Product News
03/01/2004
E-beam scope system detects nonvisual defects
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The FS3000 EB-Scope system is an electron-beam (e-beam) inspection and metrology system that combines irradiation techniques with a mechanism for measuring pico-level substrate current flows to make nonvisual defects visible by measuring substrate currents instead of detecting secondary electrons. Device manufacturers can inspect high aspect-ratio contact and via structures, and detect failures such as residual oxide due to under-etch, breakthrough of the etch-stop layer due to over-etch, and residual polymer due to poor cleans. Fab Solutions Inc., Kanagawa, Japan; ph 81/44-812-5941, fax 81/44-812-5942, e-mail [email protected], www.fabsol.com.
UV/ozone surface treatment works at low temps
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UV-OZONE PLUS dry surface-treatment technology uses ultraviolet light and ozone to both clean and modify the molecular surface of solids for improved yield, adhesion, and quality of products. Increased surface bond energy is claimed to result in better surface adhesion and uniformity of coatings. The UV photo modification process applies to plastics, metals, and various nonmetallic surfaces. The low-temperature process can be applied to uneven geometries, as long as the surface can be treated with the UV light. Surface treatment applications include IC packages, plasma TV screens, liquid crystal glass, and reticle plates. Optical Associates Inc., San Jose, CA; ph 408/232-0600, fax 408/433-9904, e-mail [email protected], www.oainet.com.
E-diagnostics software enables APC
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eCentre version 2.1 incorporates a light pole status function that allows a user to log into the system to see a tool's status indicator lights as though the user were looking down the aisle in the fab. The option to join an eCentre "session" with other engineers is included to investigate and troubleshoot the tool. A data viewer also permits the user to view real-time numerical data using a variety of graphical and tabular formats. The system may be programmed to download files to an authorized destination at a scheduled time, and meets the Semi PR8 equipment data-acquisition standard. ILS Technology LLC, Boca Raton, FL; ph 802/985-5400, [email protected], www.ilstechnology.com.
Automated cleaning system prevents contamination
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The Process One FX30 system has robotic controls that transport FOUPs through the cleaning process, with the robot and cleaning system contained within an individual cleanroom to prevent contamination. The system is designed to clean and dry Entegris' front-opening unified pods and front-opening shipping boxes. The patented media-isolation technology also segregates cleaning media used inside the FOUPs and FOSBs from the cleaning media used outside, preventing contamination migration between surfaces. Entegris, Chaska, MN; ph 952/556-3131, fax 952/556-1880, www.entegris.com.
Thick-film material system
Thick-film materials for use with AlN substrates provide an alternative to beryllium oxide BeO or thin-film AlN systems. The thick-film material system is suited to applications that require high power output, efficient heat dissipation, and reliable performance. The full line of materials for AlN includes gold- and silver-based conductors, resistors, dielectrics, through-hole fills, brazing, and encapsulant compositions. DuPont Microcircuit Materials, Research Triangle Park, NC; ph 919/248-5422, fax 919/248-5770, e-mail [email protected], www.dupont.com/mcm.
Single-wafer wet-process cleaning series
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The DaVinci series of single-wafer wet-process cleaning systems unite high throughput and small footprint in a modular, multichamber design. The first product in the series, the eight-chamber DV-38F, targets BEOL processing of 300mm wafers with 90nm and below geometries. A robotic handler enables throughput of 200 wafers/hr and beyond; front and rear interfaces allow two users to interact with the system. SEZ Group, Villach, Austria; ph 43/4242-204-455, e-mail [email protected], www.sez.com.
Reworkable underfill encapsulant
CN-1432 reworkable underfill encapsulant offers easy removal of defective CSPs and BGAs when the component and encapsulant are heated to 220°C. The encapsulant is fast-flowing with only a single-side dispense in as little as 15 sec. After flow is complete, the encapsulant can be cured in an in-line oven in 5 min at 165°C. It is suited to high-volume manufacturing of consumer electronics such as mobile phones and other handheld devices. Zymet Inc., East Hanover, NJ; ph 973/428-5245, fax 973/428-5244, e-mail [email protected].
Inlet system for SIRMS
The ManiFold inlet system for the IsoPrime stable-isotope ratio mass spectrometer (SIRMS) automatically delivers gas samples prepared offline into the spectrometer. The 50-port assembly reportedly has a 60% greater capacity than other systems. The system and module together provide a flexible SIRMS system with high sensitivity, high throughput, and comprehensive SampleCentric Windows-based software for ease of use. GV Instruments, Manchester, UK; ph 44/161-902-2100, fax 44/161-902-2198, www.gvinstruments.co.uk.
Inspection software
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The analySIS waferInspector and analySIS filterInspector image-analysis software systems offer fully automatic analysis, classification, and documentation of defects on wafers, residues, filters, or other substrates. In the filterInspector system, all measurement results, histograms, reports, and sample data are saved in the user-definable inspection database. The waferInspector automatically analyzes blank wafers for contamination, defects, or coating flaws, and can save a digital rendering of each wafer. Soft Imaging System, Münster, Germany; ph 49/251-798-000, fax 49/251-798-0099, e-mail [email protected], www.soft-imaging.net.
Variable-pressure SEM
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The SUPRA 60VP is an ultrahigh-resolution field-emission scanning electron microscope with a large cylindrical chamber, refined six-axis motorized stage, 8-in. integrated airlock, and added variable pressure capabilities. The SEM reportedly shows 20% resolution improvement in the low voltage range (1.7nm at 1kV and 4.0nm at 0.1kV). LEO Electron Microscopy Group, Oberkochen, Germany; ph 49/7364-946137, fax 49/7364-844851, e-mail [email protected], www.leo-usa.com.
Web-based Dynamic Reporting module
Dynamic Reporting supports automation and encapsulation of best practices accessible via the Internet in all installations of the dataConductorEP yield-management platform. The module can institutionalize the analysis required to monitor and identify yield variances, forecast inventory, and identify corrective action in a timely manner. Security and access control are built into the web-based platform. Syntricity Inc., San Diego, CA; ph 858/552-4485, fax 858/552-4493, e-mail [email protected], www.syntricity.com.
Mass-imaging process
Mass-imaging thermal interface material (TIM) using ProFlow DirEKT Imaging can ensure uniform thickness of TIM deposited between a silicon die and its package lid, resulting in better thermal connectivity between the die and the lid, as well as greater coplanarity of the lid. Die assembled on substrates enter a single flexible printing platform that combines passive attach, TIM sealing, and lid sealing. DEK International GmbH, Zurich Switzerland; e-mail [email protected], www.dek.com.
EUVL simulation software
SOLID-EUV 1.3 is an enhanced extreme-ultraviolet lithography (EUVL) simulation software that determines the printability of defects on masks. Users can create virtual, defective multilayer blanks to assess possible mask defects and develop strategies to mitigate defects based on simulation analyses. The software is available for several different platforms, including Windows and Solaris. SIGMA-C, Munich, Germany; e-mail [email protected], www.sigma-c.com.
EA PSM material for lithography
The PSM bilayer system adjusts phase and transmission almost independently, according to customer needs. The layer design consists of Ta controlling transmission and delivering etch-stop capability, and SiO2 controlling phase shift. The material exhibits phase-shift uniformity of ±1°, transmission uniformity of ±0.15%, and PSM layer roughness ~2.5Å. Schott Lithotec, Jena, Germany; e-mail [email protected], www.schott.com/lithotec.