Semicon Europa 2004 Preview
03/01/2004
April 19-23, Munich, Germany
Semicon Europa will be held from Monday, April 19–Friday, April 23 at the New Munich Trade Fair Centre (see photo). Sponsored by trade organization Semi, the exhibition will run from April 20–22, and the technical program and events will run from April 19–23. At last year's Semicon Europa, 986 companies presented their products to more than 10,200 registered visitors. See www.semi.org for an up-to-date exhibitor list.
 Attendees at the 2003 Semicon Europa trade show in Munich, Germany. |
Semicon Europa's technical program is broken out into: the Semi Technology Symposium (STS); MEMS program; flat-panel displays (FPD) program; educational courses; and business courses. Some of the program and some Standards Meeting information is included below. See www.semi.org for a complete listing.
Exhibit Dates & Hours
Tuesday, April 20 9 am–5 pm
Wednesday, April 21 9 am–5 pm
Thursday, April 22 9 am–4 pm
Semi Technology Symposium
Tuesday, April 20 12 noon–2 pm: STS: Interconnect Technologies
8:30–11 am: STS: E-Manufacturing/E-Diagnostics
Chemicals & gases
Tuesday, April 20
10:30–12 noon: Safe Handling of H2O2 Standards
1–2:30 pm: Revision to Semi C28 (Hydrofluoric Acid) Standards
2:30–4 pm: Dichlorosilane Standards
4–5:30 pm: Precursors Specification Issues Standards
4–6 pm: CGMG General Meeting
Wednesday, April 21
9 am–12 noon: Gases and Liquid Chemicals Technical Standards Committee
1–3 pm: STS: Contamination Control in the Frontend of Advance Production Lines
Silicon substrates
Monday, April 19
9 am–12 noon: General Silicon Wafer Specifications Standards
12:30–3:30 pm: International AWSIS (Automated Wafer Surface Inspection Specification) Standards
3:30–6:30 pm: International Advanced Wafer Geometry Standards
Tuesday, April 20
9–11 am: International Basic Silicon Wafer Specification Standards
11 am–12 noon: Front-side Wafer Marking for 300mm Standards
12 noon–1 pm: Specification for Particle Removal Efficiency Standards
1:30–5:30 pm: STS: Workshop on Silicon Wafers Standardization
Wednesday, April 21
8:30 am–12 noon: Silicon Wafer Standards Technical Committee
Compound substrates
Tuesday, April 20
2–4 pm: Epitaxial Wafer Properties ECV Standards
4–6 pm: Epitaxial Wafer Properties X-Ray Diffraction Standards
Wednesday, April 21
9–11 am: SiC Standards; 200mm GaAs Kick-Off Meeting Standards
11 am–12 noon: DIN Compound Standards Transfer
1–3 pm: STS: SiGe/SOI/Strained Si: From Growth to Device Properties
3:30–6 pm: Compound Standards Technical Committee
Lithography
Monday, April 19
10 am–5:30 pm: Photomask Fabrication & Qualification Terminology Standards
Tuesday, April 20
9–12 noon: Photomask Flatness Standards
12:30–2:30 pm: Micropatterning Standards Technical Committee
3–5 pm: STS: The Low-k1 Reticle Challenge
EHS
Wednesday, April 21
1:30–5:30 pm: Semi Environment, Health, and Safety Workshop on Compliance with RoHS, WEEE, and ATEX
8:30–9:30 am: Semi S10 Revision Standards/S14 Fire Risk Assessment & Mitigation
Final Manufacturing
Monday, April 19
10 am–6 pm: 6th European Manufacturing Test Conf.
10 am–5:30 pm: Advanced Packaging Conf.
MEMS program
April 19: International MEMS Industry Forum;
April 20: MEMS Standardization and International MEMS Steering Group meetings;
April 21: the MEMS Manufacturing and Packaging Platform
Flat-panel display program
FPD conferences take place on April 21 and 22. See www.semi.org for more details.
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