Product News
09/01/2004
Universal tool platform supports multiple nodes
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The Unity platform, designed to serve as a universal foundation for future-generation tools, can be customer-configured for flexible manufacturing support, as well as tool extendibility for multiple technology nodes. With a modular design that incorporates all subassemblies and components, stage advances for process uniformity, particle control features, and diagnostic capabilities including remote and self-diagnostics, the platform will reportedly show a ≥20% throughput gain over prior-generation Ultratech tools. Two versions — for lithography and laser-processing — are available. Ultratech Inc., San Jose, CA; ph 650/968-8900, fax 650/968-8990, e-mail [email protected], www.ultratech.com.
Circuit edit system is FIB-based
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The Vectra Gen5 system performs front- and backside circuit editing on devices with linewidths to 65nm. The focused ion-beam system modifies circuit operation, debugs, and freezes revised designs without making new prototypes. The tool features an advanced ion column, an infrared microscope for through-silicon navigation, high stage accuracy, complementary endpoint technologies, machine intelligence and automation, an in situ mechanical prober, and versatile beam chemistry for etch and deposition. FEI Co., Hillsboro, OR; ph 503/726-2695, e-mail [email protected], www.feicompany.com.
CMP system is geared to copper planarization
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The Xceda 300mm CMP platform is engineered to planarize next-generation, multilevel copper/low-k/ultra-low-k structures with slurry usage reduced by up to 40%. The tool includes four independent polishing modules with through-the-pad slurry management and a patented pad design to provide uniform slurry flow for low dishing and erosion across wafer surface features. An advanced vapor dryer enables watermark-free hydrophobic dielectrics, and in situ/in-line metrology control provides real-time copper profile management. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, fax 408/570-2635, e-mail [email protected], www.novellus.com.
CD-tuning system uses sensor wafer to acquire thermal data
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AutoCD is a process control solution that automatically tunes lithography process-tool settings for desired critical dimension (CD) results on wafers. Combined with calibration provided by the AutoCal dynamic correction engine, AutoCD enables direct CD control by customizing post-exposure bake (PEB). The BakeTemp sensor wafer included in the control package acquires data used to construct thermal models of the PEB process, reducing manual analysis and controlling plate variance for less total CD variation (field results showed variation reduced by 25–60%). OnWafer Technologies, Dublin, CA; ph 925/560-9441, fax 925/560-9460, e-mail [email protected], www.onwafer.com.