications include electro-optics testing and/or manufacturing, semiconductor manufacturing, and medical diagnostics. Alpha Omega Instruments, Cumberland, RI; ph 800/262-5977, e-mail [email protected], www.aoi-corp.com.
Defect management software
Klarity SSA (spatial signature analysis) software for use with defect management systems provides automated classification and root cause analysis of defect clusters and patterns to improve fab-wide process control. The software imports wafer-map data generated by inspection tools and then characterizes and groups defect clusters by their identifiable signatures for process line and tool monitoring and engineering analysis. It has an open-architecture platform, supported by all KLA-Tencor tools, including brightfield, darkfield, e-beam, and unpatterned. KLA-Tencor, San Jose, CA; ph 408/875-5473, e-mail [email protected], www.kla-tencor.com.
Gas analysis system
 |
The TGA320 trace gas analyzer, a maintenance-free measuring system for continuous monitoring of ammonia concentration, incorporates Omnisens' laser-based photo-acoustic detection system for a detection limit of 0.1ppb and a large dynamic range. DSP-based electronics control the system, display gas concentrations continuously, and provide a response time in less than 2 sec. Lighthouse Worldwide Solutions, Milpitas, CA; ph 408/945-5905, fax 408/942-1032, e-mail [email protected], www.golighthouse.com.
Wafer-carrier technology upgrade
ViPRR II (variable input-pressure retaining ring) CMP wafer-carrier technology is now available for upgrade on IPEC 372 and 472 CMP platforms, offering edge exclusion to 3mm, controlled zone back pressure, gimbal technology that ensures optimal center-to-edge uniformity, and a carrier hole pattern that reduces or eliminates local hot spots. No software changes are required, resulting in minimal tool interruption during installation. Strasbaugh, San Luis Obispo, CA; 805/541-6424, e-mail [email protected], www.strasbaugh.com.
Integrated MEMS technology
Nanomech technology integrates microelectromechanical systems (MEMS) elements with standard CMOS semiconductor processes for nonvolatile embedded memory products, as an alternative to standard embedded fuse, flash, and EEPROM designs. Memory structures based on this technology reportedly can withstand operating temperatures ≥125°C, making it suitable for harsh environments in electronics applications. Each submicron structure represents one bit of memory. The technology is scaleable and can be used below the 45nm node. Cavendish Kinetics, 's-Hertogenbosch (Den Bosch), The Netherlands; e-mail [email protected], www.cavendish-kinetics.com.
Slide for linear motion apps
 |
The RGS 10000 slide builds on the original RGS 6000 platform, handling dynamic axial loads up to 100 lb. and speeds >60ips. The slide is compact, self-contained, and reportedly backlash- and maintenance-free, making it suitable for transportation doors, materials handling, automated cutting and sliding, and large x-y tables. Kerk Motion Products Inc., Hollis, NH; ph 603/465-7227, fax 603/465-3598, e-mail [email protected], www.kerkmotion.com.
Multistage ejector pump
 |
The P2010 multistage ejector vacuum pump is suited for applications requiring light and reliable pick-ups. The pump measures only 1.08 in. high and weighs 0.54 oz., but can generate a vacuum of 24.9 inHg at a feed pressure of only 26psi, whereas most pumps require at least 59–87psi. It features patented COAX technology that integrates the internal components of a multistage vacuum pump into a vacuum cartridge to create a small, flexible, modular system. PIAB Vacuum Products, Hingham, MA; ph 800/321-7422, e-mail [email protected], www.piab.com.
Remote plasma source
The Litmas RPS 1501 is a fully integrated, remote, inductive plasma source and power-delivery system that features a high-conductance, low surface-area, linear geometry. It is designed for wafer pre-clean, photoresist strip, and gate-dielectric and atomic-layer deposition applications. The system delivers up to 1.5kW of stable RF power in <3 msec. Advanced Energy Industries Inc., Fort Collins, CO; ph 800/446-9167, fax 970/407-5280, e-mail [email protected], www.advanced-energy.com.
Pinch valves for CMP
Dymatrix PV Series pinch valves for CMP slurry applications feature a long-lasting tube material and innovative flow-through design that enable an extended life cycle (>2 million cycles) and eliminate stress and particle cohesion. The compound tube is resistant to vacuum operation and will not collapse when exposed to limited vacuum service. The valves are available in sizes from 0.25–1 in., in manual and pneumatic versions, and with a variety of tube and thread connections. Asahi/America Inc., Malden, MA; ph 877/242-7244, fax 800/426-7058, e-mail [email protected], www.asahi-america.com.