Product News
04/01/2002
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Digital peripheral device interface
This new peripheral device interface module converts non-DeviceNet peripheral devices to DeviceNet. The MKS D.I.P. Products CDN127 is the latest in a series of DeviceNet-compatible interfaces for enhanced digital communication and productivity for semiconductor manufacturers and manufacturers of auxiliary equipment commonly used on semiconductor processing tools, such as vacuum pumps, process generators/power supplies, heat exchangers, chillers, and compressors. The CDN127 supports eight fail-safe digital inputs/outputs, two analog inputs, and two analog outputs. In addition, it provides added flexibility by easily integrating into end-user interlock strategies that use electromechanical relays. This interlock capability conforms to Semi-S2 requirements for safety. With eight configurable digital inputs/outputs and 12-bit analog inputs/outputs, the CDN127 operates as a Group 2 slave on a DeviceNet network. MKS D.I.P. Applications Engineering Group, Riverside, CA; ph 909/686-4211, www.mksinst.com (D.I.P. Products).
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Automated wafer backside inspection
Designed specifically to address the process control needs of advanced design rules and 300mm applications, the Backside Inspection Module (BSIM) allows nondestructive inspection on the backsides of patterned production wafers with the sensitivity to detect particles as small as 50nm. (BSIM is offered as an option to Surfscan SP1 wafer inspection tools.) The backsides of production wafers become contaminated or damaged at almost every process step, including deposition, etch and CMP. The move to double-sided polish wafers for 300mm applications is also creating a challenge, because defects previously hidden in the wafer topography on the backside surface of single-sided polish wafers are brought to the surface when the backside is polished. These defects distort the front surface during subsequent photolithography exposure, causing "hot spots" and out-of-focus IC patterns. BSIM employs edge-only wafer handling throughout the measurement process, so it is completely nondestructive to the unscanned side. Since the system is automated, chipmakers can employ it to monitor product wafers at all critical points throughout the fab. KLA-Tencor Corp., San Jose, CA; ph 408/875-5473, [email protected], www.kla-tencor.com.
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Wafer inspection system
The Vision Inspector Vi-2201 Series has been developed to inspect wafer defects such as chip flaws, dust, probe marks after electrical test, etc. — fully automatically and at high speed. The newly adopted high-speed continuous scanning system performs inspection without stopping the target objects, resulting in a reduced inspection time of 15-50 sec/standard wafer (150mm). The Vi-2201 Series inspects between 50 and 200 times as fast as visual inspection, greatly reducing labor and costs. Also, the enhanced precision of the Vi-2201, supported by expanded learning methods, sensitivity settings, and a wide choice of options, achieves high inspection reproducibility, such as an inspection agreement ratio of 99.99%. The inspecting program can be created easily in a short time through a self-learning system with statistical error image processing. The Vi-2201 Series also supports expanded wafers and chips packed in trays. Topcon Corp., Japan; ph 81/3-3558-2525, [email protected], www.topcon.co.jp.
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Point-of-use dry pump network integration
The IPX point-of-use dry pump series is now available with Cnet, an enhanced network integration. Cnet does not require OEM integration, which allows for rapid connection to the tool — users simply plug it in and operate. It also allows remote monitoring through a fabwide network connection and provides EMS facility. IPX pumps ordered with Cnet have enhanced electronics and switch gear; the pump performance is unaffected. Cnet is also compatible with conventional dry pump Tool Interface Module (TIM) or Network Interface Module (NIM). This simple tool integration enhancement is compatible with all major OEM tools and complies with Semi S2-2000 requirements. BOC Edwards, Wilmington, MA; ph 800/848-9800 or 978/753-3137, [email protected], www.bocedwards.com.
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Nanopositioning stages
Designed for applications that include semiconductor inspection systems, CD measurement, mask alignment, and high-resolution microscopy, these piezo-electrically driven nanoautomation stages are parallel-kinematics designs. System features include sub-nanometer, sub-μrad resolution and stability; travel up to 800μm/2000μrad/axis; X to XYZθXθYθZ versions (1-6 degrees of freedom); integrated two-electrode capacitive displacement sensors that provide high resolution, linearity, and stability; sub-msec response and special vibration suppressing algorithms that allow high operating cycles and high throughput; a large, clear aperture for near-field microscopy applications; and high-speed digital controllers with Autocalibration to allow easy exchange of a controller/stage system. Polytec PI Inc., Auburn, MA; ph 508/832-3456 or 714/850-1835, [email protected], www.polytecpi.com.
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Sputtering system for wafer-level CSP
The SRH-820 is a cost-effective sputtering system for CSP applications. It offers throughput of 102 wafers/hr and allows processing flexibility. The system can be set up to handle various wafer sizes quickly and offers up to seven process chambers. The SRH-820 has a simple, highly reliable rotational turret system based on this company's experience in optical disk and power device production systems. Wafers are indexed rather than transferred by a robot, reducing hardware costs. The system also applies an isolated process chamber environment to etching and sputter chambers during processing, eliminating the risk of cross-contamination. ULVAC Technologies Inc., Methuen, MA; ph 978-686-7550, [email protected], www.ulvac.com.
Standard reliability testing for nonstandard devices
This new system has the ability to perform lifetest, burn-in, electromigration testing, hot carrier testing, dielectric testing, and bump testing on specialized, nonstandard devices. It addresses the part of the market that may need to test devices at 3 amps, or 300V. ThetaDelta Technologies Inc., Lawrence, MA; ph 978/689-0136, [email protected], www.thetadelta.com.
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Wafer rotation during die bonding
Wafer rotation for high-aspect-ratio die during automatic die bonding integrates a vision system with a mechanism for theta rotation of the wafer frame assembly in order to align the die with the fixed ejector pins. This process enhancement increases the number of die that can be used per wafer, resulting in higher yields. As the system picks die from the wafer tape, it first vision-processes the die and then rotates the wafer to ensure that the individual chips and the row of ejector pins align. This feature is important for long-aspect-ratio die and, particularly, for thin die. MRSI, North Billerica, MA; ph 978/667-9449, fax 978/667-6109, www.mrsigroup.com.
Molded distribution valve
The Integra Molded Distribution Valve is an injection-molded valve, made from TEFLON PFA HP Plus material, that is designed to transport critical fluids safely while minimizing downtime, cross-contamination, and yield loss in the chemical-handling process. The valve has demonstrated success in the qualification process due to its robust, compact, high-flow design. After recent tests, the valve has been proven to withstand millions of cycles in chemical, vacuum, and elevated-temperature tests. These results exceed the industry's rigid qualification standards, making the valve ideal for use in applications such as the upstream side of pressure vacuum vessels and pumps. The valve's TEFLON PFA HP Plus construction provides chemical resistance for applications that use high-purity chemicals, solvents and deionized water. Entegris Inc., Chaska, MN; ph 952/556-8079, www.entegris.com
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All solid-state 193nm source
The Indigo-DUV is a compact, all solid-state, deep-UV laser. It produces >2mW of single-frequency radiation at wavelengths around 193nm in a TEM00 spatial mode. It is used by chipmakers for microlithography, metrology, mask inspection, and spectrometer calibration. The Indigo-DUV is based on a Ti:sapphire oscillator that is pumped by the Evolution laser, a diode pumped solid-state (DPSS) Nd:YLF laser. The Ti:sapphire oscillator is injection-seeded by a tunable narrow linewidth external cavity diode laser (ECDL). The fundamental wavelength produced is ~772nm. A harmonics package converts the 772nm to the fourth harmonic, 193nm. The Indigo-DUV delivers superior performance with a TEM00 output beam, output power stability, and computer-controlled wavelength tuning with <0.1pm resolution. Positive Light, Los Gatos, CA; ph 408/399-7744, [email protected], www.poslight.com.
On-line boron analyzer
The Sievers UPW Boron Analyzer is the first instrument to provide continuous, online, unattended monitoring of part-per-trillion levels of boron in DI, ultrapure water applications. Because boron is released from mixed-bed ion exchange resins before silica, the analyzer is an essential tool for pinpointing resin exhaustion in microelectronics applications. Possessing the ppt sensitivity of inductively coupled plasma mass spectroscopy (ICP/MS), the analyzer ensures compliance with primary and polish loop boron specifications. At five analyses per hour, engineers can protect against upset conditions that would go undetected with ICP/MS or other batch analysis methods. Ionics, Instrument Business Group, Boulder, CO; ph 617/926-2500, [email protected], www.ionics.com.
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Class 1 cleanroom robots
The new SR6 and SR8 turboscara robots are certified for use in Class 1 cleanrooms (US Federal Standard 209e) by the Fraunhofer Institute for Production Technology and Automation, Germany. To meet cleanroom requirements, both the SR6 and SR8 robots use an integrated suction device to prevent particles from entering the clean environment. The robot housing encloses all rotating parts and drive elements, and a special bellows tested for use in cleanrooms covers the area of the stroke axes. To complete the cleanroom setup, all electrical and pneumatic cables are routed through the sleeve to the gripper. Bosch Rexroth Corp./Robert Bosch GmbH, Buchanan, MI; ph 616/697-5295, [email protected].
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Electrolytical metal analysis tool
ELYMAT III measures defect distributions with a maximum lateral resolution of 1mm on silicon wafers with diameters up to 300mm. By measuring the diffusion current of minority carriers induced by a laser, iron contamination can be detected down to 109 at/cm3 without sample preparation. To suppress recombination of minority carriers at the wafer surface, acid passivation and electrostatic passivation can be applied. The whole measurement is run by a real-time controller that records a contamination map of a 300mm wafer at maximum resolution in ~1 min. The tool can be operated manually or automatically by a remote host and complies with the SECS/GEM interface specification. GeMeTec, Munich, Germany; ph 49/89-748-25242, [email protected], www.gemetec.com.
Thin-film characterization station
The PUV station is a variable angle spectroscopic ellipsometer
eflectometer that spans the 145-750nm spectral range. The instrument is well suited to precise and accurate V-UV and D-UV characterization of optical materials and coatings at 248, 193 and 157nm wavelengths. Spectrophotometry and optical CD metrology based on "scatterometry" can also be performed. Sopra SA, Bois-Colombes, France; ph 33/1-4649-6700, (in USA) 978/392-2089, www.sopra-sa.com.
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Soft and precision laser-welded bellows
These "soft" bellows, called LASERBELLOWS, are suitable for hermetic sealing and manipulators for ultrahigh-vacuum and semiconductor applications. The mechanical resistance to the axial motion of the bellows (spring rate) is reduced from 47% to 19% compared with conventional bellows of the same size. Higher positioning accuracy and low motor power are some of the benefits of these bellows.
The "soft" bellows are 100% quality-checked by automatic welding/inspection machines, followed by mass spectrometer leak check. The bellows' life is more than 5 million cycles. LaserTech USA, Orlando, FL; ph 407/438-9015, [email protected], www.lasertechllc.com.
Wafer passivation coating
EPO-TEK T3084-A2 is a wafer passivation coating material that provides good mechanical and environment protection on memory chips and other semiconductor devices. Only two steps are required to screen-print the wafer surface protection, compared to the seven or more steps required by spin-etch techniques. The material offers a combination of high Tg with low modulus that yields a low stress coating and a flat wafer. T3084-A2 has been formulated to optimize high-definition print resolution with minimal post-point flow. Epoxy Technology Inc., Billerica, MA; ph 978/667-3805, www.epotek.com.