ConFab speakers debate the new economics of chipmaking
08/01/2005
ConFab speakers debate the new economics of chipmaking
The ConFab — sponsored by Solid State Technology and our parent company, PennWell — brought together the leading semiconductor manufacturing executives for three days of dialogue and collaboration this past May in Las Vegas. For those unable to attend, we have prepared this Special Online Staff Report, which summarizes the key presentations and discussions that explored the most challenging economic issues facing the industry today.
All of the articles in this report were written by J. Robert Lineback, senior technical editor of Solid State Technology, except where otherwise noted.
ECONOMICS
 Dan Hutcheson |
- Analyst Dan Hutcheson cautions that a crisis looms if R&D spending growth continues to outpace IC sales.
- Will economics derail 450mm and industry progress?
- Systematic defect growth requires new DFM approach.
Download a .pdf of this article here
LITHOGRAPHY
 Geoff Wild |
- Nikon Precision’s Geoff Wild argues that lithography is not to blame for high fab costs.
Download a .pdf of this article here
NEXT-GENERATION TECHNOLOGY
 George Gomba |
- IBM’s George Gomba contends that global collaboration is needed for NGL.
By Robert Haavind, editorial director
- ASML sees EUV essential beyond 32 nm.
Download a .pdf of this article here
YIELD MANAGEMENT
 John Schmitz |
- SEMATECH’s John Schmitz cautions that yield management must become part of the design process to reduce rising costs.
Download a .pdf of this article here
INTEGRATED METROLOGY
 John Heaton |
- Nanometrics’ John Heaton claims that lithography processes are the next key target for integrated measurements
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FAB AUTOMATION/APC
 Thomas Sonderman |
- Late-stage R&D and transistor “tuning” in fabs is key to boosting yields.
- Cross-discipline automation greatly increases optimized fab-wide control. By Thomas Sonderman.
Download a .pdf of this article here
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