Product News
09/01/2002
FEOL photoresist strip
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The GAMMA 2130 system is a production-worthy, 300mm system for FEOL photoresist strip. It features a MultiStation Sequential Processing (MSSP) architecture that incorporates six processing stations within a single process chamber. The system's patented Interlaced Inductively Coupled Plasma (I2CP) downstream source offers damage-free processing through a combination of low power and ionization densities. Independent process control at each station delivers the flexibility required to accommodate the full spectrum of strip applications, including high-dose implant strip. A combination of high throughput, small footprint, low consumables cost, and minimal maintenance requirements give GAMMA 2130 a low cost of ownership. Novellus Systems Inc., San Jose, CA; ph 408/ 953-4188, [email protected], www.novellus.com.
High-performance vision sensor
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The palm-sized In-Sight 1701 is a high-performance vision sensor for identifying and tracking wafers through the semiconductor manufacturing process. It is an enhanced version of the In-Sight 1700 wafer reader, offering advanced optics technology for reading identification scribes on wafers. The 1701 provides a large area of illumination, allowing it to image heavily degraded marks on wafers, even if the wafers are misaligned due to mechanical pre-alignment errors. Like the In-Sight 1700, the 1701 uses advanced OCR, 2D matrix, and barcode recognition algorithms to read soft-marked, super-soft-marked, or hard-marked Semi-standard codes on the front or back side of a wafer. These algorithms also provide very high read rates on wafer marks that have been affected by CMP, edge beads, copper metalization, blue nitride coating, and other process effects. The 1701 features an intuitive graphical user interface for easy set-up and modfication, image "tuning" capabilities that automatically balance lighting and image filters for optimal read settings, and built-in network and serial communications for connectivity to other process tools and/or the fab network. Cognex Corp., Natick, MA; ph 508/650-3140, [email protected], www.cognex.com.
Fixed-abrasive CMP solution
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The Reflexion Fixed-Abrasive Web CMP system features a slurryless process for forming the shallow trench isolation (STI) structures in sub-100nm devices. Instead of using a polishing pad and slurry to planarize the wafer, this technology employs a roll of fabric-like material that contains the polishing abrasive. Integrating the abrasive into the fabric effectively eliminates dishing - the removal of material from low areas on the wafer caused by "free" abrasive particles. Erosion is resolved by using nitride selective chemistry that curtails polishing once nitride is exposed. The system features one to two abrasive web magazines mounted in place of conventional platens. During polishing, the abrasive material is stationary on the magazine that rotates while the polishing head both turns and sweeps across the surface. After each wafer is processed, the abrasive material is advanced, continuously replenishing the abrasive before the next wafer is polished to provide uniform and repeatable polishing conditions for every wafer. Applied Materials Inc., Santa Clara, CA; ph 408/563-6209 or 408/748-5227, www.appliedmaterials.com.
Overlay measurement system
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The NRM-3000 provides automatic measurement of overlay and NSR focus marks with high speed and precision. It features a dedicated opticalsystem with good aberration management. The objective lens is designed specifically for overlay measurement, offering good imaging performance with a high S/N ratio and high dynamic range characteristics. The illumination system is bright and optically matched to the imagingsystem. It employs a fiber-optic delivery system to an efficient quartz-halogen lamp. The NRM-3000 employs an actively damped stage and new EGA alignment control technology for speed and accuracy. Throughput is 150 wafers/hour (5 points/wafer). Newly developed software offers easily optimized recipe management functions. Waferless recipe creation gives automatic recognition of stepper alignment marks and other unique patterns. Nikon SITECH, Melville, NY; ph 800/526-4566, www.nikonusa.com.
Piping for ultrapure processes
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The Secure & Pure is a secure, cost-effective, ultrapure thermoplastic piping system for the semiconductor, water, and chemical industries. The system is designed to protect critical transmission lines from mechanical damage, as well as eliminate expansion problems common to solid thermoplastic systems. These products combine the strength of a stainless exterior with a non-contaminating, unpigmented plastic interior produced and cleaned to semiconductor specifications. Virgin resin liners are available in PVDF, PP or PTFE. All three meet chemical resistance, purity, and temperature capability requirements. Secure & Pure system sizes range from 1/2-12-in. diameters. Edlon Inc., Avondale, PA; ph 800/753-3566, contact_ us@ edlon.com, www.edlon.com.
Sensor probe for humidity and airflow
Sensor Probe 1410 is designed to measure humidity and airflow for lithography track applications. Combined with this company's temperature measurement tools, Sensor Probe 1410 tightens customers' control of environmental parameters by measuring temperature, humidity and airflow simultaneously. The Sensor Probe 1410 is highly accurate, measuring within ñ1% for humidity at a range of 10-80% relative humidity and within ñ2% for airflow ranging from 0-1000 ft/min. Also available is the Sensor Probe 1410 for temperatures ranging from 0-230°C, with accuracy of ñ0.1°C. Sens Array Corp., Fremont, CA; ph 510/360-5600, www.sensarray.com.
Yield/quality/performance software
By integrating all of the data engineers need to access in order to understand and solve problems - including planning, product, process and tool data - ENGINEERINGworks enables customers to solve a broad range of engineering problems. These include: finding a problem's root cause; characterizing a new product design code; qualifying a new resist vendor; qualifying a new tool; identifying the drivers for increased product performance; improving preventive maintenance schedules; reducing monitor wafers; and eliminating optical inspection. Engineers can explore comprehensive data with a rich set of data-mining and analysis methods to resolve problems associated with planned and un planned engineering changes in the semiconductor fabrication process, and also manage the complexities of outsourced manufacturing. Brooks-PRI Automation Inc., Chelmsford, MA; ph 978/262-2459, mark. chung@ brooks-pri.com, www.brooks-pri.com, www.sas.com.
High-resolution SEM
The JSM-7400F scanning electron microscope (SEM) delivers very high resolution at low kV, providing good image quality for bothnanoscience and nanotechnology research. New semi-in lens technology provides a new level of imaging detail. The JSM-7400F provides image resolution of 1.5nm at 1kV to meet the precise structural evidence and imaging need of materials scientists working in the areas of nanoscience and semiconductor technology. The SEM's advanced lens design includes a patented SE Enhancer, r-filter, and in-lens backscatter detector to enhance image quality, reduce charging contrast, and heighten z-contrast. The SE Enhancer multiplies higher-energy secondary electrons through the objective lens and enhances contrast quality of surface structures. The r-filter suppresses the effect of electron charge on nonconductive specimens. The in-lens backscattered electron detector efficiently detects backscattered electrons with ó1kV energy incident electrons that are generated from the very surface of the sample. JEOL USA Inc., Peabody, MA; ph 978/536-2261 or 978/535-5900, [email protected], www.jeol.com.
Advanced in-fab defect analysis
The Defect Analyzer DualBeam system is designed for advanced in-fab defect analysis of processes for 130nm nodes and below. It is engineered to reduce new process ramp times and lower the financial impact of yield-killing excursions and is available as a 200mm wafer tool or a 300mm bridge tool. The Defect Analyzer is highly automated, reducing the amount of "on-tool" time for operators. Wafer alignment, defect navigation, electron and ion beam imaging, as well as ion beam milling operations, are all automated functions on the tool, enabling it to conduct full wafer analysis and analyze multiple defects on multiple wafers. FEI Co., Hillsboro, OR; ph 503/844-2695 or 408/737-0285, [email protected], www.feico. com.
Underfill system for flip chip
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The MRSI-175UF system is targeted specifically to the flip chip underfill dispense market. Depending on customer need, the MRSI-175UF can be configured to meet application-specific solutions, e.g., single or dualconveyors, single or dual dispense head, and rotary or linear positive displacement pump. The Linear Positive Displacement Pump design offers the tight process control, high dispense accuracy, and consistent repeatability needed for high-volume production. With closed-loop encoder feedback, the pump can hold very precise process control tolerance for extended periods, substantially reducing the frequency of calibrations. The pump was designed for rapid and easy routine maintenance by using standard, inexpensive, disposable components. The MRSI-175UF offers parallel processing conveyors that reduce time associated with preheat, load, unload, transfer, and underfill material flow. MRSI, North Billerica, MA; ph 978/667-9449, fax 978/667-6109, www.mrsigroup.com.
Gas systems
TRiMEGA GASGUARD High Flow Racks offer a cost-effective alternative to typical bulk specialty gas systems. The design offers a robust mounting system that installs easily and provides good accessibility to all components. Mass customization includes gas-specific panel designs that incorporate advanced, ultrahigh-purity components. Mass customized panels meet basic operational and safety requirements for the intended gas service while allowing customer configurable options. Process component layout design facilitates operation and maintenance while minimizing internal purge volumes and process line welds to reduce the potential for contamination. TRiMEGA(Air Products/ Kinetics), Allentown, PA;ph 480/763-2200, [email protected].
Exhaust management system
The Kronis exhaust management system, for low-k CVD applications, provides good exhaust management for deposition species and clean chemistries used in emerginglow-k CVD chip manufacturing processes. These CVD processes utilize organosilane compounds. Achieving clean combustion of these materials is challenging, and failure to do so can result in by-products and blockages. The combination of the unique inward-fired combustion technique with a novel process gas inlet architecture provides a high level of combustion coupled to a low level of by-products. BOC Edwards, Wilmington, MA; ph 800/848-9800, [email protected], www.bocedwards.com.
Photosensitive polyimide coating
Photoneece PWDC-1000 is a positive tonephotosensitive material that is used in the semiconductor arena as a stress buffer and/or redistribution layer. It offers high resolution with short processing steps - and even elimination of the etch process step. It is formulated for compatibility with most existing semiconductor processing equipment. The polyimides are also used in optoelectronics as a passivation and insulation layer, as well as in OLED applications. Dow Corning, Midland, MI; www.dowcorning.com.