Product News
05/01/2004
KrF system addresses sub-100nm design nodes
 |
The ELS-7010 krypton fluoride (KrF) excimer light source is designed for volume-production lithography applications at the 248nm wavelength. With 40W optical output power and 4kHz pulse repetition rate, the system delivers a high level of spectral performance through a line-narrowed bandwidth of <0.35pm FWHM and <1.2pm at 95% energy integral. The light source reportedly features VERRO (variable energy and repetition rate operation) to increase process latitude, MicroInject to minimize downtime, and high-accuracy tuning technology for wavelength stability. Cymer Inc., Santa Clara, CA; ph 858/385-7300, fax 858/385-7100, e-mail [email protected], www.cymer.com.
Optical CD metrology tool provides inline transistor control
 |
The SpectraCD 100 uses broadband spectroscopic ellipsometry with reflective optics across a continuous wavelength spectrum from 190–800nm to detect process issues that require extreme sensitivity, such as resist footers in gate structures. The system's new 3D modeling capability enables measurement of contact holes, and it can monitor a variety of frontend layers now including DRAM gate, bilayer resist, step height, deep trench, and CMP layers with liners. KLA-Tencor Corp., San Jose, CA; ph 408/875-4200, fax 408/875-4144, e-mail [email protected], www.kla-tencor.com.
PECVD system has throughput >60 substrates/hr
 |
The AKT-40K PECVD system is used for manufacturing seventh-generation (1800×2200mm2 class) TFT-LCD panels primarily for large, high-resolution flat-panel televisions. The system reportedly provides 30% reduction in NF3 consumption on a normalized basis over fourth-generation systems. A new loadlock design, robotic transfer, and software modifications can increase productivity, with a throughput >60 substrates/hr for single-layer applications. The system can also deposit in situ multiple-layer films of doped and undoped amorphous silicon, silicon oxide, silicon oxynitride, and silicon nitride. AKT Inc., Santa Clara, CA; ph 408/727-5555, www.appliedmaterials.com.
DIO3 system offers
 |
The LIQUOZON Smart ozonated-water delivery system delivers ultrapure ozonated water (DIO3) for wafer and substrate cleaning during IC and thin-film processing. The self-contained system, which generates DIO3 at the point of use to eliminate chemical storage, provides a smaller footprint, as well as lower gas and DIO3 consumption. The system does not generate NOx, a source of contamination and a possible threat to metal piping, and residual ozone that does not dissolve is converted back to oxygen before it is released to the exhaust. The MTBF is reportedly >20,000 hrs. MKS Instruments Inc., Andover, MA; ph 978/975-2350, fax 978/975-0093, e-mail [email protected], www.mksinst.com.
Compact capacitance vacuum gauge
 |
The Model 720 offers a 0–5VDC or 0–10VDC output that is linear with pressure and independent of gas consumption. Provided reading accuracy is ±0.5%, with an optional accuracy of ±0.25%. Vacuum pressure ranges include 2–150kPa, 10–1000torr, and 10–1000Mb, with industry-standard 9-pin D-sub electrical connection. Corrosion-resistant 600 series Inconel wetted parts make the 720 suitable for use with corrosive media. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, fax 978/264-0292, e-mail [email protected], www.setra.com.
Liquid-crystal polymer
Liquid-crystal polymers make it possible to produce JEDEC- and MIL-specified hermetic plastic packages for semiconductor devices. Lower dielectric constant and loss properties allow high-frequency performance, and thin wall construction provides more air inside the package for active and passive components. Lid attachment with Ultraseal technology produces a hermetic seal in <2 sec, faster than a 1 hr epoxy cure cycle, and eliminates epoxy flow and outgassing, which affect reliability. Quantum Leap Packaging Inc., Wilmington, MA; ph 978/253-6101, fax 978/658-2444, e-mail [email protected], www.qlpkg.com.
Signal-integrity probe station
The PSI 1920 is a flexible probing station for signal-integrity probing apps on PCBs, fixed-pitched BGAs, semiconductor devices, and hybrid ceramics. The station accommodates up to three manipulators per adjustable platen, and the manipulator-probing end adapts to fit 50Ω controlled-impedance probes or high-impedance oscilloscope probes to collect signals for vector network analyzers, TDR instruments, or oscilloscopes. The working area is 19×20 in. with a clearance of 3.375 in. Probing Solutions Inc., Dayton, NV; ph 775/246-0999, fax 775/246-0480, e-mail [email protected], www.probingsolutions.com.
Hydride purification media
The Aeronex SK purification media purify hydride gases such as ammonia, arsine, phosphine, germane, and silane. The SK media are iron-free to eliminate the release of carbon monoxide, and offer an increase of 163% in oxygen capacity and a 20% increase in moisture capacity over the previous Y Series product. The media provide removal efficiency better than 1ppb under conditions of 10ppb carbon monoxide and offer capacity ≥37 days. Mykrolis Corp., Billerica, MA; ph 978/436-6500, e-mail [email protected], www.mykrolis.com.
Bluetooth-enabled metrology system
The compact ISIS 5 module acquires temperature data from Process Probe instrumented wafers and communicates it through Bluetooth MicroNet technology to Thermal TRACK 5 software on a SensArray-qualified PDA. The ISIS 5 module is available in 9/17-channel multiplexed or 17-channel nonmultiplexed models. Both models include either thermocouple or resistance-temperature detector sensors, as well as a high-density smart connector for less weight and pull on instrumented wafers. SensArray Corp., Fremont, CA; ph 510/360-5600, fax 510/360-5601, e-mail [email protected], www.sensarray.com.
Spray coater for 3D lithography
 |
A 3D lithography system combines the AltaSpray coater — for conformal layers over topography of up to several hundred microns — with LEGO optics for large depth-of-focus imaging. AltaSpray resist deposition enables conformal coats across flat and steeply sloped surfaces using a patent-pending atomization technology. LEGO optics are designed to obtain a large depth of field for precise patterning on the top and bottom and along the slope of structures. The system enables 3D packages, 3D wiring, advanced MEMS, and other technologies. Süss MicroTec AG, Garching, Germany; ph 49/89-32007-237, fax 49/89-32007-162, e-mail [email protected].
Integrated machine-vision system
 |
The NetSight II integrated machine-vision system is designed for rapid deployment in plant floor applications in a compact, 8×7×3-in. package. The system combines a processing engine with a camera interface, flexible software, and industrial communications for simultaneous image acquisition from multiple cameras. It also features OPC-compatible open connectivity, progressive-scan analog inputs, and Sherlock "point-and-click" GUI. ipd, Billerica, MA; ph 978/670-2002, fax 978/670-2010, e-mail [email protected], www.goipd.com.
Semiautomatic printer for hybrid apps
The MX-2 semiautomatic screen and stencil printer is designed for thick-film, hybrid, and solar-cell applications. The standard machine is equipped with an x-, y-, and Θ-adjustable print table and a vacuum circuit. A pneumatic cylinder controls the print table for accurate positioning and moves it laterally to the right to simplify loading and unloading. The interface displays errors in plain text, and a text editor allows additional information to be entered and stored on the built-in hard disk. Ekra, Boennigheim, Germany; ph 49/7143-8844-928, fax 49/7143-8844-22, e-mail [email protected], www.ekra.com.
Measurement device with laser scanner
 |
The Laser ScanArm is a seven-axis, contact/noncontact measurement device with an integrated laser scanner to digitize without removing either the hard probe or laser scanner. Users can collect simple point variations with the arm's hard probe, then laser-scan the sections requiring larger volumes of data. The arm is capable of collecting more than 13,000 points/sec, and can be used for inspection, cloud-to-CAD comparison, rapid prototyping, reverse engineering, and 3D modeling. Faro Technologies Inc., Lake Mary, FL; ph 800/736-0234, e-mail [email protected], www.faro.com.
Diode-pumped green lasers
The DM Series of diode-pumped Nd:YLF Q-switched green lasers offer high pulse energy at high repetition rates in a compact, hands-free system. Three models are available with pulse energies of 30mJ, 20mJ, and 10mJ at 1kHz and 527nm. Optional features include an automated power attenuator, fiber-coupled output, TEM00 output, and twin pulse operation (separation ≥1µsec). The lasers are suited to applications such as pumping of dye lasers, high-speed imaging, and particle image velocimetry. Photonics Industries International Inc., Bohemia, NY; ph 631/218-2240, e-mail [email protected], www.photonix.com.
Dry film photoresist
WB Series dry film photoresist for wafer bumping is applied in one step, with no solvents or drying required. The dry film photoresist process flow consists of lamination, edge trimming, bake, exposure, bake, developing, and bake — fewer steps than liquid photoresist processes. The films have a resist aspect ratio of 3:1 for fine-pitch bumps in electroplating applications. WB3000, WB2000, and WB5000 Series films come in 50 and 100µm thicknesses. DuPont Electronic Technologies, Research Triangle Park, NC; ph 919/248-5598, e-mail [email protected], www.dupont.com/pcm/icp.
Ozone generator
 |
The Series OG-5000 ozone generator produces high-purity ozone gas for applications including CVD, ALD, oxide growth, wet processing, photoresist removal, and more. A controlled electrical discharge produces the ozone gas; ppm levels of a "doping" or "spiking" gas increase the ozone production and ensure the stability of ozone concentration over time. The OG-5000 is available as a standalone generator or as part of a complete turnkey ozone gas or DIO3 water delivery system. IN USA Inc., Needham, MA; ph 800/798-4029, fax 781/444-9229, e-mail [email protected], www.inusacorp.com.
Copper electroplating system
The SABRE NexT copper electrochemical deposition system is enhanced with a proprietary single-step chemistry that reportedly provides reproducible fill at advanced nodes, with reduced defects and an optimal profile for CMP. A new anode cell design reduces the level of contaminants in the plating bath, cutting chemical consumption and costs. The system can be configured with a remote bath, enabling production and development efforts on the same tool. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, fax 650/968-8990, e-mail [email protected], www.novellus.com.
Wafer prober
The P-12XLn+ 300mm wafer prober targets multidie memory probing and high-speed logic device applications, offering 1.8µm accuracy. Optional features include thermal systems with -65 to +300°C operating temperatures, probe-card changers capable of semiautomatically handling 400mm-dia. cards, and in situ Z-wide area probe polish. To allow seamless integration into existing test areas, the software is compatible with the P-12XL platform. Tokyo Electron Ltd., Tokyo, Japan; ph 81/3-5561-7406, e-mail [email protected], www.tel.com.
Flash annealing system
The FLASH-300 annealing system forms ultrashallow transistor junctions (≤15nm) for high-performance memory and microprocessor devices. A single process chamber with RTP flash technology activates ion-implanted dopants, and uniformly heats the entire wafer with Xe-based ultraviolet radiation, with exposure times ranging from tenths of a millisecond to several milliseconds. A Soft-Flash anneal lowers thermal stress and enables tailored recrystallization of the implant layer and junction abruptness. WaferMasters Inc., San Jose, CA; ph 408/451-0859, www.wafermasters.com.
DC/RF test system
The S680DC/RF parametric test system controls 300mm wafer processes in 200mm test times with the SimulTest parallel-test software option for measuring up to nine devices within a single probe touchdown. The system has identical, high-resolution DC measurement paths for all tester pins to provide 100aA and 100nV measurement resolution. Optional KTE AdapTest software allows the system to change test plans in real time. Keithley Instruments Inc., Cleveland, OH; ph 440/248-0400, fax 440/248-6168, e-mail [email protected], www.keithley.com.
Inspection system add-ons
The EdgeCheck option and wafer backside quality monitor work with ADE's existing FIT inspection tools/AWIS inspection systems to identify and sort on-wafer edge defects and backside particles during the surface inspection process. With the monitor, EdgeCheck allows front and back surface inspection to the wafer edge, including between the edge-exclusion zone and physical wafer edge, an area not usually covered by standard particle inspection systems. ADE Corp., Westwood, MA; ph 781/467-3740, e-mail [email protected], www.ade.com.
Epoxy adhesive
Master Bond EP35 is a two-component, contact and room-temperature curing, high-temperature resistant epoxy adhesive, suitable for bonding to metals, glass, ceramics, wood, vulcanized rubber, and many plastics. The epoxy produces high-strength bonds with a service operating-temperature range from -60–500°F. The system is 100% reactive and does not contain diluents or solvents. Master Bond Inc., Hackensack, NJ; ph 201/343-8983, www.masterbond.com.
RF SoC test system
An RF SoC test solution tests next-generation wireless devices used in wireless LAN, BlueTooth, cellular, GPS, and other applications. The system has an RFIC IQ analog option for a relative amplitude accuracy of ±0.05dB and a relative phase accuracy of ±0.2°. The solution also includes 12 RF ports, 40MHz IF bandwidth, 64 pins of 250Mbps digital, and 8GHz stimulus and measure. Agilent Technologies Inc., Palo Alto, CA; ph 970/635-6013, e-mail [email protected], www.agilent.com.
X-ray inspection system
 |
The WBI-FOX meets automated standards for 200mm and 300mm wafers with a customized handling system to prevent human interface with the wafers, flexible recipes that adjust to specific wafer characteristics, and summarized inspection results in pre-defined reports. TXI control allows stable and permanent image quality for real-time void inspection. Feinfocus, Stamford, CT; ph 978/794-5441, e-mail [email protected], www.feinfocus.com.