News from Semicon Japan
02/01/2004
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Signs of recovery abounded at Semicon Japan, held in December. Nearly 1600 exhibitors from 26 countries occupied about 4000 booths, encompassing the entire 11-hall exhibition facility (see photo). Some of the news highlights were:
Philtech supplies x-ray patterned 65nm wafers
X-ray lithography startup Philtech, Tokyo, Japan, now has 11 Japanese semiconductor industry companies and four universities lined up to participate in its Ultra Fine Pattern Technology Research Consortium to develop 65nm technologies based on its exposed wafers. Participants will use resist-processed wafers made with Philtech's 0.8nm proximity x-ray lithography technology in Mitsubishi Electric's laboratories to develop their own interconnect and other processes.
Participants include Tokyo Electron, Shin-Etsu Handotai (SEH), Tohoku U., and Waseda U., according to Japanese press reports.
Hitachi introduces nano imprint tool
Hitachi plans to start selling an automated nanoimprinting tool in 1Q that can produce 70nm lines. Hitachi High Technologies and Hitachi Industries will market the equipment for ~$560,000 (¥60 million), and target sales of ~$28 million (¥3 billion) by 2006.
Sekisui Chemical introduces atmospheric-pressure etching tool
Sekisui Chemical moves its atmospheric-pressure plasma technology into the semiconductor market with an etching tool aimed at replacing wet etching with a faster and more controllable process for removing some surface films. The company produces a stable plasma without a vacuum by switching the power off and on every few microseconds, so its glow source never has a chance to build up to an arc discharge. Sekisui already uses the technology in tools for the display industry, but believes the smaller footprint and higher transfer speed of the nonvacuum approach will have potential in a range of semiconductor applications as well. Japanese press reports say the two-chamber 300mm tool will sell for ~$1.4 million (¥150 million).
Shin-Etsu Polymer adds wafer carrier capacity
Shin-Etsu Polymer plans to invest some $19 million (¥2 billion) to quadruple its capacity to make wafer carriers over the next three years. It will gradually increase capacity from 10,000 to 40,000 polycarbonate 300mm 25-wafer carriers a year. Though the company does have a plant in Indonesia, it intends to keep its advanced 300mm production in Japan, and will increase employment there from 220 to 300.
Ulvac to market platform, introduces tools for 50µm-thick wafers
Ulvac currently manufactures its vacuum platform almost entirely for its own internal use, but aims to sell 50% of the units to outside customers by next year, to bring in an additional $19 million (¥2 billion) or so in revenues. Ulvac is offering six models with prices ranging from $187,000–$374,000 (¥20–¥40 million).
The company also introduced at Semicon Japan a series of etching, sputtering, and ion-implantation tools with robots and cassettes improved to handle wafers as thin as 50µm without damage.
The company most impressed reporters with its live video feed of a screen-printing tool running back at its plant, showing real-time metrology results — much more convincing than just the usual metal boxes on the floor. The featured tool showed the company's 20µm frontend metallization process patterns made with its nanometal particles, with readouts of film thickness.
Fujimi invests in CMP equipment
Fujimi plans to invest some $16 million (¥1.7 billion) in cleanroom facilities and 300mm CMP process and inspection tools for its laboratory by May. The company is a major supplier of rubbing and polishing compounds, but looks for growth in the CMP consumables market. It sold ~$46 million (¥5 billion) worth of CMP materials in 2003.
Sumitomo Corp. to market Ziptronix bonding technology
Sumitomo Corp. will market Ziptronix technology for bonding wafers and glass at room temperature and pressure in Japan. The companies are also considering building their own contract processing plant using the technology, probably in Taiwan, according to Japanese press reports.
Kaijo offers improved wet bench to challenge single-wafer tools
Kaijo claims its new wet bench cleans wafers better, with less damage than single-wafer tools. The tool, to be available in April, flows the cleaning fluid through a gap of several millimeters between the rotating wafer and a unit supplying 2MHz ultrasound. The company says all parts of both sides of the 300mm wafer are cleaned at the same time in about 18 sec, for throughput of 120 wafers/hr. The unit uses only half as much cleaning fluid as previous models, and reportedly removes particles down to 0.09µm. — Paula Doe, Asia correspondent