Product News
04/01/2004
Software models e-beam lithography in 3D
 |
SELID version 3.3 models the entire electron-beam lithography process in 3D, reportedly reducing cycle times and development costs by running hundreds of wafers or masks overnight, without using production resources. SELID uses the Monte Carlo method for simulating e-beam scattering and incorporates automated analysis tools that allow variation of all parameters. The software offers process-oriented flows that allow users to specify process steps sequentially, such as substrate stack definition, e-beam exposure, post-exposure bake, and resist development. SIGMA-C GmbH, Munich, Germany; ph 49/89-63025741; e-mail [email protected], www.sigma-c.com.
Liquid polymer encapsulates without sweep
 |
NoSWEEP wire-bond encapsulant is a silica-filled liquid polymer that encapsulates narrow-diameter, long, and ultrafine-pitch wires on semiconductor devices without causing sweep. The polymer reportedly locks wires into place and prohibits their movement during process transition and transfer molding to reduce sweep from 6.5% to 0.12% and improve yield. NoSWEEP can be dispensed in either inline or offline processes, fully surrounding the wires or placed at points where shorting is a problem. The encapsulant is UV-cured in a wire bonder, then completes full cure during the traditional post-mold cure cycle. Polysciences Inc., Warrington, PA; ph 215/343-6484 ext. 126, e-mail [email protected], www.polysciences.com.
Dry strip system for 300mm FEOL apps
 |
The RapidStrip 320 resist and polymer removal system uses downstream microwave plasma generation and chuck-based wafer heating to provide dry-strip, with small process vacuum chambers for high ash rates and process repeatability. The small-footprint platform is available in single and dual process-chamber configurations for capacity flexibility. The system has been specifically designed for high-volume, 300mm front-end-of-line (FEOL) applications for 130nm device processing and beyond. Axcelis Technologies Inc., Beverly, MA; ph 978/787-4266, fax 978/787-4275, e-mail [email protected], www.axcelis.com.
Photoresist/spin-processing system has compact, modular design
 |
The FLEXI PCS photoresist/spin-processing system incorporates PC-based control and brushless DC servomotor-driven actuation. Its extended z-axis polar robots permit vertical stacking of thermal modules, which are enclosed for controlled process atmosphere. The noncontact optical wafer-centering capability completely eliminates centering devices, enabling a compact, modular design. A system configured with two spin modules and four thermal modules, or alternatively, one spin module and eight thermal modules, occupies <1m2. S-Cubed Inc., Montville, NJ; ph 973/263-0640, fax 973/263-8888, e-mail [email protected] or [email protected], www.s-cubed.com.
Plasma system for batch ashing
 |
The Plasma System 800 is designed for wafer processing in high-volume 200mm wafer fabs. Cassette-to-cassette handling of 25 wafer lots is integrated with PC control and touchscreen operation. The small-footprint plasma asher uses microwave excited batch technology to remove photoresist masks without damage to devices —including CMOS, MEMS, photonics, solar cells, and hard disk drives —that can occur with RF plasma systems. PVA TePla AG, Feldkirchen, Germany; ph 49/89-90503-126, fax 49/89-90503-185, e-mail [email protected], www.pvatepla.com.
Deep-Si etching module
The Omega DSi is a module for Bosch process deep-Si etching designed to operate at high RF powers, high pressure, and high process-gas flow rates for optimum dissociation of the SF6 etch gas. Processes have been developed for applications requiring high net etch rate (>12µm/min), minimal scalloping (<30nm), SOI (<100nm notch), and high aspect ratios (~35:1). Trikon Technologies Ltd., Newport, UK; ph 44/1633-414030, fax 44/1633-414180, [email protected], www.trikon.com.
Suspension systems for microscopy
 |
STX suspension arm systems for the SZ2 stereo microscope systems allow movement of the microscope in x, y, and z directions. With an adjustable gas-spring counterweight suspension arm, the microscope can be positioned with the touch of a finger. Standard suspension arms are available in 360mm and 560mm lengths and can balance a weight up to 6kg. The STX-300 horizontal arm can reach any point within a diameter of 1600mm. Olympus Europa GmbH, Hamburg, Germany; ph 49/40-23773-326, fax 49/40-23773-647, e-mail [email protected], www.olympus-europa.com.
Dual-use mask and bond aligner
 |
The 300mm automated IQ Aligner performs precision alignment techniques such as top-side, bottom-side, large-gap, and darkfield alignment. The system targets applications such as full-field proximity exposure for 300mm wafer bumping, thick resist, and BCB lithography, as well as transparent packaging and NGL. Wafer sizes from 100–300mm are supported with handling capability for thin, fragile, etched, and bowed wafers. EV Group, Schärding, Austria; ph 43/7712-5311-0, fax 43/7712-5311-4600, e-mail [email protected], www.evgroup.com.
Microscope objective stage
The MIPOS 500 travel stage for focusing microscope objectives exhibits nearly 5× the travel of the MIPOS 100 stage, at 500µm, with repeatability ±16nm. The symmetric design of the stage gives it low angular deviation over the entire travel, important for high-magnification step-and-scan image acquisition. Various thread-type adapters allow flexible and easy mounting for many microscopes. piezosystem jena GmbH, Jena, Germany; ph 49/3641-66-88-0, fax 49/3641-66-88-66, e-mail [email protected], www.piezojena.com.
RF delivery system
 |
The 3kW Apex delivery system provides high power density and power-delivery consistency in a compact, half-rack package. Its RF-conversion technology eliminates the need for frontend DC-to-DC conversion components. An optional internal match network further reduces extra equipment. The modular system can be customized via an extensive list of parameters, from input voltage to on-board RF-connector location. Advanced Energy Industries Inc., Fort Collins, CO; ph 970/407-6253, fax 970/407-5253, e-mail [email protected], www.advanced-energy.com.
Gas-concentration sensor
Version 8.08 of the Piezocon gas-concentration sensor reportedly exhibits a faster response and lower pressure range than the previous version, and includes both slave and master DeviceNet. The system measures the concentration of a binary mixture of a process chemical in its carrier with precise monitoring of the mass transfer rate of the process chemical to the process tool (ALD, CVD, MOCVD, and more). Lorex Industries Inc., Poughkeepsie, NY; ph 845/471-7740, fax 845/471-6210, e-mail [email protected], www.lorex.com.
Compact pressure regulators
The Dymatrix HPR series pressure regulators are engineered to maintain constant downstream liquid pressure. Constructed from all-wetted PTFE and without sliding parts, the regulators are suited for aggressive chemical and high-purity applications in the semiconductor industry. The series features a wide flow range, from 5cc/min–100L/min, full shutoff, adjustable outlet pressure, inlet pressure up to 72.5psi, and outlet pressure up to 42.5psi. Asahi/America Inc., Malden, MA; ph 781/321-5409, fax 800/426-7058, e-mail [email protected], www.asahi-america.com.
Direct wafer-bonding technology
nano PREP, a method of surface activation and wafer-to-wafer bonding, is available as an optional process module in the SÜSS SOI300 production system or as a standalone module for wafer-level integration of CMOS and MEMS or CMOS and nanotechnology. The technology reduces the process temperature from 1000°C down to 200°C by using an atmospheric pressure plasma to generate a molecular-level surface modification, which allows low-temperature bonding. SÜSS MicroTec AG, Munich, Germany; ph 49/89-320-07-327, e-mail [email protected], www.sussmicrotec.com.
"Smart" edge-grip robot system
The 300mm automated edge-grip robot system provides safe, precise, repeatable 300mm wafer handling with an integrated sensor that enables the robot to "see" and measure its environment and self-teach. The system calculates wafer center with an accuracy of 0.005 in., and its end-effector maps the location and presence of wafers in a cassette and measures wafer elevation and edge location without striking the FOUP. Newport Corp., Irvine, CA; ph 800/222-8440, fax 949/253-1800, e-mail [email protected], www.newport.com.
X-ray inspection software
 |
FGUI version 2.2 x-ray inspection software has been upgraded to include a single-button AVI recorder for saving video sequences of processed images used for training, demonstration, or reporting purposes. FGUI also offers 16-bit image processing, seamless integration of direct digital detectors, and image saving in a variety of formats, such as TIFF, BMP, and JPEG. The software is available with Windows XP on all new FEINFOCUS TIGER and FOX series systems; existing customers may upgrade for their existing operating system. FEINFOCUS, Stamford, CT; ph 978/794-5441, fax 978/688-8418, e-mail [email protected], www.feinfocus.com.
Bond-test system
 |
The Royce 580 is a high-accuracy universal bond-test system for wire-pull, bond-shear, bump shear, stud-pull, and die-shear testing. Test standards supported include Mil-STD 883d, Mil-STD 750c, and ASTM 1269; and test capabilities include wire pull to 10kg, ball shear to 5kg, bump shear to 5kg, and die shear up to 100kg at up to 300°C. The system is network-ready and has a multitasking operating system, process-control software, and programmable testing routines and parameters. Royce Instruments Inc., Napa, CA; ph 707/255-9078, www.royceinstruments.com.
E-beam mask repair tool
The photomask repair tool is reportedly the first to combine high-resolution electron-beam technology with damage-free review and repair capabilities. The tool, based on SMT's field-emission scanning microscope with GEMINI technology, includes a dedicated chamber, a semiautomated mask loader, and a high-precision laser interferometer stage. NaWoTec has added a five-channel gas supply system; a dedicated scan generator; and complete mask-repair software featuring defect navigation, deposition, and etching processes, as well as automation modules. Carl Zeiss SMT AG, Jena, Germany; ph 49/3641-64-2044, fax 49/3641-64-2938, www.smt.zeiss.com.
Lead-free materials system
A lead-free system of matched silver-palladium conductors, resistors, overglazes, and crossover dielectrics provides ratios of 10:1, 6:1, 4:1, and 3:1. The 85-Series resistors feature high stability for hybrid circuit applications or discrete resistor components. The RE88-Series of low ohmic-value resistor pastes have values ranging from 0.1–1.0Ω/sq. The DL11-194 overglaze and 10-038S crystallizing overglaze and crossover dielectric both fire to a hard, smooth coating on 96% alumina substrates. Ferro Electronic Material Systems, Vista, CA; ph 760/305-1020, fax 760/305-1100, e-mail [email protected], www.ferro.com.
Self-adjusting matrix tray feeder
The TF30 automated tray feeder is a self-adjusting handling solution for processing devices in and out of JEDEC and semiconductor-specific matrix trays during programming. The side-mounted design integrates with PP and PS Series automated programming systems, utilizing the existing machine footprint. The feeder can change tray configurations in seconds without operator adjustments, and the Batch Plus process allows component replenishment while the host machine continues to program and process components. Data I/O Corp., Redmond, WA; ph 800/426-1045, e-mail [email protected], www.dataio.com.
Excimer laser lift-off system
The IX-1000 ChromaLift excimer laser system homogenizes the excimer laser beam profile and fires through the back of a sapphire wafer to de-bond a GaN LED device and transfer it to a substrate where it can be packaged onto a heat sink and/or optical reflector. The system incorporates PC-controlled power meters and beam profilometer, an automatic door Class 1 system, industrial-grade reliability with R&D flexibility, and user-friendly Windows 2000 software. JPSA Laser, Hollis, NH; ph 603/595-7048, e-mail [email protected], www.jpsalaser.com.
Metrology software for 90nm processes
Expert Application System (EASy) software automates measurements for copper, low-k, and other process control challenges. EASy generates edge profiles; checks for traces of copper or barrier on ILD spacers between lines, and reports whether the lines are clear, if there is residue, and the thickness of residue; and generates copper/ILD dishing profiles by determining if the measurement site consists of copper or ILD and applying the correct model for each material. Rudolph Technologies Inc., Flanders, NJ; e-mail [email protected], www.rudolphtech.com.