Products
11/01/2002
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Silicon etch system
The 2300 Versys Star system, for 200mm and 300mm applications, builds on the 2300 Versys, expanding process capability for etching the complex structures required for sub-90nm applications. The new system introduces technologies for rapid control of temperature and gas flow step-by-step across the wafer surface, meeting next-generation CD uniformity requirements. For a typical gate etch process, applying these new tuning capabilities reduces CD variation by as much as 50%. The 2300 Versys Star enables in situ etching of complex film stacks, such as resist trim followed by antireflective coating and hardmask open over dual-doped polysilicon gate, as well as shallow trench isolation etch. The system's new capabilities for rapid tuning of wafer temperature and gas flow offer flexibility and step-by-step uniformity control to optimize each layer of the complex stack, delivering enhanced performance and productivity. Lam Research Corp., Fremont, CA; ph 510/572-4566 or 510/572-1726, [email protected], [email protected], www.lamrc.com.
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248nm bilayer resist system
SiBER is an ultrahigh-resolution, 248nm, silicon bilayer resist system that is composed of a silicon-containing top imaging layer and a planarizing, light-absorbing, polymeric bottom layer. The system contains the highest concentration of silicon in its top layer, allowing for very high differential etch transfer into the polymeric bottom layer. An aspect ratio of 10 to 1 can easily be obtained using conventional etching systems. The silicon-rich imaging top layer provides the user with a significant degree of newfound resolution within a wide process window. This company's top layer materials, SR2400 Series resists, are available in a variety of dilutions for specific customer requirements. Conventional exposure equipment can be used for imaging the SiBER bilayer system, but the newest step-and-scan DUV systems will provide device fabricators with increased resolution and process window benefits beyond those of conventional step-and-scan tools. The AR2450 Series bottom-layer material is also available in a variety of dilutions to meet user requirements. The bottom layer provides planar defect-free coatings on the wafer surface while simultaneously offering a chemically matched surface well suited to application of the silicon-rich, top-imaging layer resist. Unwanted reflected light energy is suppressed by this layer, allowing for the highest feature resolution and critical dimension control of the top layer image. Shipley Co. LLC, Marlborough, MA; ph 508/229-7586, [email protected], www.rohmhaas.com.
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SiGe virtual substrate production
The CLUSTERLINE LEP is a high-throughput, single-wafer tool for 200mm and 300mm processing. Low-cost manufacturing of SiGe virtual substrates has become possible with the low-energy, plasma-enhanced CVD of both silicon and SiGe layers. Features of the system include: in situ, pre-epi wafer cleaning below 150°C, which eliminates high-temperature hydrogen bake; high-rate deposition of epitaxial silicon and SiGe, with growth rates up to 10nm/sec below 600°C; and optimum process economy with complete utilization of reactive gases. CLUSTERLINE LEP's low-energy, high-density plasma enhances the dissociation of the reactive gases and hydrogen desorption on the wafer surface, resulting in rapid deposition of the required layers. Unaxis Semiconductors, Truebbach, Switzerland; ph 423/388-4515 or 41/1360-9622, [email protected], [email protected], www.unaxis.com.
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300mm RTP system
The Radiance Vantage system is a dedicated, two-chamber rapid thermal processing (RTP) solution for 300mm high-volume chip manufacturing. It combines Radiance 300mm RTP technology with a streamlined platform design, delivering high productivity and low cost of ownership for all anneal applications, including implant annealing, spike annealing and salicidation, as well as dry rapid thermal oxidation. The system is configured with up to two RTP process chambers that are linked directly to a factory interface and track robot. Mechanical throughput of the system exceeds 100 wafers/hr thanks to its simplified wafer-transfer sequencing. Chipmakers can quickly install and qualify the Radiance Vantage, since no additional system assembly is required for installation. The Vantage platform also is designed for ease of maintenance and high reliability in volume production. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
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WLCSP marking system
The CSP300 wafer-level CSP marking system marks wafer-level chip scale packages and bare die on 300mm wafers. It is fully automated for "in-line" production marking of 200mm and 300mm wafers. It provides the marking accuracy required for sub-1mm IC ..sizes and marks only good die as determined by information downloaded from prober wafer maps. Overall, it allows customers to optimize mark quality and throughput and to ensure proper character placement and pin one orientation. Other system performance benefits that are critical to back-end production operations include automatic wafer mapping, automatic alignment and calibration, on-board mark inspection and validation, factory networking, cleanroom compatibility, and both FOUP and SMIF automation interfaces. GSI Lumonics Inc., Northville, MI; ph 248/449-8989 ext 2664, [email protected], www.gsilumonics.com.
Point-of-use filters
Designed in cooperation with major optical lithography tool manufacturers and employing multiple filtration mechanisms, the LITHOGUARD POU effectively controls the gas-phase contamination that affects image quality and causes degradation of optical elements, thereby improving yield rates and increasing uptime of lithography exposure tools. With the ability to remove bases, acids and organic gas phase contaminants at high efficiencies, the LITHOGUARD POU is well suited to the chemical filtration of pressurized air streams in critical point-of-use applications. Donaldson High Purity Products, Minneapolis, MN; ph 952/887-3841, [email protected], www.donaldson.com.
Manual transfer machine
This machine transfers 25 wafers from a cassette (Teflon or plastic) to a quartz or SiC angle slot boat and vice versa. Transfer takes less than 40 seconds, and no maintenance or alignment is required. Also, there is no chipping, scratching or breakage. Angle slot boats used with the machine reduce particle contamination and enhance uniformity, throughput and yield. ASQ Technology Inc., San Clemente, CA; ph 949/498-4000, [email protected], www.asqtech.com.
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Benchtop vision measurement
The Benchmark system combines this company's hardware and software capabilities with the portability of a compact benchtop configuration. Because the Benchmark system can be easily moved and quickly set up to perform a variety of tasks at different locations on the production floor, it is highly suitable for ..addressing critical process control points, such as incoming inspection, in-process QA sampling, and/or final inspection. View Metrology Software (VMS) allows for rapid programming of efficient and highly targeted measurement applications. Benchmark's DC servomotor-driven positioning stage provides a 12 ¥ 6 ¥ 6 in. (x-y-z) measuring envelope with 0.1µm resolution, 200mm/sec stage velocity and integrated x-y error correction. Benchmark's optical system incorporates View's proprietary Dual Magnification Optical System to provide multiple magnifications with a single objective lens while avoiding the distortion associated with conventional zoom lenses. View Engineering Inc., Simi Valley, CA; ph 805/578-5012 [email protected], www.vieweng.com.
Automated atomic force microscope
The Dimension X3D in-line metrology tool is a nondestructive automated atomic force microscope (AFM) that provides 3D resolution for high-volume chipmaking. Based on field-proven AFM technology, the Dimension X3D gives chipmakers the ability to characterize ≥90nm device features in advanced photolithography and etch processes. The system enables three-dimensional (x, y, z) in-line measurement and control of ≥90nm critical dimension (CD) features. A gauge-capable system, the Dimension X3D is designed to provide accurate feature shape control, as well as full-sidewall scans and width and depth analysis of CDs with good repeatability and resolution. Veeco Metrology, Santa Barbara, CA; ph 516/677-0200 ext 1222 or 1472, www.veeco.com.
Pressure-based flow controller
The Criterion is a flow-control solution that has the potential to increase yield, lower cost of ownership, ease process start-up, replicate processes tool to tool and fab to fab, enhance process control, reduce tool process time, reduce part numbers, eliminate flow faults, and reduce gas panel costs. It is a next-generation pressure-based flow controller that provides accurate and fast control of process gas to the semiconductor process tool. It is immune to upstream and downstream pressure and temperature changes, is not affected by attitude sensitivity, is characterized at varying pressures on actual gas (not surrogate gases), and is accurate to better than 1% of full scale flow. FuGasity Corp., Allen, TX; ph 972/359-6519, [email protected] or [email protected], www.fugasity.com.
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Cleanroom overhead transport
The CLEANWAY CLW-07 overhead transport supports both interbay and intrabay applications. With its non-stop merge and diverge capability, the CLW-07 supports the direct delivery model, minimizing work-in-process and eliminating the need for a stocker system. ..This technology improves travel control with new vehicle proximity sensors and an inter-vehicle communication device. By eliminating interference between hangers and controllers and making cable channels easier to set up, installation has been simplified. CLEANWAY CLW-07 improves upon its predecessor model in ways that include increased maximum travel speed, increased acceleration/deceleration rate, improved FOUP vibration protection, improved FOUP security arms, enhanced vehicle travel control, updated travel and lift motors and reducers, a new status display panel, and new rear wheel drive. ESKAY Corp., Salt Lake City, UT; ph 801/359-9900, [email protected], www.eskay.com.
Die sorter with tape reel output
The DS-4000 SpeedStar now delivers more flexibility with its new tape reel output. Placing devices as small as 0.008 in. square, it vision-aligns every pocket for increased accuracy. DC servo motors and glass scale encoders provide smooth, accurate movement, along with low gram compliant pickup, and programmable process controls make the DS-4000T/R precision competent. The sorter will pick, flip and place parts into embossed pocketed tape at 3500 uph, or pick and place onto tack tape at 4000 uph. Programmable pitch is from 1mm to 24mm. Tape widths are from 8mm to 24mm. The tool picks from wafers up to 8 in., waffle packs, Gel-Paks or Jedec trays. It will accept pressure seal, heat seal, or tack tape and will invert or non-invert the die with the push of a button. Laurier Inc., Londonderry, NH; ph 603/626-4700 ext 116, [email protected], www.laurierinc.com.
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Sapphire wafer scribing system
The AccuScribe-SS20 laser-based sapphire wafer scribing system is a cost-effective alternative to diamond scribing technology, producing clean, consistent scribe lines and featuring uniform depth control. ...The AccuScribe-SS20 processes 350 ¥ 350µm die on 50mm wafers at a rate of 40 min/wafer. Channel depth is 30µm and channel width is ≥12µm, easily falling within a 30µm street. In addition, the system features good repeatability — over a run of 500 wafers, it maintains a channel width of ±1µm and a channel depth of 0µm. Suitable for the 24/7 production environment, the AccuScribe-SS20 features a stable and robust design that allows for easy loading, unloading, and alignment of wafers. New Wave Research, Fremont, CA; ph 510/249-1550, [email protected], www.new-wave.com.
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Self-ionized sputter system
The Self-Ionized Sputter (SIS) system — for dual damascene copper wiring — deposits highly effective barrier metal/Cu seed films, ..and guarantees complete filling of Cu seedinterconnects at the 90nm device node. The sputtering technology works beyond thelimits of conventional sputtering for barrier metal/Cu seed deposition onto high-aspect-ratio device features. SIS technology incorporates a new high magnet field strength self-biasing type cathode, wafer bias control mechanism, and new type of electrostatic chuck susceptor, which allows thermal control of wafers at low temperatures during the deposition process. ULVAC Technologies Inc., Methuen, MA; ph 978/686-7550, [email protected], www.ulvac.com.