Product News
08/01/2004
Backend test system uses 40% less space
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The cluster probing system (CPS) combines multiple test configurations within one backend test system, with up to six high-throughput probe systems configured around a high-speed robotic material handling unit, taking up 40% less floor space than individual production probers. The system's modular hardware/software runs multiple test protocols on the same wafer without human intervention. Each probe module can be operated in manual, semi-, or fully automated mode and removed from the cluster to be used as a standalone probe system. The system is suitable for testing optoelectronic, MEMS, and high-frequency components that require customizable test setups. Süss MicroTec AG, Munich, Germany; ph 49/35240-73-249, e-mail [email protected], www.suss.com.
Ellipsometer provides high-throughput measurements
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The ultra-II transparent thin-film metrology system provides measurements for process control at the 90nm technology node and below, as well as for 193nm lithography processes. The MAControl option helps to eliminate effects of molecular airborne contamination on critical thickness measurements of ultrathin gate dielectrics. With a single, fast full-wafer cleaning step and controlled environment that prevents regrowth, MAControl delivers uniformity mapping for sub-20Å gate oxides. The DUV reflectometer provides high-throughput nitrogen concentration measurements for nitrided gates, and also measures 248 and 193nm ARC materials, high-k gate dielectrics, and low-k integration materials. Rudolph Technologies, Flanders, NJ; ph 973/691-1300, e-mail [email protected], www.rudolphtech.com.
Immersion objective achieves 60nm resolution
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The Leica DUV AT WI water immersion objective for deep-ultraviolet (DUV) lithography applications has a numerical aperture of 1.2 and 19 lenses, and reportedly offers 25% higher resolution than the previous model. As part of the LWM500 WI CD-measurement system, the 200× objective operates at 248nm DUV illumination, and achieves linewidth resolution of 60nm for measuring CDs in transmission on various types of photomasks for the 90nm and 65nm nodes. The objective and system together provide stability better than 1nm (3σ). Leica Microsystems AG, Wetzlar, Germany; ph 49/6441-29-2550, fax 49/6441-29-2527, e-mail [email protected], www.leica-microsystems.com.
Mask generator exposes probe masks in 30 min
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The PS-1000 wafer-probe alignment-mask generator is designed for the semiconductor-test probe card industry. The system reportedly reduces mask costs by 27%. An alignment pattern duplicates the positions of all the contact pads on the circuit to be tested. The generator single-exposes images of customer-designed probe-alignment targets directly onto a chrome mask blank within a grid area up to 5 in.2 The system has a UV exposure rate of ~2000 target exposures/hr, and a placement accuracy of ±0.5µm. Probe masks that previously took 4 hr to expose can be completed in 30 min. RZ Enterprises, Mountain View, CA; ph 650/960-1967, e-mail [email protected], www.rze.com.
Arsine purifier
The Nanochem ASX-II purification medium removes killer impurities such as H2O in arsine, eliminates pressure build-up, and nearly doubles the moisture capacity, extending the lifetime of the purifier. The medium can also remove oxy-acid impurities (GaAs, InGaAs, AlGaAs, and InGaAsP) that contaminate III-V films and reduce carrier concentration and photoluminescence efficiency. It is available in various sizes. Matheson Tri-Gas Inc., Parsippany, NJ; ph 215/648-4026, e-mail [email protected], www.mathesontrigas.com.
RTP system
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The Helios 300mm RTP system features model-based temperature control for uniformity, fast ramp and cool-down rates, closed-loop control down to 250°C, and dual-side heating for minimized pattern effects. Built on a modular, dual-chamber platform designed for reliability and ease of maintenance, Helios includes a dual-arm robot for throughput >120wph. It addresses applications such as NiSi formation and USJ spike anneals for 90nm and 65nm device development and production. Mattson Technology, San Jose, CA; ph 49/7348-981-326, e-mail [email protected], www.mattson.com.
3D modeling software
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MEMulator 2004 emulates and visualizes fabrication processes for 3D MEMS modeling. Cross-sectioning, animation, and zoom capabilities help users to create complex virtual models and reduce the cost of prototyping, which generally requires taking a series of SEM pictures of pre-made devices. The software can be applied to a range of processes in surface and bulk micromachining, as well as wafer bonding. Coventor Inc., Cary, NC; ph 919/854-7500, e-mail [email protected], www.coventor.com.
Mechanically driven work center
The Series 6600 adjustable-height workstation provides an ergonomically designed work area, with supporting frames that can be rear- or center-justified, increasing the work area for two operators and stabilizing the station for heavy loads. It has a weight capacity of 1000 lb., a height adjustment to 15.5 in., and support for work surface sizes from 18×36 in. to 48×96 in. Arlink, Burlington, Ontario, Canada; ph 888/559-4441, e-mail [email protected], www.arlink.com.
Microtesting system
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The model 5848 MicroTester is designed to test microelectronic devices and MEMS, photonic, and other small components. It can be used to conduct die shear and pull, tensile, flex, and peel tests. The system's rigid horizontal- and vertical-adjusting frame, load capacity of 2kN, and encoder allow submicron position accuracy and load control for static testing. Various optional interchangeable accessories are available. Instron, Canton, MA; ph 800/564-8378 ext. 5390, e-mail [email protected], www.instron.com.
High-res machine-vision camera
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The Dica 121 is a high-resolution, digital camera for motion/vision, pick-and-place machines, and robotics. The camera's sensor can obtain up to 1280×1024 pixels, and has a 10bit/pixel gray level for accurate test-product images. Images can be captured from 27Hz up to 1000Hz. The camera can be used in combination with Philips' proprietary vision software for Windows-based systems or as a standard DCS camera. Philips CFT Industrial Vision, Eindhoven, The Netherlands; ph 31/40-2733627, e-mail [email protected], www.cft.philips.com/industrialvision.
Plasma processing platform
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The AP-1000 HTP (high-throughput) plasma-processing system is equipped with four MFCs for optimal control of argon, hydrogen, and helium gases; each of up to 12 slotted magazines can hold 20 lead frames. All vertical electrodes are grounded, and the platform is completely self-contained for minimized use of floor space. Multiple removable/adjustable shelves accommodate a range of part carriers. March Plasma Systems, Concord, CA; ph 925/827-1240, e-mail [email protected], www.marchplasma.com.
Compact defect inspection system
The compact Reflex MetriCube 300mm defect inspection system can be integrated into any 300mm process or handling tool. The main component, the compact Reflex laser darkfield surface-inspection module, has sensitivity to below 90nm. The system provides full wafer defect detection for microroughness, scratches, and area defects on unpatterned surfaces. It is approximately the size of a FOUP module and can be flanged to EFEM processing tools. NanoPhotonics, Mainz, Germany; ph 714/903-5999, e-mail [email protected], www.nanophotonics.de.
Ion source
The Diamonex CD Source is a gridless ion source for direct and ion-assisted deposition of thin films, ion-beam etching, and surface cleaning, especially for the data storage industry. In harsh environments, it has demonstrated 170+ hours of operation without limiting the source lifetime. The source is composed of an anode assembly, integrated hollow-cathode electron source, and electromagnet assembly in a compact, flange-mounted housing. It has a beam current of 12mA and an operating pressure range of below 5mtorr. Morgan Advanced Ceramics Inc., Fairfield, NJ; ph 800/433-0638, e-mail [email protected], www.morganadvancedceramics.com.
Combo analysis system
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The Trident microanalysis system combines x-ray microanalysis, electron diffraction, and wavelength-dispersal spectrometry in one tool to improve analysis accuracy that may be compromised between individual tools that perform these functions, and reduces equipment space usage. ChI-Scan chemical-indexing software incorporates elemental composition into the crystal-structure indexing process for developing and characterizing new materials. Edax Inc., Mahwah, NJ; ph 201/529-4880, e-mail [email protected], www.edax.com.
Integrated inspection system
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The Dual-VU integrated inspection system displays side-by-side x-ray and optical images in real time at up to 40× magnification; a high-quality dichroic mirror separates the x-ray beam from the light path to provide images on the same axis. The system can function independently as a full-featured x-ray or vision inspection system as well, and is well suited for interpreting images of multilayer and assembled PCBs and BGAs. It is equipped with a 70kV x-ray tube for inspecting heavy metal BGAs. Glenbrook Technologies Inc., Randolph, NJ; ph 973/361-9286, e-mail [email protected], www.glenbrooktech.com.
Micro-objective for lithography
The AquaCAT immersion micro-objective is based on the MicroCAT catadioptric micro-objective design, using immersion technology to increase NA and depth-of-focus for higher resolution. In tests, the objective yielded image resolution <100nm, which enables semiconductor manufacturers to reduce linewidths and may extend the use of 193nm technologies for chip fabrication. Corning Tropel, Fairport, NY; ph 607/974-8908, e-mail [email protected], www.corning.com.
Ball valve
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The Quarter-Bloc PVC True-Union ball valve is NSF-61 approved, features all-thermoplastic construction with no metallic parts, and is suitable for water and light chemical applications. Safety and convenience features include a safe blocking design that allows downstream pipe removal, and a stem equipped with a double O-ring seal for durability. The elastomeric backing cushion minimizes carrier adjustment by allowing fixed preload of PTFE seats. Asahi/America Inc., Malden, MA; ph 781/321-5409, e-mail [email protected], www.asahi-america.com.
Polymer removers
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The KDSP PEPR line of wet cleans consists of noncorrosive, environmentally benign post-etch polymer removers that are formulated for sub-180nm high-density plasma etch. They dissolve to remove inorganic polymers from post-metal and post-via layers 8–10× faster (<5 min) than conventional removers/strippers at 20–50°C. The removers are 100% water-soluble, nonflammable, and acid-drain disposable. Kanto Corp., Portland, OR; ph 866/609-5571, e-mail [email protected], www.kantocorp.com.
CMP pressure-mapping sensor
Tactilus is an electronic force- and pressure-indicating sensor that monitors proper pressures in wafer polishing and bonding processes. The system can be used for either single-spindle or multispindle heads, with custom designs available. The Windows-based system uses an electronic sensor element "skin," a thin, flexible sheet densely packed with sensing points that can collect data as quickly as 60,000 times/sec. The sensor system is pre-calibrated and requires minimal training. Sensor Products Inc., East Hanover, NJ; ph 973/560-4826, e-mail [email protected], www.sensorprod.com.