New Products
05/01/2002
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Si, SiGe and SiGeC epitaxial film depositionI-2300 SRE is a Si and SiGe epitaxial film deposition system — for the fabrication of high-speed communication and mobile computing devices — that employs a cold-wall reactor. Epitaxial films are grown at a temperature <600°C under ultrahigh-vacuum conditions, yet give a higher deposition rate than conventional CVD systems. Technologies have been developed to obtain selective growth of Si/SiGe epitaxial films on Si by controlling the incubation times on Si, SiN and SiO2. The selective growth process eases the self-aligned fabrication technique, particularly for devices with sub-0.25μm features. The film quality at the boundary between insulator patterns and the Si window is almost defect-free. In addition, owing to the low-temperature process technology, this system can be used for the selective epitaxial growth of SiGeC films on Si. The epitaxial film-growth and pre-cleaning processes are carried out with a very low thermal budget. The system supports both 200 and 300mm Si wafers. Anelva Corp., Tokyo, Japan, ph 81/42-334-0843, [email protected], www.anelva.co.jp/english.
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Reticle macro inspection system
The ZARIS reticle macro inspection system maximizes stepper throughput at reduced cost, thanks to its ability to prevent the mask damage and mishandling normally encountered in manual inspection processes. This product's proven track record and ease of use, flexibility to handle multiple stepper configurations, and ability to ID reticles and pellicles and to integrate additional metrology or process components results in faster factory ramp with minimized reticle and pellicle damage. CE/Semi compliant, ZARIS is a Class 1 bright-light macro inspection and nitrogen cleaning system that accommodates 5- and 6-in. reticles from a wide range of shipping cassettes and supports fully automated opening of most common stepper cassettes. It also provides a large set of options, including optical character recognition for reticle and/or pellicle ID, microscope inspection, particle detection, pellicle mounting, and GEM/SECS link, and it can integrate with stockers and metrology equipment. Through the use of ESD-safe materials and other fail-safe features, ZARIS provides the maximum in reticle protection. Brooks Automation Inc., Chelmsford, MA; ph 978/262-2459, [email protected], www.brooks.com.
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Dual damascene etch
The Dielectric Etch eMax EnTek Centura system provides an enabling, cost-effective solution for etching low-k dielectric materials in high-performance copper chips. The system's proprietary Deposition Mode and Clean Mode technologies seamlessly integrate and optimize etch, photoresist strip, and barrier removal process steps on a single system to preserve the integrity of the k-value and critical dimensions while reducing cycle time. A major challenge for integrating low-k materials is maintaining the integrity of the dielectric material during post-etch strip. By separating deposition (via and trench etch, polymer-rich processes) and clean (photoresist and barrier removal, polymer-free processes) steps, the eMax EnTek preserves material properties, minimizing changes to the k value of the dielectric film associated with post-etch strip processing. The unique design of the eMax chamber provides for a soft, stable and uniform barrier removal process that improves cleanliness and enhances yield performance. New, advanced iRM (integrated rate monitor) sensor technology provides precise control of trench etch depth. This capability also minimizes wafer-to-wafer electrical performance variation and eliminates the need for a middle stop layer that reduces the effective k value of the film layers. Applied Materials Inc., Santa Clara, CA; ph 408/563-0647 or 408/748-5227, www.appliedmaterials.com.
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CD metrology systems
The Process Window Monitor (PWM) CD metrology systems build on the high precision, throughput and sensitivity of this company's most advanced CD SEM and optical CD metrology tools. The 8x50-PWM and SpectraCD-PWM systems include fully automated, web-based CD process window measurement, analysis, and reporting capabilities. With these new features, chipmakers can monitor and match the process windows of every lithography cell and process in the fab, maintaining tight CD control within these narrowing windows. This enables chipmakers to accelerate development efforts on advanced lithography processes, while at the same time increasing baseline yields and maximizing lithography cell productivity in high-volume manufacturing. Over time, optimal focus and exposure settings for a given lithography cell and process can drift and change in a variety of ways, such as CD variations during the patterning process. Knowing not just the optimal process settings but also the size of the window and the sensitivity to process variation is now critical for stable and efficient pattern transfer. The new PWM-enabled tools automate all steps — from measurement to reporting — required to obtain the critical focus and exposure measurements that previously had been performed by the lithography tools. KLA-Tencor Corp., San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
Dual-discharge-chamber technology
This breakthrough dual-gas-discharge-chamber technology is designed to meet the stringent performance requirements of the next several generations of lithography tools. The innovative master oscillator power amplifier (MOPA) will enable next-generation light sources to deliver higher power, tighter bandwidth, and lower cost of operation for future optical lithography applications across all three deep ultraviolet (DUV) wavelengths: 248nm, 193nm, and 157nm. The new dual-gas-discharge-chamber technology separates the power and bandwidth generators to overcome the costly tradeoffs that have limited the design of new light sources. Cymer Inc., San Diego, CA; ph 858/385-6308, [email protected], www.cymer.com.
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Vibration isolation workstation
The 9100 Series vibration isolation workstations offer Faraday Cages and other efficiency-improving accessories. These workstations can be configured for a wide variety of applications in which external vibrations adversely affect the operation of sensitive equipment. Customization options include provisions for ergonomically correct comfort as well as application-specific convenience. Optional Faraday Cages protect sensitive operations from electromagnetic interference, and tabletop enclosures protect against harsh manufacturing environments. The 9100 Series is available with a load capacity of 800 or 1300 lbs. and is Class 100 cleanroom compatible, with Class 10 available as an option. Kinetic Systems Inc., Boston, MA; ph 617/522-8700, fax 617/522-6323, www.kineticsystems.com.
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Diode-pumped solid-state laser
The new HIPPO (high intensity peak power oscillator) is an industrial, diode-pumped solid-state laser for micromachining of metals, semiconductors and polymer materials. In particular, HIPPO lasers deliver a unique combination of short pulse length (<15 nsec at 40 Hz), high output power (>17 W at 1064nm) and exceptional beam quality (M2 <1.2), making them particularly useful for marking and microstructuring in microelectronics, MEMS, photonics, and telecommunications applications. HIPPO lasers are available with output at 1064nm, frequency doubled to 532nm (>11 W) and frequency tripled to 355nm (>4.5 W). Frequency multiplication is achieved through the use of pre-aligned harmonic modules, which mate to the laser using locating pins. Spectra-Physics, Mountain View, CA; ph 650/966-5877, [email protected], www.spectra-physics.com.
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Data analysis and modeling
The Global Process Control (GPC) Scan allows off-line, fast and intuitive data analysis and modeling. GPC Guard provides automatic real-time fault detection, classification, identification and correction, and is embedded in the SilverBox. With the SilverBox, the GPC Guard and the GPC Scan allow the user to develop a wide range of reusable applications, from Real-Time Process Control to Feed-Forward or Feed-Backward Control, and from e-diagnostics to Overall Equipment Efficiency (OEE) tracking. The SilverBox is a single hardware and software multi-connectivity platform, which delivers both capabilities and solutions for equipment integration, sensors integration, and data collection. The third generation of the SilverBox supports the GPC methodology, and provides a complete APC/EEC Framework through its distributed architecture. Si Automation, Montpellier, France; ph 33/467-0337-00, [email protected], or (in USA) 650/251-9066, [email protected].
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Portable plating bath analyzer
The Qualilab QL-P plating bath analyzer uses patented CVS technology for accurate monitoring of the organic additives and inorganic components of an electroplating bath, regardless of its location. Designed to be set up in minutes, it is highly transportable within a single facility or among multiple facilities. Containing an electrode stand, an electronic analysis component, and connectivity to a notebook PC, this compact, lightweight system retains all the analytical capabilities of the QL-10. Both products provide complete analysis of additives and components in a copper or other electroplating bath and display live voltammograms (fingerprints) used to monitor contaminant buildup. ECI Technology, East Rutherford, NJ; ph 973/773-8686 ext 206, [email protected], www.ecitechnology.com.
Thin film etchants
These three products selectively etch thin metal films on gallium arsenide and other III-V semiconductor materials. Gold Etchant TFAC, Aluminum Etchant D, and Nickel Etchant TFG are nitric acid-free, for full compatibility with sensitive gallium arsenide and related intermetallic substrates. Etch rates of 40-200Å/sec can be achieved. The etchants provide uniform, controlled etching with minimal undercutting and good compatibility with photoresists. These aqueous solutions are easily rinsed with deionized water. Transene Co., Danvers, MA; ph 978/777-7860, [email protected], www.transene.com.
General purpose hotplate
This general purpose aluminum hotplate, the HP 401, gives easy and accurate control of temperature up to 150°C. It has a plate dimension of 320 x 320mm, with adjustable proximity, as well as loading pins suitable for 2-12-in. substrates. Vacuum can be applied to the holes in the hotplate to pull the wafer flat. Also, the hotplate has an integrated pneumatic lift for the top. SAWATEC Solutions AG, Balzers, Liechtenstein; ph 423/384 2652, [email protected], www.sawatecsolutions.com.
Ellipsometer
eflectometer for 300mm
The proven PZ2000 laser ellipsometer
eflectometer now handles 300mm wafers, with software controlled XY-mapping. The new MQ Garnet 300 is a Windows NT-based table-top instrument capable of determining thickness, refractive indices, absorption constants, and reflectivity of thin films ranging from 0nm to several microns. Aimed at both the R&D and process qualification markets, the instrument analyzes transparent films such as oxides and nitrides, as well as absorbing films such as polysilicon and polyimide. It simultaneously evaluates multilayers such as ONO, OPO and CMP films. Philips Analytical B.V., Almelo, The Netherlands; ph 31/546-5343-88, [email protected], [email protected].
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Automated TEM sample preparation
TEMpro creates pre-thinned samples for FIB and TEM quickly and reliably. It is a stand-alone tool that automatically and reliably produces a 25μm thin sample mounted on a support grid and loaded in a holder — ready in 15 min for final thinning to electron transparency in a FIB workstation. Liquid nitrogen is a standard feature that stabilizes sensitive materials on the IC. Preparation and delivery of consumables to the system, such as the glue capsule and needle applicator, have been simplified. Unlike manual techniques, the cryo-cooled precision sawing and bonding system of the TEMpro uses no water and no chemicals, and prevents contact with the area of interest. SELA Ltd., Sunnyvale, CA; ph 408/736-3700 ext 104, [email protected], www.sela.com.
Lithography process control software
ARGUS software offers use-case-based lithography critical dimension (CD) and overlay control specifically tailored for complex product flow conditions. The primary feature offered by ARGUS 2.3 is its enhanced CD and overlay control, which automatically adjusts exposure feedback parameters in response to reticle and film stack changes. ARGUS utilizes a separate control loop that feeds forward corrections to address reticle-related effects and incoming lot conditions. Graphical user interface (GUI) and computer-integrated manufacturing (CIM) systems provide effective control over ARGUS's operation. New Vision Systems, Cambridge, MA; ph 617/551-2223, [email protected], www.nvs.com.
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All-solid-state, CW, DUV laser
The Azure, a continuous-wave, diode-pumped, DUV laser is a "hands-free" 266nm laser source designed for industrial applications ranging from writing fiber Bragg gratings to semiconductor metrology. In the semiconductor market, for example, Azure's 266nm wavelength allows the detection of small but critical defects that longer wavelengths miss. Azure uses the field-proven Verdi laser to generate light at 532nm; the output is then doubled to 266nm. The result is a stable, reliable, long-life 266nm laser with an output power of 200 mW and a TEM00 beam profile. The unit also features the Sentinel system, an on-board series of automated capabilities that control beam pointing, maintain output power, shift the crystal, and relock the cavity. Azure measures 14.4 x 23.3 x 7.0 in., runs on 100-250 VAC, and requires minimal water cooling. Coherent Laser Division, Santa Clara, CA; ph 408/764-4654, [email protected], www.coherentinc.com.