Issue



Conference Preview: Semicon China, Shanghai


02/01/2004







Semicon China will be held March 17–19 at the Shanghai New International Expo Centre in Shanghai. Exhibit hours are Wednesday, March 17, and Thursday, March 18, 9 am to 5 pm; and Friday, March 19, from 9 am to 4 pm.

At last year's Semicon China, more than 765 companies presented their products to more than 15,380 registered visitors. This year, companies from Ablestik to ZMC Technologies Pte Ltd. will be attending, as well as Shanghai and other Chinese city companies and institutes. Companies as well known as Applied Materials and Tokyo Electron Ltd. will be there, as well as some lesser-known, but interesting, entities like the Zhengzhou Research Institute for Abrasives and Grinding and the Shanghai Sanwei Anti-electrostatic Equipment Co. Ltd. See Semi's web site at www.semi.org for the complete exhibitor list.

From March 16–19, Semicon China's 2004 Semi Technology Symposium (STS) will be held in conjunction with the exhibition. Presentations will be original and noncommercial in that they will focus on the technical merits of a process rather than on the individual company's product benefits.

In addition, there will be a one-day flat panel display (FPD) tutorial on March 16 and a half-day FPD manufacturing program on March 19. Possible topics include liquid crystal displays (LCD) such as AMLCD and PMLCD above 5th generation; plasma display panels (PDP), including high-efficiency/low-power PDPs, and equipment, materials, and components; organic light-emitting-diode (OLED) displays, equipment, materials and components; e-ink and e-paper; and passive- and active-matrix OLED displays.

A CMP technology symposium on recent advances in planarization technology for ULSI multilevel interconnection will be held on March 18 at the Riverfront Business Hotel.

Semi was still working out details of these additional symposia at press time.

The exhibition will be co-located at the Expo Centre with electronicaChina and ProductronicaChina, regional fairs for electronic components and assemblies and photonics, as well as for electronics production technologies.

Semi Technology Symposium

As of press time, the exact papers and topics were not yet known, but listed below are the general types of articles you will find presented at the show. See Semi's web site at www.semi.org for the latest information on the technical program.

  • Session I: Lithography
    Possible topics include: developments in EUV lithography and its applications; SCALPEL, PREVAIL, and e-beam inspection; and developments in FIB and immersion lithography.
  • Session II: Materials
    Possible topics include: clean packaging technology; GaAs epitaxy; and materials integration issues.
  • Session III: Advanced processing
    Possible topics include: low-temperature etching mechanism; self-cleaning processes; and CMP processing technology.
  • Session IV: Test technology
    Possible topics include: QA programming in test production; GaAs wafer and ultrahigh-speed circuit test; and failure analysis.
  • Session V: Packaging technology
    Possible topics include: CSP, BGA, MCM, and 3D packaging.
  • Session VI: Manufacturing science
    Possible topics for this session on manufacturing science include: reliability of copper metallization for ULSI applications; upgrading of existing fab lines using SMIF technology; and new developments in yield-management techniques for advanced wafer fab lines.
  • Sessions I to VI: Environmental, health, and safety
    Possible topics include: design for environment; design changes to improve safety and health; and recycling and water use reduction.

Microelectronics Trade Mission

A US government-sponsored Microelectronics Trade Mission will coincide with the Semicon China 2004 exposition. The US Department of Commerce International Trade Administration (DOC/ITA) will host the China trade mission from March 15–19. Semi will support the initiative by providing exhibition space at the show, reports the trade organization's web site, www.semi.org.

"Semi is again pleased to work with the US Department of Commerce in its efforts to promote business cooperation between the high-tech industries in China and the US. This trade mission offers companies the opportunity to explore the rapidly growing Chinese semiconductor market," said Stanley T. Myers, president and CEO of Semi.

The mission, to be led by Michelle O'Neill, the DOC's Deputy Assistant Secretary for Information Technology Industries, will include meetings with authorities at the Zhangjiang High Tech Park in Shanghai and the Jin Qiao Industrial Processing Zone.

Delegates will have the opportunity to visit Shanghai-based foundry Grace Semiconductor Manufacturing Co., as well as the local operations of Advanced Micro Devices, Applied Materials, Intel, Lam Research, and Novellus Systems.

In addition, briefings by representatives of the Chinese government will provide information on trade opportunities and doing business in China.

To join the China Microelectronics Trade Mission or for further information, contact Marlene Ruffin at ph 202/482-0570 or e-mail [email protected].

Exhibition Hours

Wednesday, March 17; 9 am–5 pm
Thursday, March 18; 9 am–5 pm
Friday, March 19; 9 am–4 pm