Product News
02/01/2004
System integrates SEM with automated FIB capability
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The SEMVision G2 FIB defect-analysis system integrates SEM capability with automated focused ion-beam (FIB) cross-sectioning and energy-dispersive x-ray (EDX) analysis technology for high-speed, high-resolution defect review and analysis in one in-line production tool. The closed-loop system has the SEM and FIB in parallel, allowing various advanced imaging technologies, including multiperspective SEM, voltage contrast, high aspect-ratio imaging, and material analysis by EDX. Applied Materials Inc., Santa Clara. CA; ph 408/563-0647, e-mail [email protected], www.appliedmaterials.com.
Die-attach adhesive works for tight-tolerance die-stacking
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The AAA 1000 adhesive is a Teflon (PTFE)-filled nonconductive paste used in applications where a soft, nonabrasive electrical insulator is required. The low-bleed adhesive passes high JEDEC moisture-level testing and 260°C reflow. AAA 1000 bonds to a variety of organic, ceramic, and metal substrates, and is void-free even on moisture-saturated solder mesh in snap-cure mode. It can be cured on the heat indexer of a die bonder or in a snap-cure oven to eliminate unproductive, time-consuming, offline oven-cure processes for multiple die-stack application. Advanced Applied Adhesives, San Diego, CA; ph 858/348-1125, e-mail [email protected].
STI slurry delivers silica-like defectivity
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Celexis slurry for direct shallow-trench isolation (STI) is a high-selectivity, low-defectivity slurry that supplies a one-step replacement for multiple-step reverse mask processes. The slurry features NanoArc Synthesis cerium oxide (ceria) particles from Nanophase Technologies Corp. that are <100nm in size and can be formulated into concentrated dispersions at a variety of pH levels. Celexis provides good planarization and clearing for silica-like defectivity to meet future STI dishing and erosion targets with higher yields. Rodel Inc., Phoenix, AZ; ph 602/470-4418, e-mail [email protected], www.rodel.com.
Defect-detection tools provide single-scan monitoring and detection
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The Surfscan SP1 series of defect-detection tools features new Monitor expert (MX 4.0) software to provide process monitoring information and benchmark defect detection in a single scan with no additional overhead, reducing manual process-monitoring steps. Wafer and IC manufacturers can monitor process characteristics such as surface roughness, porosity, resist- and film-thickness uniformity, CMP pad conditioning and polishing uniformity, and changes in bath chemistry during copper ECD. A new haze-monitoring ability also shows deviations outside of the normal operating window, and brightfield sizing enables Surfscan SP1 systems to consistently quantify large-area and low-profile defects. KLA-Tencor, San Jose, CA; ph 408/875-5473, e-mail [email protected], www.kla-tencor.com.
Defect removal process for low-k structures
The AspectClean CryoKinetic process used in the ANTARES system removes defects from back-end-of-line patterned low-k structures without altering the k value or causing physical damage. The CryoKinetic process is an all-dry, nonreactive process that removes particles through impact by high-velocity cryogenic aerosols, useful for sensitive films and Cu/low-k structures and gate modules. The aerosols are water-free to avoid leaving watermarks. FSI International Inc., Minneapolis, MN; ph 952/448-8066, [email protected], www.fsi-intl.com.
TFT-LCD mask metrology system
The MMS15000 TFT-LCD is a registration measurement system for TFT-LCD photomasks used to verify that the pattern placement among different photomasks matches the high-accuracy demands of advanced displays. The system features measurement accuracy better than 100nm and is capable of performing measurements on photomasks as large as 1300 × 1500mm. Micronic Laser Systems AB, Taby, Sweden; www.micronic.se.
Thermosonic die attach services
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Thermosonic die attach is preferred for thin, brittle dies or those that are intolerant of high heat. This interconnect method is an alternative to solder reflow when used with gold-stud bumping for flip-chip applications; it improves thermal and electrical conductivity with a true metal-to-metal connection. Ultrasonic vibration, heat, and force are applied to the die, forming a metallic bond where the bump comes into contact with the package metallization. Palomar Technologies, Process Development and Prototyping Services, Vista, CA; ph 760/931-3600, [email protected], www.palomartechnologies.com.
Mass spectrometer
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The MiniSIMS is a compact secondary-ion mass spectrometer that provides elemental analysis, species mapping, and depth profiling. The MiniSIMS has three operational modes: static SIMS, scanning SIMS, and dynamic SIMS. The spectrometer may be applied to a variety of samples to produce data on the structure or composition of thin films and electronic devices, and has been used in studies of surface contamination. The MiniSIMS is self-contained with hardware and vacuum system in one package. Micro Photonics Inc., Allentown, PA; ph 610/366-7103, e-mail [email protected], www.microphotonics.com.
Pressure transducers
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The models 546 and 547 strain gauge pressure transducers are optimized for high overpressure applications such as HVAC compressors, robotics applications, and semiconductor processing. The transducers incorporate submersible or general-purpose enclosures. Using thin-film strain technology, the models 546 and 547 have 4–20mA output, 0.1% full-scale accuracy, and choice of absolute, gauge, or sealed gauge data with pressure ranges from 10–10,000psi. The compensated temperature range is from -13 to +167°F. The pressure transducers are CE compliant, and when mated with the immersible electrical connector, these models are ABS certified. Setra Systems Inc., Boxborough, MA; ph 800/257-3872, e-mail [email protected], www.setra.com.
Laser particle counter
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The Anatel Ultrapure-100 laser particle counter helps address contamination control issues in ultrapure water applications relating to precision manufacturing, such as microelectronics, MEMS/MOEMS, and heads for disk drives. The device combines robust optomechanics, counting and communication electronics, and a flow-control system in one instrument, with sensitivity to 0.1µm. In high-pressure applications, the total system flow rate is >1.0L/min, resulting in fast cleanup and recovery times and excellent flow regulation. The counter may be used as a standalone instrument or integrated with existing monitoring systems. Hach Ultra Analytics, Grants Pass, OR; ph 970/663-1377 ext. 2345, [email protected], www.hachultra.com.
Wafer-handling equipment frontend module
The Apex EFEM platform combines a direct-drive wafer-handling robot with SmartServo distributed controls architecture that handles wafers up to 300mm and is configurable with any combination of open cassette, SMIF, and FOUP loadports. The FireWire-based controls architecture allows plug-and-play addition of machine vision, digital and analog I/O, and servo-axis control. It also uses less space, reduces cabling, and improves reliability and cost. Adept Technology Inc., Livermore, CA; ph 925/245-3490, e-mail [email protected], www.adept.com.
Gripper fittings for high-pressure applications
The polypropylene gripper fittings for connecting laboratory tubing offer zero dead volume at pressures ≤1000psi. They can be hand-tightened without a special tool and will not compress or twist tubing if over-tightened. The fittings are available in 10 standard international colors and have slotted heads for easy removal. A built-in lockout prevents the fitting from coming loose. Bio-Chem Valve Inc., Boonton, NJ; ph 973/263-3001.
XVP added to family of SEMs
The EVO family of scanning electron microscopes now includes XVP (extended variable pressure) technology, with the ability to image hydrated, insulating, and outgassing specimens by imaging in either water vapor or air at pressures from 1–750Pa. An enhanced VPSE detector provides true secondary electron imaging for XVP imaging with sensitivities that are comparable to the Everhart Thornley so that operating in XVP mode is reportedly as productive as high-vacuum imaging. LEO Electron Microscopy Inc., Thornwood, NY; ph 914/747-7700 ext 796, e-mail [email protected], www.leo-usa.com.
Multiaxis stage for scanning microscopy
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The P-733.DD piezo stage has a high resonant frequency of 2.3 kHz (400% higher than conventional stages) to allow scanning rates of hundreds of hertz for capturing transient data. The parallel-kinematics layout of the x- and y-axes achieves symmetrical dynamic behavior for improved imaging speed and linearity. The stage also provides <0.3nm resolution. Polytec PI Inc., Auburn, MA; ph 508/832-3456, e-mail [email protected], www.polytecpi.com.
Process-simulation tool for sub-90nm manufacturing
The Taurus Process Atomistic process-simulation tool reportedly offers up to 40% faster and more accurate simulation of nanoscale semiconductor device structures, reducing test silicon runs. The Process Atomistic simulates the diffusion of atoms within a transistor, which determines the transistor's ability to carry electrical current. Simulation times decrease with each process generation at smaller feature sizes, reportedly offering a speed improvement of orders of magnitude over traditional techniques. Synopsys Inc., Mountain View, CA; ph 512/372-7644, e-mail [email protected], www.synopsys.com.
Semiconductor characterization software
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The Model 4200-SCS semiconductor characterization system is available with KTEI v5.0 software with new stress-measure and reliability test capabilities for device lifetime analysis and quality assurance. Running in either Windows NT or XP environments, KTEI 5.0 provides advanced test definition, parameter analysis, graphing, and automation capabilities. The system and/or software can be purchased separately as an upgrade; the total system hardware and software as an upgrade; or a completely new system. Keithley Instruments Inc., Cleveland, OH; ph 888/534-8453, e-mail [email protected], www.keithley.com.
Tantalum sputtering targets
Tantalum sputtering targets are now available for evaluation by semiconductor manufacturers for all leading PVD systems, with volume production expected in 3Q04. Cabot tantalum thin-film materials are available in purities for 3N5 to 5N with low oxygen content; the small grain size and uniform metallurgy offer improved process consistency and can reduce the cost of consumables in PVD processes. A simple recycle path and inventory programs are available for lower cost-of-ownership. Cabot Supermetals, Columbus, OH; ph 614/340-1848, e-mail [email protected], www.cabot-corp.com.
Frame grabber for high-speed analog cameras
The MVS-8501 is a half-slot frame grabber that is PCI 2.31 compliant, and is designed for high-speed analog cameras that use the latest progressive-scan CCD sensor technology. The frame grabber is backward-compatible with standard-speed analog interlaced and progressive-scan cameras to cost-effectively achieve higher performance in machine-vision applications. The device comes equipped with PatMax technology for locating objects despite changes in angle, scale, and appearance. Cognex Corp., Natick, MA; ph 508/650-3140, e-mail [email protected], www.cognex.com.
Correction engine for CD control
The AutoCal dynamic correction engine for advanced photolithography track systems is designed to improve critical dimension (CD) control and extend the life of lithography tools. AutoCal uses BakeTemp SensorWafers to obtain an accurate baseline picture of the process zone. It uploads the data along with an OEM plate-specific thermal model to derive optimized hotplate control system parameters for improved thermal dose uniformity on the wafer. OnWafer Technologies, Pleasant Hill, CA; ph 925/603-1142, e-mail [email protected], www.onwafer.com.