World News
09/01/2004
WORLDWIDE HIGHLIGHTS
Avoiding a potentially lengthy dispute with the WTO, China has agreed to lift the rebate it offers domestic chipmakers as part of its value-added tax (VAT) policy for ICs, effective April 2005. Effective immediately, China will not certify any new semiconductor products or manufacturers for eligibility for the refund. China's current policy subjects imports to a 17% tax; domestic manufacturers received rebates that effectively cut the VAT to as little as 3%. Under the new agreement, the VAT rate will be 17% across the board for semiconductors, regardless of origin.
After several years of trying to jumpstart 157nm lithography as a successor to 193nm ArF scanners and 65nm IC processes, International Sematech is ramping down several programs aimed at evaluating 157nm photoresist, calcium-fluoride (CaF2) lens material, and pellicles. The programs, which essentially encompass all of Sematech's direct efforts in 157nm, were shut down by the end of June. Instead, Sematech is putting resources behind a new 193nm immersion technology center (iTC), part of its recently established Advanced Materials Research Center. The iTC program will start off with a budget of $15 million to develop photoresists, fluids, and other components of high-NA 193nm immersion technology.
STMicroelectronics has confirmed it is in discussions with South Korea's Hynix Semiconductor for a manufacturing joint venture, with a deal possibly in place in the next few weeks, according to several news outlets. Earlier this year, Hynix indicated the two companies, which have collaborated on NAND flash products since April 2003, were in talks over creation of a $1.5 million DRAM plant in China.
USA
International Sematech, Austin, TX, has announced the creation of an independent subsidiary of its R&D wafer fab and associated analytical laboratories. The new Advanced Technology Development Facility Inc. (ATDF), which began operations on July 1, will offer a range of services to meet R&D needs of the semiconductor and related industries. Among the subsidiary's offerings: nonclassical CMOS, custom development, and prototyping services; wafer-processing services for both Sematech and external customers, including equipment and materials suppliers; and analytical and electrical testing services for advanced materials and device characterization. About 240 Sematech employees (roughly half of its work force) will be part of the new company.
Texas Instruments plans to start construction of its $3 billion 300mm facility in Richardson, TX, by the end of this year — a full year ahead of its original schedule, according to the Associated Press. Construction at the site, which is funded in part by a $50 million state aid package, is expected to take 18 months. TI already has a 300mm fab in Dallas that has been operational since 2001.
ASIAFocus
China
Semiconductor Manufacturing International Corp. (SMIC) and Japan's Toppan Printing Co. are forming a joint venture to produce on-chip color filters and microlenses for image sensors, according to the Nihon Keizai Shimbun. The JV, to be built in Shanghai, is scheduled to begin production in February 2006.
Japan
Former Seiko Instruments employees have established a new domestic company offering semiconductor design services, according to the Nikkei Business Daily. Keirex Technology Inc., which aims to help chipmakers employ designs combining various EDA systems and software, expects sales of ¥200 million in its first year of operations.
Korea
S-LCD Corp., a JV between Samsung and Sony, has completed its $1.8 billion 7G amorphous TFT-LCD panel production building in Tangjung. The 47,000 m2 operation, with production capacity of 60,000 panels/month, will begin mass production in 1H05.
Taiwan
Inotera Memories Inc., the 50-50 DRAM JV between Infineon Technologies and Nanya Technology Corp., has inaugurated its $2.2 billion 300mm DRAM production facility in Taoyuan, 18 months after its formation. The first of two stages of equipment and production ramp-up is now complete, with initial production of 20,000 wafer starts/month by year's end. Completion of the second stage is slated for the end of 2005, with a ramp-up to 50,000 wafer starts/month.
Eurofocus
Soitec, Bernin, France, and ASM International, Bilthoven, The Netherlands, said they have ramped a 300mm strained silicon-on-insulator (sSOI) pilot line for sampling, with defectivity levels close to those of standard SOI and bulk silicon. The two said evaluations indicate the line of sSOI will survive thermal budgets of 65nm CMOS processes.
Wafer manufacturer Siltronic AG has opened the doors of its 300mm facility in Freiberg, Germany, after 18 months of construction. The €430 million facility is the largest single investment project ever undertaken by Siltronic's parent company, Wacker-Chemie GmbH. Siltronic's overall 300mm capacity now is 125,000 wafers/month; by 2007, the company plans to triple that output to 350,000 wafers/month.