Product News
02/01/2005
System provides CD/film analysis for masks, reticles
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The Atlas-M metrology system features multiple technologies to provide full characterization of masks and reticles for linewidth, etch depth, overhang, height, and profile measurements in one tool. The Class-1 mini-environment allows defect-free substrate handling, and various options, such as remote diagnostics, DVD system backup, an offline analysis station, and waferless recipe creation, are available. The system is SMIF compatible with both single- and multiple-mask carriers. Nanometrics Inc., Milpitas, CA; ph 408/435-9600, e-mail [email protected], www.nanometrics.com.
Wireless sensor enables close CD control for mask sets
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The MaskTemp SensorPlate employs unintrusive techniques to monitor critical process zones for photomask makers. The processing/collection module, sensors, and power plant are integrated into a standard 6×6 mask blank. Sixty-four sensors measure temperature in a rich spatial format, recording thermal activity and transmitting it wirelessly to data-analysis applications such as AutoCal. SensorPlates are available for plasma etch, resist processing, electron-beam writers, scanners, and wet-processing steps. OnWafer Technologies, Dublin, CA; ph 925/560-9441, fax 925/560-9460, e-mail [email protected], www.onwafer.com.
Vacuum-coating system covers many process options
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The TF600 combines a 600mm-wide coating chamber with a high-throughput vacuum pumping system for research, development, and production of substrates. Pumping system options include diffusion, turbomolecular, and cryogenic high-vacuum pumps, and the XDS 35i “dry” scroll pump for backing and chamber roughing. Custom-built systems can accommodate process options such as resistance evaporation, electron-beam, RF, DC, and pulsed DC sputtering. BOC Edwards, Wilmington, MA; ph 800/848-9800, e-mail [email protected], www.boc.com.
Microprobe has 10× spatial resolution of x-ray systems
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The JAMP-9500F field-emission scanning Auger microprobe achieves a minimum probe diameter of 3nm for SEI and 8nm for Auger imaging. Its analytical resolution is reportedly 10× the spatial resolution of highly sensitive x-ray systems, making it suitable for identifying killer defects in interfaces and for analyzing coatings and composites. A neutralizing ion gun and tilting specimen stage allow analysis of insulating materials and thin films without charge-up. JEOL USA Inc., Peabody, MA; ph 978/536-2261, e-mail [email protected], www.jeol.com.