Attendees choose ‘best-in-show’ products
09/01/2005
Solid State Technology invited Semicon West attendees to vote on the best products they saw at the July trade show in San Francisco’s Moscone Center. Three categories of awards were given for both the Wafer Processing Products and the Final Manufacturing Products. See www.solid-state.com’s September issue coverage for more details.
Wafer Processing Winners
Most innovative: Applied Materials Inc. Etch Products Business Group’s Centura AdvantEdge etch system with DPS II AdvantEdge chamber technology for advanced logic gate, STI, and capacitor etch offers a large process window. Its tunability enables process-by-process, step-to-step regulation for optimizing etch rate and CD bias nonuniformities to the outer limits of the wafer. Applied Materials, www.appliedmaterials.com.
Best solution to a problem: SEZ Group’s Da Vinci Series single-wafer processing tools were developed to address new cleaning requirements for back-end-of-line polymer cleaning and backside etch and clean, as well as for processing emerging applications on 200mm and 300mm wafers at the 90nm and below technology nodes. SEZ Group, www.sez.com.
Best cost-of-ownership: Pall Corp.’s Ultipleat ME etch process filter reportedly increases flow rates nearly 50% over conventional filters to improve performance, productivity, and yield in high-volume semiconductor etch processing. The filter provides high flow rates for hydrofluoric acid and buffered-oxide etch recirculation bath processes, with a patented technology that filters impurities down to 50nm. Pall Corp., www.pall.com.
Final Manufacturing Winners
Most innovative product: Newport Corp.’s MRSI-M5 assembly cell provides advanced assembly solutions for complex epoxy die attach and eutectic and flip-chip bonding in the semiconductor and electronic packaging markets. “Feather touch” force control combined with closed-loop force feedback handles delicate devices without damage to internal die features. Newport Corp., www.newport.com.
Best solution to a problem: Micro Control Co.’s HPB-5B burn-in system is designed to meet the challenges created by burn-in-with-test of both high-power VLSI devices (up to 150W) and memory devices. It features individual pattern and temperature zones per burn-in board, allowing device types to be mixed within the oven, for up to 48 devices per board. Micro Control Co., www.microcontrol.com.
Best cost-of-ownership: Ultrasonic Systems Inc.’s Prism Ultra-Coat spray system delivers precise coating of fluxes, photoresists, and conductive inks onto any substrate, using ultrasonic technology with a titanium spray head and a digitally controlled liquid-delivery system. The system can handle substrates up to 450×450mm in batch-mode or conveyor configurations. Ultrasonic Systems Inc., www.ultraspray.com.