Product News
01/01/2004
Lithography system offers alternative to spin coating
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The lithography package combines a patent-pending spray coating system with a SupraYield-enabled exposure tool for pattern transfer over severe topography. The large exposure-gap optics expose over high topography without diffraction-related image degradation, thus increasing pattern control over a range of several hundred microns. The spray coater's resist deposition method coats evenly across flat and sloped surfaces, achieving required levels of uniformity for advanced electronics without the surface-tension and fluid-flow problems inherent in spin coating. SÜSS Microtec, Munich, Germany; ph 49/ 89 320 07 237, [email protected], www.suss.com.
Scanner images down to 65nm on 200 and 300mm wafers
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The TWINSCAN XT:1250 is a 0.85NA, 193nm, volume-production lithography scanner that extends imaging to the 65nm node on both 200mm and 300mm wafers. The scanner features Ultra-k1 hardware and software that enables chipmakers to shrink circuit features through improved process latitude, depth of focus, and CD control. The XT:1250's footprint has been reduced by 25% for a more compact support module. A 50% reduction in installation facility requirements such as power consumption; process cooling water; clean, dry air; and exhaust flow also provides a more cost-effective tool for chipmakers. ASML, Veldhoven, the Netherlands; ph 617/638-0022, [email protected], www.asml.com.
Wafer sensor monitors down to room temperature
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The BandiT temperature sensor uses a solid-state spectrometer to analyze the absorption of light scattered from substrates, determine the absorption edge, and relate the edge to the substrate temperature. The sensor can be used with substrates including GaAs, Si, InP, SiC, ZnSe, and ZnTe. Development is underway to handle small-gap substrates such as GaSb. Temperatures are typically monitored from room temperature to 650°C ±0.1°C, allowing the sensor to measure temperatures too low for pyrometers. BandiT can be used for MBE, sputtering, and evaporation applications with single-wafer substrate rotation; it can also be configured to monitor multiple wafers in a platen configuration. k-Space Associates Inc., Ann Arbor, MI; ph 734/668-4644, fax 734/668-4663, [email protected], www.k-space.com.
Wafer-bow metrology tool is automated for high throughput
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The ultra-WB wafer-bow/stress metrology tool combines with the Vanguard automation platform to help manufacturers improve 300mm wafer yield. The tool measures stress-related curvature with multiple parallel laser beams, then measures the relative spacing of the reflected beams to monitor defects that may occur during film deposition. The system is less sensitive to vibration than beam-deflection and height-measurement techniques. Options for the tool include FOUP loaders and Semi-compliant automation software for integration with fab automation systems. The ultra-WB is also available on the 200mm Vanguard platform. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, fax 973/691-4863, [email protected], www.rudolphtech.com.
Automated test equipment designed for SoCs
The T2000 series of automated test equipment is based on the OPENSTAR platform, and specifically designed to test systems-on-chip is embedded in electronics products. The open, interoperable architecture is adaptable as a result of its flexible test functions and interchangeable modules. The first system in the series performs high-speed microprocessor tests with high-current device power supplies, and optimizes test cost with pin/board slice architecture. Advantest America Inc., Santa Clara, CA; ph 408/844-7805, [email protected], www.advantest.com.
X-ray inspection system with intensity control
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The TIGER (FXS-160.40) x-ray system offers true x-ray intensity (TXI) control to provide immediate and steady intensity, long-term stability, and constant image contrast and brightness for recurring inspections. The system offers geometric magnification up to 636× and a sample tray area 24 × 24 in. (610 × 610mm) to accommodate larger boards and multi-up flip-chip assemblies. The system's proprietary open-tube x-ray technology allows feature recognition <1µm. FEINFOCUS, Stamford, CT; ph 978/794-5441, [email protected], www.feinfocus.com.
Deposition/etch system for volume production
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The VERSALINE deposition and etching system is streamlined and optimized to offer a low cost-of-ownership for single-process module applications with cassette-to-cassette loading. The process modules for up to 200mm wafers are built to ensure compatibility with the central handling unit, simplifying system configuration. The system can be equipped with a large-area PECVD deposition module, or ICP, PHF, RIE, or high-performance oxide etch modules. Unaxis Semiconductors, St. Petersburg, FL; ph 423/388-4515, [email protected], www.semiconductors.unaxis.com.
Probe station for MEMS applications
The VACP200 (programmable) and VACM200 (motorized) analytical probe stations address MEMS probing applications in a dust-free, moisture-free vacuum environment or a special inert atmosphere. The DUT chamber pumps close to 1 × 10-6 torr vacuum in <5 min from chamber closing. Thermal chuck systems and custom mounting fixtures are options, as are special gas purge input controls. Micromanipulator, Carson City, NV; ph 775/882-2400, [email protected], www.micromanipulator.com.
Vision sensor software
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In-Sight Explorer software, designed for use with the In-Sight series of vision sensors, addresses all aspects of vision sensor implementation in a single, user-friendly package. Explorer detects new sensors on the network ..and includes step-by-step wizards to aid in adding sensors. Shortcuts, image zooming and panning, context-sensitive help, and the look and feel of standard Windows-based applications speed user interface creation. Cognex Corp., Natick, MA; ph 508/650-3140, [email protected], www.cognex.com.
Piping system and fusion machine
The SYGEF Plus Piping system and IR 315 Plus fusion machine for ultrapure water applications has a larger piping system that allows customers to install fewer lines to achieve results that previously required two lines. Customers can now install a single 250mm (10 in.) or 315mm (12 in.) pipe instead of two 225mm (9 in.) pipes, reducing overall installation costs. The system is available in SYGEF PVDF (polyvinylidene fluoride) pipe, valves and fittings in sizes 250mm (10 in.), 280mm (11") and 315mm (12"). SYGEF PVDF pipes are strong, lightweight, abrasion-resistant, and have a wide operating temperature range. George Fischer Inc., Tustin, CA, ph 714/731-8800; www.us.piping.georgefischer.com.
Autofocus distance measuring device
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The LaserTrac distance measuring device provides real-time autofocus of microscope systems used for inspection of wafers, microvia ..plates, and other substrates. LaserTrac focuses a laser light source into the optical path, monitors the reflected beam to disseminate above or below focus conditions, and generates an error signal to keep continuous focus even during movement of the object. The device is proven for objectives ranging from 5–10×. Axsys Technologies Inc., Rochester Hills, MI; ph 949/443-9300, [email protected], www.axsys.com.