Products
03/01/2005
Semicon Europa showcases semiconductor equipment, materials, and services in Europe. Following are some of the new products that will be exhibited at the show.
E-beam system
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The SB351 DW direct-write electron-beam (e-beam) system uses a variable-shaped beam for patterning down to 45nm feature sizes. “Write-on-the-fly” mode has been combined with a 300mm precision stage that has a 310×310mm travel range and flexible stage speed to increase throughput in small-volume production, fast prototyping, and advanced R&D applications. Leica Microsystems Semiconductor GmbH, Wetzlar, Germany; ph 49/6441-29-2229, fax 49/6441-29-2325, e-mail [email protected], www.semiconation.com.
Getter thin films
The PaGe getter thin-film line, including PaGeLid and Rel-Hy, removes impurities by chemical sorption of all active gases in hydrogen-sensitive packages, microelectronic hermetic devices in ceramic or metallic packages, and wafer-level MEMS/MOEMS. The films, a few microns thick, can be deposited and patterned on silicon, glass, germanium, metallic, and ceramic substrates in a variety of shapes. SAES Getters Group, Milan, Italy; ph 39/02-93-178489, fax 39/02-93-178320, e-mail [email protected], www.saesgetters.com.
Flip-chip system
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The 8800 FC Smart Line links three machine modules: the 8800 FC Smart Line flip-chip bonder with integrated dispenser, a curing station with integrated electrical testing, and an optical-inspection
eject-marking unit. A dual-head dispensing system uses needles for small dice and a shower head for large dice. The flip-chip bonding system offers throughput of 8500 units with process accuracy of 25µm at 3 sec. Datacon Technology AG, Radfeld, Austria; ph 43/5337-600-128, fax 43/5337-600-660, e-mail [email protected], www.datacon.at.
Yield management software
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YieldView 2.9 provides fab-wide integration and analysis of defect data generated by tools in the WaferView team. The software acts as a central database for recipes, defect classes, and alarm rules for inspection consistency, as well as performing defect discovery and identifying contributors to yield loss. An optional web-based client adds accessibility and flexibility. Rudolph Technologies Inc., Flanders, NJ; ph 973/691-1300, e-mail [email protected], www.rudolphtech.com.
sSOI wafers
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300mm strained silicon-on-insulator (sSOI) wafers for partially depleted (>35nm thick) CMOS IC architectures exhibit a strain value of 1.5GPa with homogeneity of ±7% over the wafer. The strained Si layer is 200Å thick, with a surface roughness comparable to premium bulk Si wafers. The wafers maintain their strain at temperatures up to 1100°C. Soitec, Bernin, France; ph 33/06-79-49-51-43, e-mail [email protected], www.soitec.com.
X-ray metrology tool
The BedeMetrix-L is a multipurpose process R&D metrology tool for advanced semiconductor manufacturing that incorporates enhanced small-spot measuring capability for wafers from 50-300mm. This allows measurement of sub-100µm test pads in chips and scribe lines on processed wafers. The automated tool measures thickness as well as fundamental properties and structures of materials. Bede, Durham, UK; ph 44/191-332-4700, fax 44/191-332-4800, e-mail [email protected], www.bede.com.
Noncontact measurement system
The noncontact V-Q tool is an in-line monitoring/characterization system that can replace traditional hard-probe and mercury C-V measurements for gate-dielectric materials. Full wafer-mapping capability reveals inhomogeneity of oxide characteristics on the wafer immediately after a process step. The tool combines dielectric characteristics, carrier lifetime, and diffusion length measurements in one machine for either 300mm factory automation or off-line applications. Semilab, Budapest, Hungary; ph 36/1-382-4530, fax 36/1-382-4532, e-mail [email protected], www.semilab.com.