Product News
05/01/2005
Strip process removes nickel and platinum without residues
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The PlatNiStrip, designed to help implement salicide formation at the 65nm technology node, can be implemented with industry-standard chemicals on a standard Zeta spray cleaning system. Nickel silicide for salicide formation may not have sufficient thermal stability to withstand the temperatures of full integration in all cases. Adding ~5% platinum can significantly increase the thermal stability of the resulting silicide film. However, traditional approaches to stripping Ni are not effective in stripping platinum, resulting in a platinum residue on the wafer. The PlatNiStrip’s point-of-use blended acid solution can strip both nickel and platinum without residues and with high selectivity to silicide, oxide, and nitride, enabling the integration of nickel-platinum silicide film. Coupled with the spray system’s chemical mixing and delivery technology, the process offers consistent etch rates and selectivity for stable and reliable process performance. FSI International Inc., Chaska, MN; ph 952/448-8066, e-mail [email protected], www.fsi-intl.com.
System performs over wide thermal range for multiple packaging apps
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OMIStrain ETR metrology system for IC and MEMS packaging enables package designers to screen out potential reliability issues during the development phase. The thermal-deformation metrology system specifically measures inplane deformation and warpage of IC and MEMS packages. It operates over the -65°C to +350°C temperature range. The extended range allows measurements to be made at the higher reflow temperatures required by lead-free packaging as well as subzero temperature measurements for other markets such as automotive and military. The extended temperature operation combined with the measurement resolution of 20nm enables accurate strain measurements for first-level C4 interconnect up to lead-free temperatures. Optical Metrology Innovations Ltd., Cork, Ireland; ph 35/32-14-34-6707, e-mail [email protected], www.optical-metrology.com.
Data analysis system stores and retrieves for real-time yield loss prevention
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The FabVision is a fab-wide data system for yield and quality management that allows offline, off-tool process control analysis for improved wafer yields. It incorporates a fully integrated server, workstation, and software package that collect, analyze, store, and retrieve critical metrology and inspection data from a wide range of production tools, including surface topography mappers, sorting systems, and particle inspection products. The system continously monitors, reports, issue alerts, and manages product quality information in a real-time environment. It also collects and combines data to automatically send reports worldwide to manage operations at the fab, process, or customer level without interfering with the normal production flow. ADE Corp., Westwood, MA; ph 781/467-3867, e-mail [email protected], www.ade.com.
Model-based tool verifies full chip
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The Tachyon RDI 1100 [resolution enhancement techniques (RET) design inspection] is a model-based, full-chip verification tool for post-RET design verification. The first product built on the Tachyon platform, a hardware-accelerated, image-based data and simulation engine, performs lithography modeling and database handling tasks. Unlike conventional edge-based sampling methods, Tachyon simulates and inspects the entire chip area with an image-based approach. Ultrafast throughput reportedly can be seen with full-chip RET/OPC verification in 60 min, accelerating time-to-market for chip manufacturers. To deliver accurate simulation, 128 calculation kernels are used in the optical image modeling. Brion Technologies Inc., Santa Clara, CA; ph 408/653-4304, e-mail [email protected], www.brion.com.
Probing system
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The X series Nanoprober combines PicoCurrent imaging capabilities with the high-performance Multiscan atomic force probe (AFP) for 45nm, 65nm, 90nm, and larger process-technology measurements. The Nanoprober consists of three major components: a precision, low-noise probing platform; up to four AFP heads; and an environmental enclosure and workstation. The sharp probes, nanopositioning using piezoelectrics, and force feedback provide a nanometer-resolution map of surface structures and the ability to place the probes on the desired nodes quickly with controlled contact force. Multiprobe, Santa Barbara, CA; ph 805/560-0404, e-mail [email protected], www.multiprobe.com.
Coating analyzer
An add-on software module brings the capability to characterize diamond-like coatings on perpendicular recording media to the 1500-D analyzer. The software package enables the user to effectively characterize complex magnetic media that allow higher recording densities. The 1500-D uses only one model, the Forouhi-Bloomer Model, to simultaneously determine n and k spectra and thickness. The end user can characterize unknown films with the software and add them to the system’s library, and can develop new recipes for materials that cannot be analyzed by the existing library. n&k Technology, Santa Clara, CA; ph 408/850-7315, e-mail [email protected], www.nandk.com.
NIL system
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The Imprio 250 nanoimprint lithography (NIL) system offers sub-50nm half-pitch resolution, sub-10nm alignment, and integrated magnification control for patterning features <100nm. The tool is built to industry standards around a core platform using step-and-flash imprint lithography technology. It includes fully automated wafer handling (up to 300mm) and automated template loading capability. An in-liquid alignment and magnification control system offers precision overlay for advanced applications. Molecular Imprints Inc., Austin, TX; ph 512/334-1203, e-mail [email protected], www.molecularimprints.com.
Defect inspection system
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The AXi-935 advanced macro defect-inspection system is specifically designed with brightfield technology that enables device manufacturers to find smaller defects faster. Compared to the previous model, the AXi-935 enables inspection of 200mm wafers at throughputs 250% higher at 2µm resolution, and allows process engineers to use a common inspection platform across lithography, CMP, etch, and deposition applications. An upgrade kit is available for current AXi-930 owners. August Technology Corp., Bloomington, MN; ph 952/259-1647, e-mail megan.andrada@ augusttech.com, www.augusttech.com.
Silicon carbide
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Utilizing an advanced chemical-vapor deposition (CVD) manufacturing process, ultrapure and low electrical-resisitivity silicon carbide (SiC) are produced, for use in hostile chemical and plasma environments. The chemical and erosion resistance and thermal conductivity of CVD SiC make it appropriate for a variety of semiconductor manufacturing components, including edge rings, susceptors, processing chambers, liners, and gas distribution plates. CVD SiC offers high purity, stiffness, dimensional stability, and thermal shock resistance. Morgan Advanced Ceramics, CVD Materials Div., Hudson, NH; ph 800/700-1283, e-mail [email protected], www.morganadvancedceramics.com.
Heating/cooling module for wafers
A wafer heating and cooling module is designed for 200/300mm wafers and is BOLTS-compatible for simple integration with standard wafer-handling automation. The module uses resistive heating elements to achieve better than 450°C heating in <15 sec. After processing, the module rapidly cools the wafer to allow safe return to the FOUP. Backside particle and metals contamination is minimized through a low-contact wafer chuck. Owens Design Inc., Fremont, CA; ph 510/659-1800, e-mail [email protected], www.owensdesign.com.
Handling platform for sensor production
The Clusterline wafer-handling platform is now capable of producing “above-IC” image sensors on CMOS. The sensor is built on top of a conventional CMOS circuit and, because the entire pixel area is photosensitive, the image sensor offers decreased size for the same diode performance. Product performance is reportedly improved while cutting costs by eliminating microlenses, infrared filters, and reducing the number of process steps. Unaxis Wafer Processing, St. Petersburg, FL; ph 42/388-45-15, e-mail [email protected], www.waferprocessing.unaxis.com.
Particle counters
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Solair 3200+ and 5200+ portable airborne-particle counters offer 0.3µm sensitivity at 2.0CFM (56.6 liter/min), with an optional configuration of 0.5µm sensitivity at 50 liter/min (1.7CFM) flow rate. The counters have a volumetric flow-control system and a powerful pump that accurately maintains the flow rate. Data may be stored, viewed onscreen, thermally printed, or easily downloaded. The Solair models count up to six particle sizes, display counts instantly, and store up to 3000 records. Lighthouse Worldwide Solutions, San Jose CA; ph 408/228-9200, e-mail [email protected], www.golighthouse.com.
High-voltage module
The MPS Series high-voltage module can be used in applications ranging from mass spectrometry, electron-beam, electrostatic printing, photomultiplier tubes, and nuclear instrumentation. A hybrid topology combines proprietary circuitry for both linear and switchmode designs to enable the 10W module to attain high efficiency and ripple ratings of 0.001%Vp-p. The series is available in 1, 3, 5, and 10kV output at 10W max power output, and is available with a VCC option for combination of voltage and current mode control. The module offers stable operation at .02% drift over 8 hr of operation with a temperature coefficient of <25ppm/°C. Spellman High Voltage Electronics Corp., Happauge, NY; ph 631/630-3000, e-mail [email protected], www.spellmanhv.com.