Integrated ALD/PVD Cu barrier/seed system
10/01/2002
Integrated ALD/PVD Cu barrier/seed system
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This integrated atomic layer deposition/physical vapor deposition (ALD/PVD) product, the Endura iCuB/S Integrated Cu Barrier/Seed system, deposits the critical barrier and seed layers in 65nm-generation (and beyond) copper interconnects. Using ALD technology, the iCuB/S system enables an ultrathin, conformal tantalum nitride (TaN) barrier layer that is compatible with advanced low-k dielectric films. In addition to leading-edge ALD technology, the iCuB/S features advanced SIP nCoRe PVD seed technology on the Endura XP platform. The Endura iCuB/S system's TaN chamber deposits an ultrathin barrier layer with virtually 100% side and bottom coverage. Combined with the ALD TaN chamber, the iCuB/S system features the new SIP EnCoRe copper seed process, which offers low-cost operation using a flat copper target. The SIP EnCoRe copper chamber employs a self-ionized plasma to achieve the high sidewall coverage, uniformity and particle control required for void-free fill with electrochemical plating. The platform includes two 4-axis, dual-blade robots, capable of separate rotation and extension, which cut wafer transfer time by 50%. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
Wafer bump inspection
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The 3Di-7500 and 3Di-8500 are two additions to the 3Di Series of inline automated inspection systems. The 3Di-8500 has demonstrated throughputs >18 wafers/hr for 200mm wafers, performing 100% coverage for both 2D and 3D wafer bump inspection. The 3Di-7500, 8000, and 8500 all use Rapid Confocal Sensor (RCS) technology, making system field upgrades and tool-to-tool measurement comparisons more practical. All 3Di Series systems have the ability to perform field proven 2D and 3D inspection in a single system. The 3Di Series systems are all capable of 300mm wafer inspection, both whole wafer and sawn wafer on film frame. August Technology, Bloomington, MN; ph 952/259-1647, [email protected], www.augusttech.com.
Automated defect inspection
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SiPHER Auto is the fully automated successor to SiPHER, which improved epi process control by detecting defects early. SiPHER Auto builds on this with the ability to run 300mm or 200mm wafers, or both; and it features one loadport system, Semi-standard FOUPs, and options for two loadports and an open cassette. SiPHER Auto offers fast and effective control of metallic contamination and defect generation in wafer fabs. It increases overall equipment effectiveness by allowing rapid process feedback of wafer quality. SiPHER Auto can be used to inspect incoming wafers and monitor surface contamination, as maximizing performance of the furnace area. In addition, it reduces the number of batches out of specification due to faster feedback. The tool's ability to monitor the surface of the wafer, rather than the bulk silicon, makes it more sensitive to defects in the device active region. It complies with all automation standards and is designed for immediate and seamless integration into 300mm fabs. This system includes new advanced image processing and data logging for statistical process control. Available as an option is a new slip inspection module that allows accurate and fast detection of slip with automatic counting. Accent Optical Technologies, Bend, OR; ph 800/900-0955 (US), 44/1904-715500 (UK), [email protected], www.accentopto.com.
300mm horizontal wafer-shipping system
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The 300mm Horizontal Wafer Shipping System (HWS300) is a compact system that enables customers to use a single handling product for standard or thinned 300mm wafers. Combining extensive 300mm industry automation features with the use of blow-molding technology, HWS300 is a low-COO alternative to conventional front opening shipping boxes (FOSB) for shipping finished wafers. For example, the patent-pending system minimizes storage space at back-end and front-end facilities, and offersa large saving in transportation costs compared to FOSB shipping methods. The HWS300 is designed for ease of use and employs key 300mm automation features such as RF tag technology for identification and tracking and industry-standard kinematic coupling for equipment interface. The product has also passed the ISTA 2A simulated 10-point drop test from 42 in. with full thickness wafers and thin wafers (300µm), making it suitable for protection and transport of all 300mm silicon wafers. Entegris Inc., Chaska, MN; ph 952/556-8079, [email protected], www.entegris.com.
SACVD system
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The Eterna SACVD(1) system — on this company's Producer SE platform — deposits BPSG(2)-doped dielectric films, extendingproven SACVD technology to sub-100nm device applications. The Eterna process chambers are designed to provide greater gap-fill ..capability for low-thermal-budget (<750°C anneal) ILD applications. The system's new ultrahigh ozone process increases film conformality and density, while maintaining good uniformity and productivity. A new ceramic heater design with improved temperature uniformity enables superior within-wafer and wafer-to-wafer dopant range and repeatability. In addition, the Eterna's redesigned Precision Liquid Injection System (PLIS), called Individual Vapor Line PLIS, significantly enhances the reliability of liquid delivery and reduces maintenance time. The Producer SE platform can transition seamlessly to 300mm production. A new loadlock pre-heating design allows 300mm wafers to stabilize their thermal expansion before transfer to the process chambers. Applied Materials Inc., Santa Clara, CA; ph 408/.748-5227, [email protected], www.appliedmaterials.com.
Wafer packing/unpacking
The HWS 9000 Series is a bi-directional system that automatically packs processed wafers into shipping cassettes in preparation for shipment to the assembly site. Wafers of varying diameters can be processed with virtually no mechanical changeover time. The HWS 9000 can also be used by the assembly site to unpack the wafers. To optimize tool utilization, it can be used as a wafer sorter, a lot splitter, and a high-speed transfer tool. The HWS 9000 Series is compatible with all types of cassettes. A wafer ID reading (OCR/BCR) function is also available in the series. Integrated Dynamics Engineering, Livermore, CA, ph 508/650-8870, www.ideworld.com.
Film thickness measurement
The APECS3000 is a fully automatic film thickness measurement system for semiconductor process control. By intelligently linking the two physical methods of spectral photometry and spectral ellipsometry, the APECS3000 offers a good platform for all film characterization measurement tasks required in chipmaking. The measurement system uses software that intuitively guides the operator, engineer or R&D specialist via the quickest route. A patented light source allows the measurement system to be used for much longer periods of time without changing lamps. Leica Microsystems, Wetzlar, Germany; ph 49/6441-29-2550 or 703/229-4503 (in US), [email protected], www.leica-microsystems.com.
Blending/delivery system
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The CFC series precision blending/delivery systems are designed with a patented "U-Tube, Overflow-Hole, Common-Liquid-Level" technique. The series provides 2 liters/min blending ratio of 200:1 and volume as low as 10cc. ..The design allows for high accuracy and repeatability for on-site blending of slurries or chemicals over a wide range of mixing ratios. No pumps, scales, or vacuums are used. The Pipe-Tank design eliminates particle agglomeration issues. The system can generate small batches of mixed chemicals as needed, thereby providing solutions to "Pot-life" issues. Constant pressure and flow delivery reduces slurry settling in lines. The system is Semi S2-93A-compliant. ChemFlow Systems Inc., San Jose, CA; ph 408/441-6575, [email protected], www.chemflowsys.com.
Fluoropolymer diaphragm valve
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Meeting or exceeding Semi Standard F57-0301 for ultrahigh-purity polymer system components, the DRP series ultrahigh-purity fluoropolymer diaphragm valve is designed for use in many applications, including aggressive CMP slurry, acid, chemical, and ultrahigh-purity DI water delivery systems. All wetted ..parts are made from DuPont Teflon modified PTFE. The patented design of the DRP series valve helps minimize entrapment areas and enhances diaphragm performance. A hemispherical valve cavity and diaphragm shape allow rapid and thorough cleaning of all wetted surfaces. The shape of the modified PTFE diaphragm is optimized to minimize stress during cycling and to promote durability, seal integrity, and long cycle life. In addition, the web thickness of the diaphragm has been maximized to reduce the potential for acid permeation. Swagelok Co., Solon, OH; ph 440/349-5934, [email protected], www.swagelok.com.
Gas purification systems
These three purifiers, for treatment of nitrogen or CDA for lithography and photomask applications, prevent condensation and carbon buildup in the optics systems of 248nm, 193nm, and 157nm systems. For CDA, the MonoTorr PS15 Series heated catalyst purifiers remove all carbons, amines and NOX impurities to ppt levels. For nitrogen, MonoTorr PS4 heated getter or MicroTorr PS11 Series ambient purifiers are specifically designed to remove the same impurities to ppt levels. SAES Pure Gas Inc., San Luis Obispo, CA; ph 805/541-9299, [email protected], www.puregastechnologies.com.
Wafer inspection software
SpotCheck software is available for the Leica INS and LDS series and allows the automation of a task that is currently still performed by operators: the specific inspection of critical sites on wafers — now even in the DUV mode — for process irregularities and systematic defects (e.g., those caused by the reticle/mask). SpotCheck permits the detection of systematic defects, such as an overlay shift or defects already on the reticle, as well as the detection of particles, extra pattern or probe mark position errors. Defects can be automatically classified using SpotCheck together with the optional automatic defect classification software ADC NT. This reduces handling time and costs and increases productivity. Leica Microsystems, Wetzlar, Germany; ph 49/6441-29-2550 or 703/229-4503 (in US), [email protected], www.leica-microsystems.com.
Bellows pump
FS is a compact, air-driven bellows pump that handles high-temperature nitride etch and piranha etch applications. It features intelligent drive technology and leak-sensing. FS handles liquid temperatures ranging from 5–180°C with discharge pressures up to 58 psi, making it suitable for wet process tools, cleaning, and chemical feed applications. High-speed pump strokes, up to 240 spm, give a high flow rate in a small space. All liquid-contacting parts are made from PTFE/PFA, with no exposed metal parts. Iwaki Walchem Corp., Holliston, MA; ph 508/429-1440, [email protected], www.iwakiwalchem.com.
Digital capacitance manometers
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An intelligent device designed for 300mm digital control networks, the i-Baratron DMA couples an advanced signal-processing engine ...with low-power electronics. The new DMA family is entirely digital, with the first series specifically designed for DeviceNet applications. The digital backbone, combined with the Inconel all-welded sensor, provides a packaged solution compatible with the most corrosive process environments. The i-Baratron DMA provides a seamless migration path for customers who are transitioning process tool control systems from analog to digital communications. The communications interface incorporates ODVA-compliant DeviceNet communication protocol. Features include One-Touch push-button zero control, which eliminates the need to adjust potentiometers, and optional PinPoint calibration to optimize accuracy at a specific pressure value. MKS Instruments Inc., Andover, MA; ph 978/975-2350, [email protected], www.mksinst.com.
Ozone destruct system
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The TOD-O3 thermal ozone destruct system efficiently destroys fully saturated, high-concentration ozone vapors that offgas from the ...wet bench and other semiconductor applications. It decomposes fully saturated ozone to safe levels through thermal destruction of ozone to oxygen. The TOD-O3 is designed for mounting to an ozone transfer module exhaust, and it can accommodate flow rates of saturated ozone up to 20 slpm @ 240 grams/Nm3. The system is customized to handle the majority of ozone destruction requirements in wafer manufacturing applications, but also in many other industrial processes, including ultrapure water systems. The TOD-O3 meets stringent safety requirements. It is a "total system," which includes a heat exchanger, coalescing filter, thermal cooling switch, and EMO, and there are no consumables required for operation. IN USA Inc., Needham, MA; ph 800/798-4029 or 781/444-2929, [email protected], www.inusacorp.com.
Silicon nitride etchant
Transetch N is a concentrated reagent derived from ortho-phosphoric acid. It boils at 180°C and selectively etches silicon nitride or aluminum oxide in the presence of silicon or silicon dioxide. Fast and controllable, Transetch N eliminates overetching and undercutting. Also available is a series of Wollam-style condensers for use with Transetch N or EDP silicon etches. This company's etching equipment handles a maximum of 34 wafers up to 300mm. Transene Co., Danvers, MA;ph 978/777-7860, [email protected], www.transene.com