Product News
10/01/2005
300mm tool integrates PVD and ion-induced ALD
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The Inova NeXT 300mm metallization system for copper/barrier seed applications is intended to extend beyond the 45nm node. The tool is capable of both physical-vapor deposition (PVD) with its single-target hollow cathode magnetron technology, and ion-induced atomic-layer deposition, laying tantalum nitride as a highly conformal and ultrathin barrier film. iALD can be used to deposit other metals as well, such as ruthenium and copper. Enhancements to the previous-generation platform featured on this system include lower overhang on the Cu seed layer, increased sidewall coverage, and improved barrier nonuniformity and sidewall asymmetry in filling 45nm structures. Novellus Systems Inc., San Jose, CA; ph 408/943-9700, e-mail [email protected], www.novellus.com.
3D probe evaporates atoms to analyze samples at atomic scale
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The advanced laser three-dimensional atom probe (3DAP) provides atomic-scale analysis of semiconductor structures by evaporating individual atoms from materials samples in an ultrahigh-vacuum chamber at cryogenic temperatures (<100K), measuring their mass, and providing position based on time-of-flight and spatial location. The analysis software then constructs a 3D model of the sample, which can provide information on dopant concentrations and profiles, thin-film thickness and uniformity, chemical composition and homogeneity, and more. A delay-line detector achieves a timing resolution of 1 nsec for high detection efficiency. Oxford NanoScience Ltd., Milton Keynes, England; ph 44/1908-5632-67, e-mail [email protected], www.oxfordnanoscience.com.
Scalable light source enables 45nm immersion lithography
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The XLA 300 is a 193nm, 6kHz argon fluoride light source for volume production in 45nm immersion lithography applications. With master oscillator power amplifier (MOPA) technology, the resulting high repetition rate and tight bandwidth (≤0.12pm FWHM, ≤>0.25pm E95) allow exposure of most critical features and optimize catadioptric lens designs to support high numerical apertures >1.3. A wider process window and capability for resolution enhancement techniques enable the use of high-dose resists without reducing throughput. On-board E95 metrology combines with advanced spectral control for processes and optical proximity effects. Cymer Inc., San Diego, CA; ph 858/385-6327, e-mail [email protected], www.cymer.com.
Darkfield tool inspects defects for 45nm development and 65nm production
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The WaferXam system is an advanced darkfield laser-scanning system for inspecting silicon substrates at semiconductor incoming quality control and silicon wafer suppliers. Intended to serve the 45nm process-development market and exceeding the requirements for 65nm wafer production, the flexible platform offers a high-sensitivity mode with 33nm defect detection and production throughputs >50wph (300mm). The system also features noncontaminating edge-grip handling and full factory automation for advanced 300mm and 200mm wafer production. WaferXam tools integrate seamlessly with the FabVision fab-wide data management and yield improvement system. ADE Corp., Westwood, MA; ph 360/254-5454, e-mail [email protected], www.ade.com.
XPS metrology tool
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The Theta 300XT tool maps thickness and elemental and chemical uniformity, provides nondestructive depth profiles, and determines interface chemistry for 200mm and 300mm production wafers. X-ray photoelectron spectroscopy (XPS) techniques allow in-depth analysis of novel materials and ultrathin structures in an automated, fully integrated, dual-loadport design. Thermo Electron Corp., Waltham, MA; ph 781/622-1111, e-mail [email protected], www.thermo.com/surfaceanalysis.
Vacuum cure system
The PBX-300 series high-temperature vacuum cure systems are air-cooled, particle-free, and can offer high vacuum up to 10-7torr. Two configurations are available with either two or four 300mm loadports and one or two oven modules. A 200mm wafer processing option includes 200mm stainless-steel cassettes, adapter plates, and a 200mm end effector for the wafer-handling robot. Yield Engineering Systems Inc., San Jose, CA; ph 408/954-8353, e-mail [email protected], www.yieldengineering.com.
Dispensing system
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The XyflexPro+ dispensing system uses a “total system accuracy” specification for precise placement on a substrate relative to a target, and reportedly incorporates faster point-to-point movement and virtually eliminates z-axis travel time, compared to other systems. The gross dot placement rate has increased to 45,000dph, and pipeline conveyor mode reduces transfer time by up to 40%. The system is available in standalone or in-line versions, with single or dual heads. Speedline Technologies, Franklin, MA; ph 508/520-0083, e-mail [email protected], www.speedlinetech.com.
Miniaturization platform
ShellUltraThin (ShellUT) is a next-generation platform for optical devices that provides a true die-sized package for savings in board space and assembly costs. Based on wafer-level chip size packaging, the platform uses a glass-silicon structure with a cavity between the image area and the glass to enable image sensing through the packaging structure using microlenses. ShellUT is designed for manufacturers of CMOS and CCD area-array and linear sensors, photodiodes, RF-MEMS, and other devices. Shellcase Ltd., Jerusalem, Israel; ph 972/2-679-8890 ext. 204, e-mail [email protected], www.shellcase.com.
Optical inspection system
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The AL Series optical inspection and defect review system inspects wafer edge and bevel areas, allowing the user to see the top, side, and bottom of the wafer from multiple angles with continuous angle adjustment. Proprietary Universal Infinity Systems infinity-corrected optics and 248nm Deep-UV Air Gap optics provide visible light imaging to 80nm resolution. Magnification and imaging techniques include brightfield, darkfield, Nomarski DIC, confocal, and high-resolution DUV and DUV confocal. Olympus Integrated Technologies America Inc., San Jose, CA; ph 408/514-3918, e-mail [email protected], www.olympus-ita.com.
Film calibration standards
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PSI Standards are thin-film calibration standards for ISO compliance, tool monitoring, and standardization. 150mm, 200mm, and 300mm NIST-traceable silicon dioxide and silicon nitride standards are available, and are manufactured from thermally grown silicon dioxide or LPCVD silicon nitride on prime p-type <100> silicon wafers, in a sub-Class 10 fab. Process Specialties Inc., Tracy, CA; ph 209/832-1344, e-mail [email protected], www.psi-standards.com.
MEMS design software
MEMS Pro version 5.1 is a flexible CAD tool suite for designing and analyzing microelectromechanical systems (MEMS). The updated software offers more output formats for 3D geometries, improved automatic meshing, automatic translation of curvilinear shapes, and enhanced libraries for system-level models. The suite covers design of associated electronics and packaging as well. SoftMEMS, Los Gatos, CA; ph 408/426-4301, e-mail [email protected], www.softmems.com.
Compositional metrology option
zMAX is an elemental depth distribution technology, now available on the RVX 1000 compositional metrology system for 65nm and 45nm process development and manufacturing. With this tool, users are able to control variations inside a film from top to bottom as well as across it. The technology is suited to gate oxidation processes, with the potential to extend more mature SiON processes beyond the 65nm node. ReVera Inc., Sunnyvale, CA; ph 408/530-3600, e-mail [email protected], www.revera.com.