FINAL MANUFACTURING — PRODUCTS
07/01/2004
Automated test equipment designed for SoCs
The T2000 series of automated test equipment is based on the OPENSTAR platform, and specifically designed to test systems-on-chip embedded in electronics products. The open, interoperable architecture is adaptable as a result of its flexible test functions and interchangeable modules. The first system in the series performs high-speed microprocessor tests with high-current device power supplies, and optimizes test cost with pin/board slice architecture. Advantest America Inc., Santa Clara, CA; ph 408/844-7805, [email protected], www.advantest.com.
Temporary bond material eliminates VOCs
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The Aquabond series includes hot-water soluble thermoplastics used as temporary wafer-bonding material, eliminating volatile organic compounds in a wafer-polishing or wafer-dicing process. All products are virtually insoluble in cold or cool water, thus providing a strong bond in the presence of aqueous cutting lubricants and coolants. After work-cycle completion, the workpiece can be placed in hot water with a 2% solution of biodegradable cleaning agent and the thermoplastic goes to solution (100% water solubility at 80∞C). It can then be poured down the drain. Aquabond products are eco-friendly and biodegradable. Aquabond Technologies, Camarillo, CA; ph 805/383-4008, fax 805/383-4018, e-mail [email protected], www.aquabond.net.
Quick-release weld system
The Model 4-500 benchtop head is a fully integrated tube weld head system for high-production bench welding of short stick-out fittings, tubes, tube-to-valve bodies, and other similar assemblies. It is suited for cleanroom aseptic welding of components for the semiconductor, biopharmaceutical, aerospace, and other industries. The 4-500 can be used by itself or with a variety of stands and blocks to support valves, regulators, and tubing during welding. The quick-release tooling is both sturdy and accurate, with a solid grip on the items to be welded. Arc Machines Inc., Pacoima, CA; ph 818/896-9556, fax 818/890-3724, e-mail [email protected], www.arcmachines.com.
All-surface inspection system
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A solution for high-speed, all-surface advanced macro wafer inspection and metrology for frontside, backside, and wafer edge detects contaminants, cracks, and other defects that can lead to large-scale contamination further in the process. The flexible capability of all-surface inspection in one system reportedly allows higher throughput and savings in fab automation, training, and space. Device manufacturers can customize a solution to their specific inspection needs with multiple configurations of front, back, and edge inspection. The tool is designed for deployment at bare wafer processing throughout the fab and at outgoing inspection, providing critical information about the entire wafer. August Technology, Bloomington, MN; ph 952/820-0080, fax 952/820-0060, e-mail [email protected], www.augusttech.com.
X-ray system aids viewing with filament-free tube
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The XiDAT XD7600 provides oblique angle views of up to 70∞ for any position 360∞ around any point of the 458× 407mm inspection area. Precise manipulation allows the system to inspect all interconnections—ball, bond, and wire—on BGA and CSP devices. The viewing capability of the XD7600 platform is further enhanced with the Dage NT250 "filament-free" x-ray tube, coupled with standard active antivibration control, which provides feature recognition down to 0.25µm in a maintenance-free package. The operating system, Image Wizard (Version 11), offers a user-friendly point-and-click interface. Dage Precision Industries Inc., Fremont, CA; ph 510/683-3930, e-mail [email protected], www.dageinc.com.
Servomotors with bearing-less design
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Kollmorgen CARTRIDGE DDR direct-drive rotary servomotors combine the performance of frameless direct-drive motors with the ease of installation of a full-frame motor. CE-marked and UL-listed for global application, these motors feature pre-engineered components; an integrated, factory-aligned, high-resolution feedback device; and a bearing-less design that facilitates "mount and run" operation in <30 min. The motors eliminate all mechanical transmission parts, reportedly resulting in simplified installation, increased machine uptime, quieter operation, increased accuracy and zero maintenance. Danaher Motion, Wood Dale, IL; ph 866/316-8437, e-mail [email protected], www.danahermotion.com.
Fast flip-chip bonding platform
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The 8800 FC Quantum platform reportedly enables the highest throughput available in a single machine for a variety of flip-chip applications. The dual bonding system (DBS) executes individual bonding steps in parallel. It consists of two flip modules, two gantries, two slide fluxers, and two upward-looking cameras. A sophisticated "anticollision arbiter" controls axis movement. The DBS enables the bonder to simultaneously achieve up to 10,000 uph throughput (dry cycle) and maintain constant, secure process times and 10µm @ 3 sec placement accuracy. Datacon Technology AG, Trevose, PA; ph 215/245-3052, e-mail [email protected], www.datacon.at.
Organic-based die-attach products
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The DA-7000 and DA-8000 Series die-attach product line is based on organic technology that will target both lead frame and array packages for semiconductors, especially 3D stacked die packaging and board-on-chip devices. These die-attach products are based on several organic chemistries and hybrid systems. Process options such as printing, dispensing, and flexible cure schedules are available. Specific properties around Tg, modulus, low moisture, electrical, or nonconductive high thermal performance will be offered to address packaging issues such as voiding, die cracking, and delamination experienced in packages under Pb-free conditions. Dow Corning Inc., Midland, MI; ph 617/868-0364, e-mail [email protected], www.dowcorning.com.
Test handling system
SIDEWINDER is a strip-test handling system designed for production handling of packaged semiconductor components in panel or leadframe format. It uses linear-motor, air-bearing stage technology to provide wear-free, frictionless performance at high speeds. A large thermal soak area, which provides wait-free testing even at maximum throughput, is optional. The system can be deployed as a standalone handler with cassette input/output modules, or easily integrated in-line with existing assembly equipment via a SMEMA interface. Electroglas Inc., San Jose, CA; ph 408/528-3167, e-mail [email protected], www.electroglas.com.
X-ray inspection system
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The WBI-FOX meets automated standards for 200mm and 300mm wafers with a customized handling system to prevent human interface with the wafers, flexible recipes that adjust to specific wafer characteristics, and summarized inspection results in pre-defined reports. TXI control allows stable and permanent image quality for real-time void inspection. Feinfocus, Stamford, CT; ph 978/794-5441, e-mail [email protected], www.feinfocus.com.
Troubleshooting tool set
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The TS3 300mm station is suited for use in wafer rescue applications, but is also an alternative to expensive sorting platforms. The tool set consists of an automatic FOUP opener, an automatic low-contact wafer-transfer machine, and a portable vacuum wand. The FOUP opener removes and secures the FOUP door at the touch of a button. The transfer machine can automatically mass-transfer wafers between various combinations of FOUPs and/or FOSBs. The tool includes a wafer mapper to insure wafer safety. H-Square Corp., Sunnyvale, CA; ph 408/734-2543, fax 408/734-1132, e-mail [email protected], www.h-square.com.
DC/RF test system
The S680DC/RF parametric test system controls 300mm wafer processes in 200mm test times with the SimulTest parallel-test software option for measuring up to nine devices within a single probe touchdown. The system has identical, high-resolution DC measurement paths for all tester pins to provide 100aA and 100nV measurement resolution. Optional KTE AdapTest software allows the system to change test plans in real time. Keithley Instruments Inc., Cleveland, OH; ph 440/248-0400, fax 440/248-6168, e-mail [email protected], www.keithley.com.
Stud bumper bonds in a single pass
The WaferPRO plus is a high-speed, single-pass stud bumper that handles wafers up to 300mm and bonds 22 bumps/sec, depending on bump type, size, and pitch. It offers ±5µm positional accuracy at 3σ and can bump down to 65µm. The stud bumper offers large table travel to handle 12 in. wafers in a single pass. The WaferPRO plus kit is also available to provide a fast upgrade path for all existing WaferPRO customers. By installing the kit, which includes hardware, specialized servo code, and motion profiles, customers can increase their existing WaferPRO stud bumpers to 22 bumps/sec as well. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6795, fax 215/784-6284, e-mail [email protected], www.kns.com.
Imprint lithography system
The IMPRIO 100 is based on step-and-flash-imprint-lithography (S-FIL), and delivers high-resolution patterning, fine alignment, and 3D replication to customers seeking sub-50nm lithography. The field size is a 25×25mm active print area, with 100µm street width. The system can pattern nanoscale devices and structures, offering an alternative to optical and e-beam lithography techniques for smaller, faster, higher-density electronic circuits, microprocessors, and memory chips for various industries. Molecular Imprints Inc., Austin, TX; ph 512/334-1203, e-mail [email protected], www.molecularimprints.com.
AFP provides flexible scanning options
The Multiscan atomic-force probe (AFP) quickly and repeatedly measures electrical performance characteristics of 90nm and 65nm transistors. The AFP uses multiple specialized atomic-force microscope heads, controlled by patent-pending Multiscan software, to locate a failing transistor and contact closely spaced terminals. Optional scan modes such as mapping and high-frequency probing provide location, characterization, and probing of failing devices. Multiprobe, Santa Barbara, CA; ph 805/560-0404, fax 805/560-0414, e-mail [email protected],www.multiprobe.com.
ATE system
The Maverick Lightning automated test equipment (ATE) system adds full dynamic analog test capability to the Maverick line for systems-on-a-chip (SoC) and systems-in-a-package (SiP) technologies: logic, memory, and analog test. The system incorporates a mixed-signal pin card (MSPC) that combines larger analog-tester capabilities onto a single PC board, allowing users to add analog capability to a standard Maverick system or configure a system with multiple MSPC boards to support high-volume parallel testing. Nextest, Sunnyvale, CA; ph 858/484-9065, fax 858/484-9066, e-mail [email protected], www.nextest.com.
Wire bonder shows placement >5??m
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The Model 8000 gold ball-and-stitch thermosonic wire bonder performs precision gold wire bonding for flexibility, ease of programming, and high throughput in complex multichip applications, high I/O count devices, and gold ball bumping for flip-chips. The 72 in.2 work area and rectilinear z-stroke of 20mm bonds large substrates in one pass. Dual handling systems maximize throughput with targeting and wire placement of >5µm. Palomar Technologies, Vista, CA; ph 760/931-3440, e-mail [email protected], www.bonders.com.
Plasma system
The Plasma System 80 processes individual substrates, for cleaning chip carriers used in IC assembly, providing total inline processing. The tool features fast and efficient surface cleaning, combined with a uniform and damage-free plasma treatment. Processing time for solder mask activation is just under 10 sec. Its process chamber can accommodate the entire manifold of chip carriers ranging from chip-scale packages, plastic ball grid arrays, and flexBGAs to hybrids, COB substrates, and to all types of metallic leadframes. PVA TePla AG, Feldkirchen, Germany; ph 49/89-90503-1, e-mail [email protected], www.pvatepla.com.
Parametric tester
The DSPT 9012 (desktop semiconductor parametric tester) performs semiconductor device characterization and testing. Among its features are an intuitive Windows-based user interface, a variety of programming tools, and up to 12 independent high-accuracy, high-power source and measurement units (each is capable of up to 20W). The tester can be used in a variety of configurations from a standalone desktop analyzer to a rack-mounted component that can control, or be controlled by, a fully integrated test system using industry-compatible GPIB commands. QualiTau, Santa Clara, CA; ph 408/522-9200, e-mail [email protected], www.qualitau.com.
Pick-and-place system
The A45 has throughput up to 3000 units/hr and die-sort data management capabilities not previously available on low-cost, 300mm-wafer, automatic die pick-and-place systems. With its Die Sort Manager software and pattern recognition, the A45 uses a probe wafer map to identify die locations and bins die to wafer-map or user-defined specifications; the software updates the wafer map with data about the die removed and their bins. When a map is not available, the A45 uses its vision processor to identify inked die before proceeding with a "remove inked" or "bin good" die plan. Royce Instruments Inc., Napa, CA; ph 707/ 255-9078, fax 707/255-9079, e-mail [email protected], www.royceinstruments.com.
Process chambers
The Raider M series offers high-performance process chambers in an automated platform scaled for pilot line, R&D, or low-volume production installations. Single or dual chambers are capable of processing 150–300mm wafers and are served by a single robot. Raider M can be configured for surface-preparation, ECD, or advanced-packaging applications. The Windows XP-based controller offers advanced process control features and full networking capabilities. Semitool Inc., Kalispell, MT; ph 406/758-7540, e-mail [email protected], www.semitool.com.
Bond cluster system
The ABC200 automated bond-cluster system for volume production of wafer-level bonding processes, such as wafer-level MEMS encapsulation, SOI bonding, Si-Ge wafer bonding, and 3D packaging, combines multiple modular configurations within one system. The process modules use up to 40% less floor space than alternative approaches. The system can be equipped with wafer-to-wafer alignment and bond modules, atmospheric-pressure plasma activation modules (nanoPREP), megasonic cleaning and dual-wafer megasonic clean/bond modules, and IR bond inspection modules. Süss MicroTec Inc., Waterbury Center, VT; ph 802-244-5181, e-mail [email protected], www.suss.com.
Dicer uses cold laser process
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Laser-Microjet is available as a fully automated dicing machine — the LDS200A — that handles wafers up to 200mm and dice-chip sizes down to 0.25× 0.25mm with a "cold laser" process, which uses a hair-thin water jet to guide the laser beam onto the wafer, functioning as a liquid optical fiber. It can operate at speeds up to 300mm/sec for 50µm-thick Si wafers, with clean edges. Unlike conventional laser cutting or scribing methods, the water jet cools the material and prevents depositions, leaving the wafer free of residue. To fix chips during dicing, a UV-tape, LaserTape, is used; to avoid being cut while dicing, it does not absorb the laser light, and allows the water jet to pass through. An optional megasonic or high-pressure water-jet cleaning station can be integrated. Synova SA, Ecublens, Switzerland; ph 41/21-694-35-00, e-mail [email protected], www.synova.ch.
Multisite test system
The FLEX semiconductor test system performs multisite testing, spanning requirements from conventional DFT and structural test to standard analog and mixed-signal to complex SoCs. Its tester-per-device-core architecture delivers a complete set of test resources to each device core, with instrument synchronization and control in device clock time on a vector-by-vector basis. The universal slot test head and high-density instrumentation allow easy reconfiguration to changing test needs. Teradyne Inc., Boston, MA; ph 617/482-2700, e-mail [email protected], www.teradyne.com/flex/.
Fold-over package
The µZ fold-over package has a modular, layered design that enables OEMs, contract assemblers, and semiconductor manufacturers to mix and match independently tested silicon devices — including processors, controllers, and memory — from multiple sources, and then stack the devices within the footprint of a single chip. Two-metal layer tape, a key building block of the technology, is now available from several suppliers. Tessera, San Jose, CA; ph 408/952-4317, e-mail [email protected], www.tessera.com.
Microfiltration systems
Memtek microfiltration systems incorporate cross-flow tubular membranes that remove precipitated contaminants and produce a high-quality filtrate suitable for discharge or further treatment. Both standard and high-flow microfiltration systems are available. The standard E-series systems accommodate flow rates up to 500gpm, while the HF-5 membranes are economical in the higher flow ranges (150–.2500gpm). Both systems utilize rugged Memtek PVDF membranes, which are resistant to most oxidizing and reducing chemicals over the full pH range. USFilter, Schaumburg, IL; ph 847/706-6912, e-mail [email protected], www.usfilter.com.