WAFER PROCESSING — PRODUCTS
07/01/2004
Single-wafer platform
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The Goldfinger Mach2 HP four-chamber single-wafer cleaning system is a production-ready product suited to a variety of wafer-surface prep applications. It can be configured for FEOL post-ash cleaning, post-deposition and other particle cleans, as well as for BEOL post-ash/etch cleaning applications on both aluminum and copper integrated devices. Goldfinger Megasonics enable particle removal without etching for cleaning sensitive structures. Integrated Sahara Dry technology provides watermark-free surface-tension gradient drying. The four process chambers have integrated splashguards and bowl seals and allow sub-90nm particle removal with minimal 2mm edge exclusion. The system can operate in single pass or reclaim mode to minimize chemical waste and cost. Akrion, Allentown, PA; ph 714/445-2237, e-mail [email protected], www.akrion.com.
300mm processing platform
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The Endura2 is a 300mm platform for advanced PVD, CVD, and ALD processes, featuring a modular architecture for easy access and serviceability, 20% fewer parts, and process transparency for minimum re-qualification. This architecture reportedly decreases system manufacturing time by one-third, reducing order lead-time and shortening startup time in customer fabs. The platform includes high-speed XP dual-wafer robotic handling technology that boosts throughput, plus easily serviced component modules that enhance availability and contribute to the substantiated 300 hr reliability (MTBF) and <2 hr repair time (MTTR). Testing has also shown 45nm-level mechanical defect performance (<0.04 defects/cm2 at >0.09µm). Applied Materials Inc., Santa Clara, CA; ph 408/563-0647, e-mail [email protected], www.appliedmaterials.com.
Electro-CMP platform
The Reflexion LK Ecmp system delivers electrochemical mechanical planarization technology for 65nm performance and cost requirements, while providing 45nm and beyond extendibility. It planarizes copper at a high rate, with a very low down force that removes much of the device pattern sensitivity associated with conventional CMP. Electrochemical profile and endpoint control across the wafer help tune the copper removal rate to meet within-wafer and wafer-to-wafer requirements. Applied Materials, CMP Products Group, Sunnyvale, CA; ph 408/727-5555, e-mail [email protected], www.appliedmaterials.com.
Single-wafer gap-fill process
Producer HARP (high aspect-ratio process) is a single-wafer nonplasma based solution designed for <65nm high aspect-ratio gap fill. Using a TEOS/ozone process, HARP combines a faceplate, heater, and process kit, to enable conformal, void-free, high aspect-ratio (>7:1) gap fill performance. The Applied HARP process runs on the Producer SE system, with extendibility to use the same Producer toolset for multiple device nodes. Applied Materials, Dielectric Systems Group, Sunnyvale, CA; ph 408/727-5555, e-mail [email protected], www.appliedmaterials.com.
Ion implanter
The Quantum X ion implanter offers single-wafer processing for applications such as source/drain, source/drain extension, and plug and gate doping, and can accommodate additional applications with its high tilt-angle capabilities. The processor incorporates a 2D isocentric scanning system for beam parallelism. In situ process particle monitoring provides pre-emptive advice and control against risk to product. Applied Materials, Front End Products Group, Sunnyvale, CA; ph 408/727-5555, e-mail [email protected], www.appliedmaterials.com.
SEM with automated FIB capability
The SEMVision G2 FIB defect-analysis system integrates SEM capability with automated focused ion-beam (FIB) cross-sectioning and energy-dispersive x-ray (EDX) analysis technology for high-speed, high-resolution defect review and analysis in one in-line production tool. The closed-loop system has the SEM and FIB in parallel, allowing various advanced imaging technologies, including multi-perspective SEM, voltage contrast, high aspect ratio imaging, and material analysis by EDX. Applied Materials Inc., Process Diagnostics Group, Santa Clara. CA; ph 408/563-0647, e-mail [email protected], www.appliedmaterials.com.
Air diaphragm valve
The HDV Series air diaphragm valve features a compact design and is constructed from PVC and a PTFE diaphragm. It is suitable for DI water and chemical applications, such as skid-mounted water and chemical distribution systems. Its compact design allows easy installation in areas where space is minimal. The HDV provides a high Cv and a cycle life tested to over 2 million cycles. Asahi/America Inc., Malden, MA; ph 781/321-5409, fax 800/426-7058, e-mail [email protected], www.asahi-america.com.
Convertible scanner
The TWINSCAN XT:1400 is a 0.93NA, 193nm scanner that images at the 65nm node in volume production environments, and can be used for pre-production testing and development at the 45nm node. The system's architecture and design provide the option of transitioning from "dry" to immersion lithography on the fab or factory floor through an "immersion conversion kit," available in 4Q05. The kit is comprised of three main parts: a lens for immersion, immersion-compatible wafer stages, and immersion infrastructure. The system also comes equipped with Ultra-k1, a hardware and software portfolio for imaging enhancement that allows shrinking of circuit features for high die yields. ASML, Veldhoven, The Netherlands; ph 203/761-6300, e-mail [email protected], www.asml.com.
Equipment information bridge
The GWEIB equipment-information bridge gives real-time data with equipment models that allow concurrent access to equipment information by fab applications. Multiple communication protocols are supported (COM/DCOM, RMI, XML/SOAP), providing flexible control-systems integration. GWEIB is compliant with Semi standards, including E4/5 (SECS), E30 (GEM) and E37 (HSMS), as well as new standards E120 (Common Equipment Model), E121 (XML), and E125 (Equipment Self Description). Asyst Technologies Inc., Connectivity Systems Div., Fremont, CA; ph 510/661-5442, fax 510/661-5151, e-mail [email protected], www.asyst.com.
Wafer-management system
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Designed as a unified wafer-management system, the SPARTAN 300mm wafer-handling solution reportedly employs the minimum scale and complexity necessary to move wafers while delivering cleanliness with lower particle levels, compared to traditional sorters. SPARTAN is fully compliant with Semi standards and is available in multiple configurations. It features an optimized mini-environment with better than ISO Class 1 performance, and incorporates dual, ultrathin edge-grip wafer handling for "fast swap" wafer exchanges or movement of two wafers simultaneously. Asyst Technologies Inc., Systems Div., Fremont, CA; ph 510/661-5442, fax 510/661-5151, e-mail [email protected], www.asyst.com.
Fully integrated stepper
The Model 5200 PanelPrinter system provides advanced photolithography for large-area substrate applications requiring 0.8–4µm resolution. Fully integrated subsystems include a high-fidelity projection lens and illumination system, precision x-y stage, automated substrate-alignment system, automated reticle handling and storage system, and a suite of metrology sensors. A variety of lenses makes the system suitable for active matrix LCD, FED, OLED, polysilicon, and high-density interconnect applications. The system accommodates substrate materials from glass to PWB to plastic film. Azores Corp., Wilmington, MA; ph 978/657-7270, fax 978/658-6349, e-mail [email protected], www.azorescorp.com.
Safety light screens
The EZ-SCREEN safety light screen system is a noncontact, point-of-operation machine guarding system small assembly equipment, pick-and-place machines, packaging machinery, and more. Dip-switch selectable functions enable reduced resolution trip or latch output, external device monitoring, and scan code setting through the access cover. Banner Engineering Corp., Minneapolis, MN; ph 763/544-3164, fax 763/544-3213, e-mail [email protected], www.bannerengineering.com.
Pump system targets energy reduction
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The Zenith Etch is an integrated vacuum pump and abatement system designed for dielectric etch applications. It is available with up to four EPX500Z drypumps to meet requirements of 300mm etch tools in a reduced footprint. The system offers PFC abatement along with sub-TLV abatement of fluorine and acidic by-products. It reportedly reduces utility consumption and cost-of-ownership with the option of either the Zenith Etch Mini TPU inward-fired combustor or the Plasma low-power atmospheric plasma abatement module. BOC Edwards, Wilmington, MA; ph 978/658-5410, e-mail [email protected], www.bocedwards.com.
Drive-level control concept
A decentralized front- and backend control concept provides diagnostics local to each device, which allow machine service without disrupting the entire production process. It also reduces the load on the central processor, requires less cabling, and provides greater reliability because feedback cables don't have to be routed back to the central device. Frontend deposition, etch, and implant processes have applications for decentralized control; on the back end, it can be used with high numbers of independent axes. Bosch Rexroth Corp., Hoffman Estates, IL; ph 847/645-4073, fax 847/645-6210, e-mail [email protected], www.boschrexroth-us.com.
Substrate-processing tool
The TALON300 is a nonlinear, automated substrate-processing tool designed for pilot line and small-scale production and process development for MEMS, semiconductor manufacturing, and optoelectronics-fabrication applications. The Semi and CE-certified system is optimized for 200–300mm wafers, with a multiaxis cylindrical coordinated robot and PC-based (Windows) controller. The spin module, with a 0–4000rpm spin range and ±1rpm repeatability with 1rpm resolution, includes an ETFE polymer-coated spin bowl, programmable exhaust standard, and optional scanning arm dispense. Brewer Science, Rolla, MO; ph 572/364-0300, fax 573/364-9513, e-mail [email protected], www.brewerscience.com/cee.
Manufacturing execution system
The third-generation manufacturing execution system (MES) FACTORYworks3 provides modeling, process planning, wafer tracking, data collection and analysis, and equipment monitoring/dispatching. The system supports collaborative manufacturing and supply chain execution via a Web services and thin client framework in real time. It is reportedly the first MES to provide integrated equipment-maintenance management, corrective/preventive action, and durables management. Brooks Automation, Chelmsford, MA; ph 978/262-2459, e-mail [email protected], www.brooks.com.
Photomask repair tool
The MeRiT MG combines the high resolution of electron-beam technology with damage-free repair and review capabilities. The system is designed to support next-generation lithography techniques and future node sizes. No mask-structure modification is generated during imaging, which allows an unlimited number of review cycles. E-beam induced chemical reactions are used for etching and deposition of mask material. Carl Zeiss SMT, Semiconductor Metrology Systems Div., Jena, Germany; e-mail [email protected], www.smt.zeiss.com.
FIB workstation
The 1540XB CrossBeam uses high-resolution focused ion-beam (FIB) technology to perform nanoscale sub-surface analysis. The integrated GEMINI column enables real-time imaging for precise milling operation. The 1540XB is capable of fully automated TEM sample preparation and can be equipped with SIMS, sample air lock, direct-write e-beam lithography capabilities, and CAD wafer-navigation software. Carl Zeiss SMT, Nano Technology Systems Div., Oberkochen, Germany; ph 914/747-7700, e-mail [email protected], www.smt.zeiss.com.
Fab management software
CIMPortal, an EDA+ software tool, enables fab-level access to critical equipment data such as SECS/GEM, high-speed OEM and fab add-on-based sensor, historical, tool-level software version control, and configuration data gathered from capital-equipment OEM suppliers. Without programming, the software can access all of the available GEM data for a 200/300mm tool via an EDA+ secure port, or with more configuration, it can collect existing sensor data directly from OEM tools. Cimetrix Inc., Salt Lake City, UT; ph 801/256-6500, fax 801/256-6510, e-mail [email protected], www.cimetrix.com.
In-line chemical monitor
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The WetSpec100 is a noncontact in-line monitor for the chemical composition of liquids. All processes are streamlined because there is no chemical sampling or need to supply chemicals and remove chemical waste. The monitor also analyzes physical properties of slurry liquids, and can be integrated into various wet applications such as slurry health monitoring in CMP slurry blending and distribution systems, cleaning and wet etching stations, bath control in electroplating systems, and chemical waste management. CI Semi, Palo Alto, CA; ph 650/424-0682, e-mail [email protected], www.ci-semi.com.
Thick-film photoresist
AZ 10XT photoresist is formulated especially for high-resolution applications, such as redistribution. It offers 4:1 aspect ratios with wide process latitude at film thicknesses of 10–20µm. This photoresist is free of perfluorooctyl sulfonate-generating ingredients, and can be exposed at broadband or i-line wavelengths. Clariant Corp., AZ Electronic Materials, Somerville, NJ; ph 908/429-3500, e-mail [email protected], www.azresist.com.
Mini-environment and ECU
Turnkey mini-environment and environmental control unit (ECU) solutions for advanced semiconductor applications are completely custom-designed around customers' process needs and can be fabricated in a variety of metals, such as powder-coated steel or aluminum, stainless steel #4 or stainless steel #8 mirror finishes. The independent ECU integrates all primary functions and controls into a freestanding, small-footprint package. The ECU can control temperature to ±0.008∞C and RH to ±0.5% at airflows up to 5000cfm. Cleanroom Systems, No. Syracuse, NY; ph 800/825-3268, e-mail [email protected], www.cleanroomsystems.com.
Chemical dispensing system
TRICHEM is a fully automated chemical dispensing system for UHP liquid CVD and ALD precursors. It is available as a single- or dual-canister model with minimum footprint. A wide range of process applications and industry-standard canisters can be adapted. The TRICHEM Canister (TCC) with an solvent-purging mechanism offers solvent supply and disposal in one. CS Clean Systems AG, Ismaning, Germany; ph 510/770 9595, e-mail [email protected], www.csclean.com.
Dielectric resin
Porous SiLK Y semiconductor dielectric resin features reduced closed-pore sizes of <2nm. The ultralow-k (k = 2.2) material enables continuous PVD tantalum barriers for 65nm technology and beyond. With tight pore-size distribution ranges of 1–3nm and coefficient of thermal expansion ~50% lower than SiLK D resin, SiLK Y reportedly has shown up to 90% improvement in barrier sheet resistance and electrical performance compared to previously reported porous dielectrics. The Dow Chemical Co., Advanced Electronic Materials, Midland, MI; ph 989/636-1000, e-mail [email protected], www.poroussilk.com.
Low-pressure transmitter
The Ashcroft DXLdp low-pressure transmitter with the SpoolCal process valve actuator can be easily validated and calibrated in place. With a quick twist to the left, the actuator tees the process pressure out to a handheld calibrator; a twist to the right enables calibration mode. Front-access test jacks provide an on-line reference signal without removing wiring, avoiding signal interruption. Dresser Instruments, Stratford, CT; ph 203/378-8281, fax 203/385-0408, e-mail [email protected], www.ashcroft.com.
FOSB for 300mm
The full-pitch front-opening shipping box (FOSB), designed to protect 300mm silicon wafers during shipping, also provides a factory-interface mechanical standard (FIMS)-compatible equipment interface. The Semi-compliant FOSB, constructed of a polycarbonate material, holds 25 300mm wafers at 10mm spacing. It provides automated FIMS compatibility to minimize contamination, enabled by the FIMS door. Entegris Inc., Chaska, MN; ph 952/556-3131; fax 952/556-1880, e-mail [email protected], www.entegris.com.
Photomask aligner
The EVG6200 Infinity mask aligner works with wafer sizes from 75–200mm, varying in shape and thickness. With full-field proximity exposure of very thick resist layers, the aligner targets wafer-bumping and chip-scale packaging markets as well as MEMS, compound semiconductors, nanoimprint lithography, and power devices. The fully automated system is reconfigurable and field-upgradeable. EV Group, Schärding, Austria; ph 43/7712-5311-0, e-mail [email protected], www.evgroup.com.
Defect analysis system
The enhanced Defect Analyzer DualBeam for structural diagnostics of 200- and 300mm wafers performs in-line, real-time, 3D defect analysis. It reduces new process ramp times and the financial impact of yield-killing excursions for chips developed at the 130nm node and below. Slice-and-View technology creates a 3D structural model of any defect by capturing cross-sections through the targeted features. Automated defect redetection (ADR) permits unattended revisiting of defects identified in other optical or e-beam inspection tools. FEI Co., Hillsboro, OR; ph 503/726-7500, e-mail [email protected], www.feic.com.
ICP etching system
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The GroovyICP SE-4000 narrow-gap ICP etcher is a 200/300mm, high-density plasma etching tool with a narrow discharge-gap configuration. The tool exhibits low-pressure performance down to 1mtorr, a gas pressure range up to a few torr, discharge stability and uniformity, and damage-free plasma. It is suitable for critical and noncritical applications, and shows high selectivity to resist and multilayer dual-damascene structures including organic or inorganic low-k materials in one multistep process chamber. FOI Corp., Kawasaki, Japan; ph 81/44-980-1150, e-mail [email protected], www.foi.co.jp.
ALD process chamber
The RAD process module is a new ALD chamber on the StrataGem platform. Rapid atomic-layer deposition (RAD) reportedly boosts ALD deposition rates to ~100Å/min—more than 5× that of conventional ALD. RAD reduces precursor exposure time at the wafer surface and uses purge steps as short as 0.2 sec. The tool addresses the needs for conformal films up to 500Å, and is suitable for TFH manufacturing and other applications. Genus Inc., Sunnyvale, CA; ph 408/747-7140, e-mail [email protected], www.genus.com.
Dual-range MFCs
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Dual-range mass flow controllers (MFC) improve accuracy of gas flow control at both low and high flow rates required in the semiconductor manufacturing process. Asingle MFC provides equal, precise, reliable control at both flow rates used in multiple applications. Overshoot and time lag associated with gas line changeover are eliminated, improving yield and throughput. Hitachi Metals America Ltd., San Jose, CA; ph 800/309-1803, e-mail [email protected], www.hitachiflowcontrol.com.
Sputtering targets
The patented ECAE technology is an advanced target process for Al and Al alloys. Targets processed with ECAE technology show superfine grain size, homogeneous microstructure, high mechanical strength, and controllable texture. Benefits of 300mm ECAE Al0.5Cu reportedly include an increase of >25% in processed wafers, target lifetime increased by >40%, low level of particles, and absence of arcing issues. ECAE process technology is applicable for via fill and blanket film for mainstream configurations. Honeywell Electronic Materials, Sunnyvale, CA; ph 408/962-2098, e-mail [email protected], www.electronicmaterials.com.
E-diagnostics suite rental framework
eCentre Hosted allows fabs and OEMs to rent an e-diagnostics application suite on a tool-by-tool basis. The main hardware-and-software framework is located within a secure hosting environment identical to those used by financial institutions. The service uses the latest version of eCentre that includes Flexible Security Wrapper (FSW), which improves e-diagnostics security from a "connection approved" to a "connection and context approved" basis, and Data Collection Plan Manager (DCPM), the ability to change data-collection plans dynamically. ILS Technology, Boca Raton, FL; ph 802/985-5400, e-mail [email protected], www.ilstechnology.com.
Sensor takes real-time measurements
The TDM-200 sensor measures absolute trench depth in real time for MEMS applications. This on-line tool can be used during Bosch etch and deposition cycles without synchronization signals from the etch tool, and without having to calculate etch depth from an extrapolation of etch rate. The TDM-200 is based on a patented twin-spot interferometric camera, which measures the trench depth from the phase shift generated between two laser spots. Jobin Yvon Inc., Edison, NJ; ph 732/494-8660, e-mail [email protected], www.jobinyvon.com.
X-ray metrology tools
The entire JVX 4x00 and JVX 5x00 series of x-ray metrology tools incorporates microspot x-ray fluorescence (XRF) and/or fast x-ray reflectance (XRR) technology. The JVX 4000 and JVX 5000 are microfocus x-ray fluorescence (XRF) spectrometers for applications such as elemental analysis, film-thickness measurement, and void detection. The JVX 4100 and JVX 5100 fast x-ray reflectometers (XRR) measure film thickness, density, and roughness, and characterize single layers and multilayer stacks; high- and low-k materials; and amorphous, poly-crystal and single-crystal films. The JVX 4200 and JVX 5200 combine small-spot XRR and XRF to cover a range of applications from ultrathin to micron-thick. Jordan Valley Semiconductors Inc., Austin, TX; ph 512/832-8470, e-mail [email protected], www.jordanvalleysemi.com.
Optical CD metrology tool
The SpectraCD 100 uses broadband spectroscopic ellipsometry with reflective optics across a continuous wavelength spectrum from 190–800nm to detect process issues that require extreme sensitivity, such as resist footers in gate structures. The system's new 3D modeling capability enables measurement of contact holes, and it can monitor a variety of frontend layers now including DRAM gate, bilayer resist, step height, deep trench, and CMP layers with liners. KLA-Tencor Corp., Optical Metrology Div., San Jose, CA; ph 408/875-4200, fax 408/875-4144, e-mail [email protected], www.kla-tencor.com.
Defect inspection system
The Surfscan SP2 wafer-surface inspection system provides a wafer-substrate and tool qualification solution for the 65/45nm nodes with extendibility to 32nm. Incorporating UV laser technology, darkfield optics, and advanced algorithms, the SP2 finds defects as small as 30nm on engineered substrates, such as silicon-on-insulator (SOI), strained silicon, and strained SOI, at throughputs of up to 5× greater than the previous Surfscan SP1 DLS. The laser emits at a wavelength that eliminates interference effects and causes engineered substrates to behave like polished wafers during inspection. KLA-Tencor Corp, Surfscan Division, San Jose, CA; ph 408/875-0722, e-mail [email protected], www.kla-tencor.com.
Handheld particle counter
The Handheld 2016 particle counter with 0.2µm sensitivity displays six channels of particle data in either cumulative or differential mode, as well as temperature and relative humidity data. The user-friendly graphical interface is displayed on a backlit LCD touch-screen display, and a user-removable lithium ion battery simplifies portable usage. The Handheld 2016 can be used as a mobile particle monitor or can become part of a larger facility-monitoring system. Lighthouse Worldwide Solutions, Milpitas, CA; ph 408/945-5905, [email protected], www.golighthouse.com.
CD measurement system
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The automated INNOVA-800AV system performs critical dimension (CD) measurement of subresolution features on photomasks. Measurement accuracy is ≤0.002µm with 3σ repeatability below 1.5nm. The system achieves measurement accuracy and repeatability by measuring the amount of light blocked by opaque areas or transmitted by clear areas of the photomask; it measures a wide range of CDs, such as defects, contacts, pitch, corner rounding, OPC patterns, intrusions, extrusions, and other features from 0.2–200µm. The system uses AutoIllumination to pre-program the lamps for each measurement and to precisely control the lamps to provide consistent image brightness for optimum edge contrast and repeatability. Micro-Metric Inc., San Jose, CA; ph 408/452-8505, e-mail [email protected], www.micro-metric.com.
Transducer uses 100% digital architecture
The Type 890 Series Baratron compact digital pressure transducer for gas delivery applications is designed to meet the needs of OEMs and gas suppliers that require a compact digital transducer at a lower cost. The 890 Series can be used in the smallest gas panels and cabinets on the market today. This Baratron product is reportedly the first pressure transducer for the semiconductor manufacturing industry that uses 100% digital architecture. MKS Instruments Inc., Wilmington, MA; ph 978/284-4050, e-mail [email protected], www.mksinst.com.
APC/e-diagnostics software
The TOOLweb suite enables real-time, secure access to the tool, sensor, and instrument data. Using an open architecture that can access data needed by each application and add new data sources as necessary, the scalable, web-enabled suite provides the brand-blind interconnection required for APC and e-diagnostics. It offers basic univariate fault detection and classification functions with advanced multivariate FDC available through partner software. MKS Instruments, Control & Information Technology Products Group, Wilmington, MA; ph 978/284-4050, www.mksinst.com.
Transducer minimizes convection effects
The HPS Series 925C MicroPirani transducer is a MEMS-based thermal conductivity gauge that features a pressure-measurement range from 10-5torr to atmosphere — two decades below a standard Pirani sensor. The sensor element is made of a 1mm2 silicon chip, allowing the measurements to be made in a very small volume. The design minimizes the effects of convection, and can be mounted in any position while maintaining accuracy. The Series 925C is gas-type sensitive, with a number of common gas calibrations. MKS Instruments, HPS Products, Boulder, CO; ph 303/449-9861, e-mail [email protected], www.mksinst.com.
Hydride purification media
The Aeronex SK purification media purify hydride gases such as ammonia, arsine, phosphine, germane, and silane. The SK media are iron-free to eliminate the release of carbon monoxide, and offer an increase of 163% in oxygen capacity and a 20% increase in moisture capacity over the previous Y Series product. The media provide removal efficiency better than 1ppb under conditions of 10ppb carbon monoxide and offer capacity ≥37 days. Mykrolis Corp., Billerica, MA; ph 978/436-6500, e-mail [email protected], www.mykrolis.com.
Nondestructive analyzer
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The nondestructive 3300DR analyzer tracks across-wafer characteristics of designated DRAM structures using innovative hardware and proprietary software. Special periodic test structures are not required. The tool can also be incorporated into production equipment for in situ applications. It has a throughput of 78wph when used for making five film-thickness measurements on a 300mm wafer. This 200–300mm bridge tool has automated loading and unloading and supports SMIFs, FOUPs, and open-cassette load ports. n&k Technology Inc., Santa Clara, CA; ph 408/850-7315, e-mail [email protected], www.nandk.com.
Actuator for clean apps
The Picomotor actuator Ultra is designed to minimize contamination and outgassing in clean-critical environments, including very deep ultraviolet (VUV) and extreme ultraviolet (EUV). It is essentially a motorized screw for precision motion control and beam-steering down to vacuum pressures as low as 10-9torr. The actuator offers <30nm resolution along with long-term set-and-hold stability, and can be incorporated into OEM designs for linear actuation as well as into optical mounts and stages for precision tip-tilt beam-steering adjustments. New Focus, San Jose, CA; ph 408/919-1564, e-mail [email protected], www.newfocus.com.
EFEM has self-teaching capability
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The Performix fabrication equipment frontend module (EFEM) features an Automated Self Teach wafer-handling robot, which enables the system to be installed and operated without extensive operator training, and minimizes initial startup time. An operator selects preprogrammed locations for the loadport, prealigner, and tool, and the optical, through-beam wafer-locating system automatically registers the locations, calibrating the robot. Newport Corp., Irvine, CA; ph 949/863-3144, fax 949/253-1800, e-mail [email protected], www.newport.com.
Step-and-repeat system
The NSR-S308F step-and-repeat system is a lens-based scanning ArF excimer laser stepper for mass production of devices at 65nm and below. The system is reportedly equipped with the highest NA projection lens (NA = 0.92) supporting an ArF excimer laser (193nm wavelength), resulting in higher-resolution imaging than in previous models. Other improvements include a 25% increase in throughput—of 140 300mm wafers/hour—and 44% improvement in alignment accuracy with the low-aberration lens, reaching the 8nm level. Nikon Precision Equipment Co., Tokyo, Japan; ph 81/3-3216-1030, e-mail [email protected], www.nikon.co.jp.
Foreline traps
Multistage LPCVD-TEOS foreline traps have a stainless-steel gauze filter to collect crystalline TEOS before it reaches downstream components. The two- and three-stage traps also have a fiberglass filter to remove silicon dioxide. The three-stage trap's final stage is a reservoir to collect liquid TEOS without restricting foreline conductance. Coaxial or right-angle bodies are available with 3- or 4-in. port sizes. Nor-Cal Products Inc., Yreka, CA; ph 530/841-9102, e-mail [email protected], www.n-c.com.
DUV metrology system
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The NovaScan 3090 is a fully polarized DUV single-channel, high-throughput, integrated or standalone metrology system for 200–300mm manufacturing, with full support for 65nm. In CMP, the system can be used for thin-film thickness and slotted grating-site (line/space structure) measurements through spectrophotometry. The 3090 addresses advanced STI applications, such as photoresist grating on the STI stack in photolithography, and STI trench in etching. Other applications include measurement and control of poly lines and photoresist on the poly stack, gate mask opening, metal grating, and contact/via applications. Nova Measuring Instruments Ltd., Rehovot, Israel; ph 972/8-9387505, e-mail [email protected], www.nova.co.il.
Scanning microscope
The LEXT confocal laser scanning microscope has 0.12µm resolution, 3D measurement capability, and magnification power from 120–.14,400× to meet requirements for submicron imaging. A 408nm laser is combined with optics to optimize image quality and limit aberrations at this wavelength. Both video and laser confocal imaging modes offer brightfield, darkfield, and differential-interference contrast microscopy. Olympus Industrial America Inc., ph 866/642-4725, e-mail [email protected], www.olympusmicroimaging.com.
Monitor collects data in real time
The AiM-200 molecular contamination monitor checks contamination on critical surfaces such as optics or wafers, where haze formation problems are caused by organic condensables in purge gases or in the ambient environment. Two sensors monitor two locations simultaneously, with active temperature control to maintain a consistent operating environment, storage of up to 50,000 samples, and sample intervals as fast as 5 sec. Detection of mass depositions of 0.003ng/cm2/Hz is possible. Particle Measuring Systems, Boulder, CO; ph 303/443-7100 ext. 258, e-mail [email protected], www.pmeasuring.com.
Spectrometer measures down to ≤10ppm
The OmniStar mass spectrometer continuously monitors gas output for toxic and greenhouse gases, and can measure up to 64 different gases simultaneously in concentrations from 100% down to ≤10ppm. OmniStar monitors the gas output of the scrubber/abatement system to be sure that it is operating properly and is cleaning up the desired exit gases. If a gas concentration is outside of specified limits, an out-of-range warning is noted so corrective action can be initiated. Pfeiffer Vacuum Inc., Nashua, NH; ph 603/578-6500, e-mail [email protected], www.pfeiffer-vacuum.com.
Nanopositioning stage
The nanoX400 nanopositioning stage has piezoelectrically actuator-based positioning with 440µm motion. The bidirectional-driven system has a compact design (52×52×22mm3) and can be easily integrated into an existing system. This one-axis stage is also offered in closed loop, and offers a high-resolution strain gauge or capacitive sensor measurement system with resolution <1nm. Piezosystem jena GmbH, Jena, Germany; ph 508-634-6688, e-mail [email protected], www.piezojena.com.
Silicon carbide material
SUPERSiC silicon carbide (SiC) can be used both as a vacuum chuck and wafer susceptor. By utilizing the unique microstructure of converted SiC, the wafer can be uniformly adhered to susceptor or chuck by pulling a vacuum through the porosity of the material, eliminating drilling in materials such as alumina, quartz, or other metals. A chemical vapor conversion process starts with graphite that has a uniform, isotropic microstructure, and produces stoichiometric SiC parts that can be manufactured in complex shapes. Poco Graphite Inc., Decatur, TX; ph 940/627-2121, e-mail [email protected], www.poco.com.
Macrodefect inspection team
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The WaferView team of macrodefect inspection tools combines three products to offer real-time inspection of every wafer at each step in the lithography or CMP process. The i-MOD module's detection and classification algorithms automatically adapt to normal wafer-to-wafer and lot-to-lot process variations. The 320 standalone system has an onboard high-resolution ReviewScope that inspects all sides and edges of the wafer, providing defect analysis and dispositioning of wafers by yield engineers. The YieldView server coordinates the equipment team by collecting critical defects in a common-knowledge base and acting as a recipe server. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, e-mail [email protected], www.rudolphtech.com.
Compact guidance system
The MINIMODULE is a compact linear guidance system with a miniature ball guideway (MINIRAIL) and integrated tooth belt drive that allow a compact design. Both the rail and carriage are manufactured from corrosion-resistant stainless steel, as is the main structure of the modules. The system is available with options including integrated limit switch, cover strip, and a bottom-mounted motor flange (top mounting is standard). A maximum length of 1142mm is available and a maximum stroke of 886mm is possible, with maximum speeds of 5m/sec. Schneeberger Inc., Bedford, MA; ph 781/271-0140, www.schneeberger.com.
Wafer-cleaning system achieves 2–3 min cycle times
The Emersion 300 single-wafer cleaning system addresses particle removal, film loss, structure damage, and watermarks by using rapid single-wafer immersion processing with multiple chemical solutions to process each wafer in a single process chamber. The system is suitable for wafer fabrication steps including front-end-of-line critical cleans and etches and back-end-of-line cleans. It combines megasonics transducers with enhanced Marangoni drying to achieve cycle times of 2–3 min for a critical pre-diffusion clean vs. typical hour-long batch process times. Ultradilute chemistries and short process times help prevent film loss, and Emersion technology cleans and dries without bridging. SCP Global Technologies, Boise, ID; ph 208/685-3244, fax 208/685-4540, e-mail [email protected], www.scpglobal.com.
Sample prep system
The EM2 is a timesaving, user-friendly system enabling a total solution for TEM/STEM and SEM sample preparation for both cross-section and plan view in a wide range of applications. Featuring an automated, cryo-cooled, dry sawing process, the system prepares specimens of either crystalline or amorphous materials. The output sample is mounted onto a FIB-compatible stub, allowing rework. Sela USA Inc., Sunnyvale, CA; ph 408/736-3700, e-mail: [email protected], www.sela.com.
Within-wafer metrology system
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INtegrated Wafer, a complete, wireless, low-profile temperature metrology system within a wafer, gathers data throughout an entire process. It is suitable for prober hot plates, photoresist track systems, steppers, and copper annealing. Analysis of static and dynamic temperature measurements helps chip and equipment manufacturers to ensure temperature uniformity in their critical semiconductor processes without modifying equipment or disrupting production. SensArray Corp., Fremont, CA; ph 510/360-5600, e-mail [email protected], www.sensarray.com.
Manometer
The Model 760 Vactron manometer achieves long-term zero stability and linearity through its patented sensor design. It is offered with a choice of standard accuracy of ±0.25% of reading, or accuracy of ±0.15% of reading. Operable from a ±15V DC power supply, the manometer provides a 0–10V DC or 0–5V DC signal output that is linear with pressure and independent of gas composition. Setra Systems Inc., Boxborough, MA; ph 800/833-4227, e-mail [email protected], www.setra.com.
Spin processors
The Da Vinci Series of single-wafer surface-preparation spin processors for high-volume, wet spin-processing applications, includes the inaugural tool, the 300mm DV-38F, and the recently introduced DV-28F, DV-34BF, and DV-24BF products for back-end-of-line (BEOL) polymer cleaning, backside etch and clean, and emerging applications such as high-k, metal gate, FRAM, and MRAM technologies. The tools have a minimized footprint, reduced media consumption, and flexible chemistry applications. SEZ, Villach, Austria; ph 602/453-5058, e-mail [email protected], www.sez.com.
Spin station
The SpinBall XP Combo multiprocess spin station has the flexibility to process substrates from pieces to 300mm wafers. The system requires manual loading and then process flows are completely automated. It can be equipped with a coater, developer, two bake ovens, and a chill plate. With an environmental control unit equipped with chemical filtration, the station can be used to produce linewidths <0.25µm, and coating uniformity near 4Å. Site Services Inc., Santa Clara, CA; ph 408/980-1155, e-mail [email protected], www.site.com.
Wet processors/cleaners
The SSEC 3300 series of wet processors and cleaners for wafers up to 300mm uses single-wafer technology, with benefits throughput (to 150 wph), precision, and uniformity. Single- and multichamber systems perform cleaning, stripping, and etching, including bevel-edge processing and wafer thinning, coating, and developing. In situ monitoring results in per-wafer process control for better yield and reduced chemistry consumption. Solid State Equipment Corp., Horsham, PA; ph 215-328-0700, e-mail [email protected], www.ssecusa.com.
USJ metrology tool probes without damage
The SSM 250 and 2500 metrology tools measure sheet resistance of ultrashallow-junction (USJ) source/drain implants using EM probe technology. The nonpenetrating, nondamaging four-point probes are made from a conductive elastic material, without mercury, and are not contaminating. The probes can be used to measure USJ implants with depths <10nm. The 250 is for off-line process development and measures wafers ≤300mm; the 2500 tool measures 200mm and 300mm in-line. Solid State Measurements Inc., Pittsburgh, PA; ph 412/787-0620, fax 412/787-0630, www.ssm-inc.com.
ALD valve
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The ALD series valve is an ultrahigh-purity, pneumatically actuated valve for application in atomic-layer deposition (ALD) processes, featuring valve actuation times <5 msec and a cycle lifetime exceeding 25 million cycles during product evaluation. The patent-pending flow setting feature enables consistent delivery of process gas. Manufactured from 316L VIM/VAR stainless steel, the valve body is available with 1/4 in. VCR and 1/4 in. and 6mm tube butt-weld end connections. Swagelok Co., Solon, OH; ph 440/349-5934, e-mail [email protected], www.swagelok.com.
Acoustic enclosures
Acoustic enclosures and precision structures are custom-designed for OEM applications for SPMs, interferometers, microscopes, and other sensitive metrology instruments. The integrated steel and stainless steel assemblies incorporate proprietary vibration and acoustic control techniques to ensure optimal equipment performance at the difficult-to-isolate frequencies below the human hearing threshold. Technical Manufacturing Corp., Peabody, MA; ph 978/532-6330, e-mail [email protected]., www.techmfg.com.
300mm PVD system
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The MD(x) Series of PVD systems enables gains in yield and tool ROI by delivering high-quality films and high throughput required for emerging IC PVD applications. PVD cathode geometries are optimized to provide metallurgical uniformity across 300mm wafers, without resorting to yield-damaging high temperatures or high RF bias. Advanced material-tuned target designs reduce roll-off while extending target life, allowing more wafers processed between monitors and maintenance. Wafer-transfer and vacuum-technology enhancements allow wafer throughput of >50wph. Tegal, Petaluma, CA; ph 707/765-5613, e-mail [email protected], www.tegal.com.
Combo system based on ACT line
The CLEAN TRACK ACT M photomask resist coater/developer is targeted for 6025 substrate processing at the 90–65nm nodes. Three modules are incorporated into one system: a photomask developer, a photomask resist coater, and a photomask (PEB) baker. The system, based on TEL's CLEAN TRACK ACT platform, provides more advanced processing control and techniques for OPC, phase-shifting, and chemically amplified resists, resulting in improved within-mask and mask-to-mask process uniformity and reduced defects. Tokyo Electron Ltd., Coater/Developer Business Unit, Tokyo, Japan; ph 81/3-5561-7406, e-mail [email protected], www.tel.com.
Ion implanter
iStar is a high-current, batch-mode ion implanter featuring high tilt angle and ultralow energy capabilities. A proprietary energy filter employed in decel mode enables high beam currents with energy purity of 99.9% at extremely low energy (2mA @ 100eV). The 13-wafer endstation features rotatable wafer pads that enable tilt angle implants up to ±45∞. A horizontal robotic wafer transfer eliminates edge gripping. Tokyo Electron Ltd., Single Wafer Deposition Unit, Austin, TX; ph 512/424-1369, e-mail [email protected], www.tel.com.
Batch sputtering system
The LLS EVO II batch sputtering system has five sources that can be configured for sputtering options that include DC, RF, RF/DC, pulsed DC, and co-sputtering. Batch-to-batch uniformity for various materials ranges from ≤0.5–≤1.0, with a capacity of 36 4-in. substrates, 12 6-in. substrates, or 9 8-in. substrates. The system offers optional automatic cassette-to-cassette handling for GaAs wafers, and can be set up as a fully automated turnkey system with a user-friendly Windows NT-based controlling system. Unaxis Wafer Processing, St. Petersburg, FL; ph 727/577-4999, e-mail [email protected], www.waferprocessing.unaxis.com.