Product News
11/01/2005
Brightfield inspection is enhanced with ultrabroadband imaging
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The 2800 Series, a brightfield wafer-inspection platform, reportedly provides the industry’s only ultrabroadband (DUV, UV, and visible) wavelength inspection at 2× the throughput of previous-generation DUV brightfield imaging tools. The system covers a variety of materials and defect types for multiple nodes, and employs a third-generation DUV source with UV and visible light to provide selectable wavelengths from 260 to 450nm. Technology first seen in military satellite systems has been adapted to create proprietary broadband solid-state time-delay integration (TDI) sensors that enable optimum materials contrast and noise suppression. KLA-Tencor, San Jose, CA; ph 408/875-5473, e-mail [email protected], www.kla-tencor.com.
Optical CD and thin-film metrology combine in one tool
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The ultra-II CD combines optical critical-dimension and thin-film metrology in one tool, offering low cost-of-ownership, reduced transport delays, and rapid notification of yield excursions for deposition, lithography, and etch processes. The tool uses Simultaneous Multi-angle Laser (SiMuLASE) scatterometry, a measurement technique based on patented focused beam ellipsometry (FBE) technology, providing high-speed, nondestructive CD metrology, as well as thickness and optical property measurements for transparent films, with high accuracy, repeatability, and tool-to-tool matching. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, e-mail [email protected], www.rudolphtech.com.
Modular inspection system pushes to the edge
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The Reflex AF series of modular, automated defect inspection systems detects particles, scratches, and microroughness (haze) on unpatterned wafer surfaces, including edges (edge exclusion = 2mm), and also provides sorting functions. Up to four modules from the Reflex inspection series for frontside, backside (BSI), and combined edge and backside (EBI) inspection can be attached to a 300mm platform. Defect sensitivities of up to 90nm on the frontside module, 200nm on the BSI module, and 200nm for the backside and 5µm for the edge inspection component can be achieved, at rates of up to 80wph. NanoPhotonics AG, Mainz, Germany; ph 49/6131-9585-40, e-mail [email protected], www.nanophotonics.de.
DRIE system etches at rates >25µm/min
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The Pegasus deep reactive-ion etch system features a modular design for reduced footprint, and is compatible with any of STS’ modular single-wafer loadlock or full-production cluster systems. It achieves etch rates >25µm/min with a high-uniformity, high-density decoupled plasma source, which reportedly has increased etch rates by 30% over competing systems and mask selectivity by 35% or more. Patented parameter ramping controls process parameters and etch profile at high aspect ratios. The etcher’s capabilities are suitable for systems-in-a-package, incorporating MEMS, optoelectronics, and biochips. Surface Technology Systems plc, Newport, Wales; ph 44/163-365-2400, e-mail [email protected], www.stsytems.com.
Inkjet materials printing system
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The cartridge-based Dimatix Materials Printing (DMP) system provides high-precision jetting of fluids such as nanoparticle-based metallic and organic materials on surfaces including plastic, metal sheets, silicon, and paper. The printing system can be used for low-volume manufacturing of flexible circuits, RFID stages, displays, and wearable electronics. The system consists of the DMP-2800 series printer, DMC-11610 cartridges that can be filled with any jettable fluid, and PC-based software, and it can deposit 10pL microdroplets of fluid to print features or linewidths as small as 50μm. Dimatix, Santa Clara, CA; ph 408/565-9150, e-mail [email protected], www.dimatix.com.
X-ray detectors for metrology system
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New solid-state silicon-lithium detectors provide high resolution and a high degree of sensitivity, and extend the energy range for measurements of heavier elements (up to 29keV) on the Microbeam XRF, which combines nondestructive energy-dispersive x-ray fluorescence (EDXRF) spectroscopy with focusing optics for thin metallic-film metrology. A Vacuum ConduitT option exerts vacuum conditions on the x-ray beam generation and detection paths, leaving the sample environment in atmosphere. Thermo Electron Corp., Madison, WI; ph 800/532-4752, e-mail [email protected], www.thermo.com/spectroscopy.
XRR/XRF metrology tool
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The BedeMetrix-F x-ray metrology tool offers combined x-ray reflectivity (XRR) and x-ray fluorescence (XRF) for inline, nondestructive, high-speed film-thickness measurements on patterned wafers. Small-spot x-ray optics measure test pads and inscribe lines down to 100µm for XRR and 30µm for XRF. Without a lower thickness limit, the tool reportedly can be extended to meet future ITRS requirements for most critical technologies. Bede plc, Durham, England; ph 44/191-332-4700, e-mail [email protected], www.bede.com.
ALD system
The Iris dielectric atomic-layer deposition (ALD) system provides high-k and metal film deposition for capacitor and gate dielectrics with sequential remote plasma-anneal capability with the addition of the Iris plasma anneal process module. With single-wafer plasma processing, low-temperature deposition is achieved for gate electrodes and back-end-of-the-line applications, as well as those using polymeric substrates. Vesta Technology Inc., San Jose, CA; ph 800/358-7509, e-mail [email protected], www.vestatechnology.com.
Multimodule wet processor
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The SSEC 3308 single-wafer wet processor achieves wafer throughputs of up to 180wph in a small footprint. Eight process modules may be arranged in any combination of double-sided clean, wet-etch, or strip-processing configurations. Wafers can be handled cassette-to-cassette or in 300mm FOUPs or 200mm SMIF pods. The system is sealed to Class 1 cleanroom specifications, meets all Semi S2-0200 safety and S-8 ergonomic standards, and is CE-marked and ETL-listed. Solid State Equipment Corp., Horsham, PA; ph 215/328-0700, e-mail [email protected], www.ssecusa.com.
Calibration software for WLT
SussCal 6 high-frequency calibration software provides fully automated multiport calibration for wafer-level test (WLT) systems. The software controls the multiport vector network analyzer (from any major manufacturer), the automatic or semiautomatic probe station, and the probe manipulators from a Windows-based PC. It automatically compensates for θ and z variations between the DUT and calibration substrates, operating with up to three independent alignment sets for x, y, z, and θ. Süss MicroTec, Munich, Germany; ph 49/352-4073-349, e-mail [email protected], www.suss.com.
Dielectric materials
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ST 100 is an inorganic spin-on oxide for front-end-of-line applications such as shallow-trench isolation and premetal dielectric that allows void-free fill of extremely narrow gaps with aspect ratios up to 13:1, and shows high wet-etch resistance and maintained integrity at temperatures ≥1000°C. SX 800 is an organosiloxane dielectric used in both BEOL and FEOL applications, with a Young’s Modulus of 10.5GPa, cracking threshold of 2μm, and thermal stability >600°C. Silecs Inc., Mountain View, CA; ph 408/549-9882, e-mail [email protected], www.silecs.com.
Matching network for process control
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Equipped with microprocessor-controlled stepper motor circuitry and digital, user-selectable tuning algorithms, the Navigator matching network for radio-frequency generators minimizes reflected power by automatically tuning the complex impedance of a coupled plasma. The network helps to tighten process control with real-time power and impedance measurement and analysis in oxide, poly, and metal etch, and PECVD, HDCVD, and PVD applications. Advanced Energy Industries Inc., Fort Collins, CO; ph 897/407-6280, e-mail [email protected], www.advanced-energy.com.
Device characterization system
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The Model 4200-SCS semiconductor characterization system offers the PIV (Pulse I-V) package option for work with high-k materials, thermally sensitive devices, and advanced memory chips. The SCS performs laboratory-grade DC device characterization, real-time plotting, and analysis with high-precision subfemtoamp resolution. The PIV can generate a pulse as short as 10 nsec, allowing true isothermal pulse measurement of 65nm and below devices and processes. Keithley Instruments Inc., Cleveland, OH; ph 800/688-9951, e-mail [email protected], www.keithley.com.
Miniature interferometer
SP-D Series miniature double-plane mirror interferometers are incorporated into customer systems for simultaneous pairs of nanoprecision length measurements. The frequency-stabilized He-Ne lasers and fiberoptic-coupled sensor heads allow precision measurements on plane tables, positioning systems, and microscope stages, and can be used for deformation studies, noncontact surface profiling, and materials testing. Piezosystem Jena Inc., Hopedale, MA; ph 508/634-6688, e-mail [email protected], www.piezojena.com.
Memory test system
The T5587 memory tester offers a comprehensive, high-throughput solution for DDR-SDRAM, NOR, and NAND flash memory test. It offers a maximum test speed of 200MHz (400Mbps in DDR mode), which supports multichip packages (MCP), enabling incorporation of newer, faster types of flash memory such as DDR-SDRAM and NOR. The two-station configuration enables a maximum parallel-test capacity of 512 devices. Advantest Corp., Tokyo, Japan; ph 212/850-6670, e-mail [email protected], www.advantest.com.