Semicon Europa2004 Products
03/01/2004
Semicon Europa showcases semiconductor equipment, materials, and services in Europe. Following are some of the new products that will be exhibited at the show.
XRF wafer analyzer
A doubling of the boron-detection capability for BPSG and CoFeB films has reportedly reduced counting time by a factor of four in PW2830 and RQ Jade wafer analyzers for XRF thin-film analysis. For 2500–20,000Å BPSG films with 4.5wt% B, typical counting times have been cut from 100 sec to <30 sec. XRF is the preferred metrology technique in manufacturing dielectric materials for MRAM and GMR devices because it does not suffer from moisture effects, and has the benefit of giving both the film thickness and its chemical composition simultaneously and precisely. PANalytical, Eindhoven, The Netherlands; ph 31/546-534444, fax 31/546-534592, e-mail [email protected], www.panalytical.com.
Noncontact V-Q system
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Models WT-2000, an open cassette tool, and the WT-3000, an SMIF/FOUP system, apply a noncontact, nondestructive measurement technique that replaces traditional C-V measurements for qualifying oxide and/or interfaces in silicon wafers. The tool provides C-V-like data without added process steps, reducing monitoring time, and can measure "fingerprint" of static charge by mapping the surface potential on the wafer. Integrating corona charging, a Kelvin probe, illumination, and a hot chuck, the system rapidly measures most parameters normally obtained by measurement of C-V from accumulation through flat band voltage to depletion. Semilab Rt., Budapest, Hungary; ph 36/1-3824530, fax 36/1-3824532, e-mail [email protected], www.semilab.com.
Automated device bonder
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The FC150 automated device bonder allows 1µm 3s post-bonding accuracy for precise product packaging and assembly. It offers ultrasonic bonding and UV curing, and covers a broad range of applications such as FPA, laser diode, MCM, MEMS, and optical subassembly bonding. The FC150 is equipped with a high-speed topical packaging technique for passive alignment, coupled with 20µrad leveling ability for high yields on a single, upgradeable platform with configurations ranging from manual to full automation. SÜSS Microtec S.A., Saint-Jeoire, France; ph 33/4-50-35-38-09, fax 33/4-50-35-88-01, e-mail [email protected], www.suss.com.
Fab management software
CIMPortal, an EDA+ software tool, enables fab-level access to critical equipment data such as SECS/GEM, high-speed OEM and fab add-on-based sensor, historical, tool-level software version control, and configuration data gathered from capital-equipment OEM suppliers. Without programming, the software can access all of the available GEM data for a 200/300mm tool via an EDA+ secure port, or with more configuration, it can collect existing sensor data directly from OEM tools. Cimetrix Inc., Salt Lake City, UT; ph 801/256-6500, fax 801/256-6510, e-mail [email protected], www.cimetrix.com.
CMOS platform with AVD
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The Tricent CMOS cluster is a 200/300mm platform for the sub-70nm node and below. It features an atomic vapor deposition (AVD) module for gate dielectrics such as HfSiOx, and a metal AVD module for depositing Ru, TiN, and Ta(Si)N; the technology features multiple pulsed liquid precursor injectors for atomic-scale thickness control at high wafer throughput. A rapid thermal-annealing module ensures flexible pre- and post-deposition interface engineering. AIXTRON AG, Aachen, Germany; ph 49/241-8909-474, fax 49/241-8909-522, e-mail [email protected], www.aixtron.com.
Modular zoom systems
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The Z6 APO 6.3× and Z16 APO 16× zoom systems are reportedly the first apochromatically corrected zoom systems in the market. Both systems deliver ultrasharp, detailed images with color fidelity. The Z6 APO offers 0.117 NA with the 1× planapochromatic objective and 0.234 NA with the 2× objective. The standard configuration of 1× planapochromatic objective and 10× wide-field eyepiece on the Z16 APO allows 115&#times; magnification, and depending on the optics combination, up to 920×. Leica Microsystems AG, Heerbrugg, Switzerland; ph 41/71-726-33-33, fax 41/71-726-33-99, e-mail [email protected], www.leica-microsystems.com.
Ultrahigh-speed ball bonder
The Maxµmplus ultrahigh-speed ball bonder is suitable for all types of ultrafine-pitch applications, including 35µm in-line pitch. The bonder delivers bond placement accuracy of 2.5µm, at speeds up to 10% faster than the Maxµm. An improved servo control system for the x-y table reduces wire cycle times to 63.0 msec, and performance is maintained for bonding areas up to 56 × 66mm. The Maxµmplus offers wire-bonding processes including standard loop, GBA2, worked-loop, J-wire loop, SSB, and others, with a variety of bonding wire. Kulicke & Soffa Industries Inc., Willow Grove, PA; ph 215/784-6000, fax 215/659-7588, e-mail [email protected], www.kns.com.
Contamination control filters
The Fluorogard RS line of filters provide protection from films, gels, and hard-particle contaminants produced by photoresist-stripping and residue-removal applications used in semiconductor manufacturing processes. The filters are designed to last two to three times longer than existing filters for both single-pass applications and recirculation systems. The filters are available in retention ratings 0.05, 0.1, and 0.2µm, and in pre-resist stripping, resist-stripping multimembrane, and resist-stripping thick configurations. Mykrolis Corp., Billerica, MA; ph 978/436-6743, fax 978/436-6724, e-mail [email protected], www.mykrolis.com.
ALD system with chamber clean
The StrataGem300 300mm atomic-layer deposition (ALD) system offers an in situ chamber clean to increase chamber uptime and decrease the time and frequency of chamber wet-cleaning. A new integrated gas system gas box reduces the size and complexity of the gas-delivery system and improves maintainability. An optional TMA auto-refill feature is available, as well as an optional Smart EFEM unit with added particle-control counter measures and safety interlocks. Genus Inc., Sunnyvale, CA; ph 408/747-7120, fax 408/747-7199, e-mail [email protected], www.genus.com.