Product News
08/01/2005
Overlay metrology solution exceeds 45nm node requirements
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Archer AIM+ reportedly reduces total measurement uncertainty (TMU) by 50%, compared to the previous generation, and increases tool throughput to up to 180wph. New optics and improved illumination reduce TMU to within 2.1nm - exceeding 45nm-node overlay-control requirements outlined in the 2004 ITRS. New software algorithms have also been added to enable high-precision measurements on low contrast and post-CMP layers. A faster and more advanced computer, a new wafer handler, and optimized algorithms also reduce move-acquired-measure time by 20%. KLA-Tencor, San Jose, CA; ph 408/875-5473, e-mail [email protected], www-kla-tencor.com.
Defect review tool achieves 3nm resolution for 65nm processes
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The JWS-3000 automatic defect review (ADR) tool, designed for 300mm wafer inspection, features a conical lens that achieves 3nm resolution for high-precision review of microdefects in 65nm design-rule processes. The system can examine 300-400 defects/hr (dph) in this high-sensitivity mode, or 600-750dph in high-speed mode for 90nm design-rule processes. Inspection of the entire patterned wafer surface, bare wafer inspection, and edge inspection at tilt angles up to 45° are possible with a magnification range of 100-500,000×. JEOL USA Inc., Peabody, MA; ph 978/535-5900, www.jeolusa.com.
RF wafer probe performs multiport testing up to 10GHz
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The Multi IZI Probe is reportedly the only radio-frequency (RF) wafer probe offering up to eight independent RF transmission lines with 50Ω impedance. It can be individually configured with RF and DC contacts for mixed-mode component testing using one probe. For full flexibility, other electrical components and even ICs can be placed directly on the probe. The Multi IZI is made with long contact springs that move independently from one another for a highly reliable, flexible, and accurate solution for RF multiport testing up to 10GHz. Süss MicroTec Inc., Munich, Germany; ph 49/352-4073-349, e-mail [email protected], www.suss.com.
Instrument combo measures and controls nanoscale particles
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Together, a plug-in finger probe (1520) and flow-through cell (1551) can control CMP blending concentration, measure concentration of PVDF coatings, and treat and segregate wastewater. Results for commonly applied materials such as silica, tungsten, tantalum, and ceria slurries exhibit highly resolved concentration measurements. The low-maintenance instruments are user-friendly. Measurement data can be exported via standard interface to external programs. A freely programmable output permits direct process control by the sensor probe. Aello, Dresden, Germany; ph 49/351-202-880, e-mail [email protected], www.aello.biz.
Thin-film metrology tools
The F80 line of stand-alone and integrated thin-film metrology tools is based on spectral imaging technology that generates large arrays of reflectance spectra at each measurement location. With this thickness-based approach, the tools are immune to the image-contrast inversion problems that conventional metrology tools frequently experience in CMP applications. Measurement pad locations can be determined with software, rather than with high-precision stages. Options include 1D and 2D high-resolution thickness mapping, which is useful for CMP test-wafer profiling, and refractive-index measurement capability. Filmetrics Inc., San Diego, CA; ph 858/573-9300, e-mail [email protected], www.filmetrics.com.
Ion source
The Nexus 420 ion source is designed to maximize the performance of Nexus ion-beam etch systems for next-generation thin-film magnetic head (TFMH) production. The ion source provides a wider dynamic energy range and a two- to three-fold improvement in 3D uniformity, resulting in improved control of the etch process. It reduces the effect of grid variations for maximum process performance and throughput improvement at low energies. In addition to high uniformity and run-to-run repeatability, it features a wide energy range (100-1500eV). Veeco Instruments Inc., Woodbury, NY; ph 516-677-0200 ext. 1472, e-mail [email protected], www.veeco.com.
Field-emission SEMs
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The Supra 40 series of ultrahigh-resolution field-emission scanning electron microscopes (FESEM), which replaces the previous Supra 35 and Supra 50 FESEM models, is based on the latest version of the Gemini FESEM column that delivers nanoscale imaging over the entire voltage range without the need for adjustments. The series comprises three models: the Supra 40 for standard ultrahigh-resolution applications; the Supra 40VP variable pressure model for real topography imaging of nonconducting specimens; and the Supra 40WDS nanoanalytical tool with a dedicated specimen chamber to accommodate fully focusing wavelength-dispersive and energy-dispersive spectrometers. The SEMs reportedly show a 20% increase in resolution both for high- and low-voltage applications. Carl Zeiss SMT AG, Oberkochen, Germany; ph 49/7364-20-3836, e-mail [email protected], www.smt.zeiss.com/nts.
Curvature sensor
The EpiCurve curvature sensor is for production-line MOCVD systems. It performs measurements for wafer curvature, emissivity-corrected wafer temperature, and double-wavelength reflectance. Combined with the EpiTT sensor for true-temperature and growth-rate measurements, this compact sensor also allows real-time measurements of wafer bowing in single- and multiwafer reactors. It can be applied even for transparent and low-reflectance substrates. LayTec,Berlin, Germany; ph 49/303-9800-800, e-mail [email protected], www.laytec.de.
ArF excimer laser
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The GT40A argon fluoride (ArF) excimer laser has 193nm emission wavelength and 4kHz repetition rate. It features an injection-locking resonator for use as a mass-production lithography light source for 65nm and below technology nodes, which ensures highly stable emission of a deep-ultraviolet beam with high output of 45W and a spectral bandwidth of 0.2pm for full-width half maximum (FWHM) and 0.5pm for E95. The system configuration has been refined to reduce both the number of consumables (modules) and replacement frequency. Gigaphoton Inc., Oyama, Japan; ph 81/285-28-8410, e-mail [email protected], www.gigaphoton.com.
Storage and delivery system
The third-generation safe delivery source SDS 3 - a subatmospheric storage and delivery system - uses ATMI’s monolithic carbon adsorbent and is able to store and deliver 2-3× as much ion-implant dopant gas as the second-generation SDS2 in the same footprint. All cylinders are leak-tested with a patented chamber test procedure to 1×10-8atm-cc/sec. This is reportedly ~1000× lower than typical industry standards. The SDS3 is available in JY-size cylinders for arsine, phosphine, and enriched boron trifluoride gas species. Matheson Tri-Gas Inc., Parsippany, NJ; ph 408/971-6500 ext. 264, e-mail [email protected],www.matheson-trigas.com.
Chemical metrology platform
The Sentry inline chemical metrology platform features proprietary inline mass spectrometry (ILMS) technology, and is incorporated into two products: the chemical-composition metrology (CCM) and trace-contamination metrology (TCM) systems. The CCM deploys ILMS to manage problems in copper ECD processes, such as bath mismanagement, fill reproducibility issues, mounding and overburden problems, and wafer-to-wafer consistency. The TCM uses ILMS to identify and quantify metallics and organic contamination to prevent potential yield-killing contamination issues, and can measure 8 samples/hr at parts-per-trillion levels. Metara Inc., Sunnyvale, CA; ph 408/331-5222, e-mail [email protected], www.metarainc.com.
Silicon carbide
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PureBeta ultrahigh-purity sintered-body silicon carbide (SiC) is suitable for semiconductor applications. The total metal content is <1ppm. Some of the major applications are dummy wafers, susceptors, electrodes, rings and heater elements for CVD, etching, ion implantation, annealing, and more. Bridgestone Corp., Tokyo, Japan; ph 81/42-342-6486, www.purebeta.com.