Eurofocus
04/01/2002
IMEC to push 193nm litho to the limit
IMEC, Leuven, Belgium, has announced a continuation of its 193nm lithography Industrial Affiliation Program on a high NA 193nm step-and-scan system to push 193nm lithography beyond 100nm. Although 193nm lithography will be introduced for volume manufacturing of the 100nm technology node, it has become clear that the technology can and must be pushed well beyond 100nm, using next-generation step-and-scan systems equipped with higher NA lenses. In order to continue the development work required to meet this objective, IMEC has extended its industrial affiliation program (IAP) throughout 2002 and 2003, using ASML's PAS5500/1100 high NA 193nm step-and-scan system (see illustration), with a maximum NA of 0.75, interfaced to a TEL Clean Track ACT8 advanced resist coat/development track.
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The system is currently being installed in IMEC's 8-inch pilot line. Work during the program extension aims to push 193nm lithography to k1 factors of 0.35-0.3 for the critical lithography levels. Using the 0.75 NA of the lens, resolutions of 90-75nm can be achieved. Special emphasis will be placed on the contact hole level, which has been ambitiously set by the ITRS roadmap and which is generally considered to be the biggest hurdle for optical lithography. As even higher-NA lenses become available, the program will form the basis for further development of 193nm lithography. It will investigate high-NA effects in greater detail, in the quest for the more aggressive optical extension techniques required by manufacturing.
The program is a significant stepping-stone to 157nm lithography, which will require ultrahigh-NA lenses and aggressive optical extension techniques as well. The resist, lens and reticle quality for 157nm lithography are currently not yet mature enough to investigate these effects properly. IMEC is inviting semiconductor manufacturers, material suppliers (resist, ARC), mask shops, and peripheral lithography equipment suppliers to participate in the 193nm program. IMEC IAPs offer the advantages of reduced costs and early process knowledge.
For more information, access www.imec.be.
New ASM International facility operational
In November 2000, ASMI announced that its subsidiary ASM Europe B.V. had signed up for a $15 million investment in a new assembly and test facility. Anticipating the success of the A412 vertical furnace product and the growing 300mm market, the facility would be dedicated to the production of the new generation 300mm and 200mm A412s. The plant, located in the Dutch town of Almere, 35 km from the main facility in Bilthoven, has approximately 1700 m2 of Class 10,000 cleanroom space for assembly and test and a dedicated 350 m2 Class 1000 area for shipment, preparation and packing. The full manufacturing capacity is eight reactors per week, while the location and set-up of the facility allow for a threefold future expansion.
For more information, access www.asm.com.
GaN high-power electronics
A new semiconductor technology is under development in Aachen, Germany, involving gallium nitride (GaN) semiconductor material that improves high-power, high-frequency applications. Because of its unique properties, this material will be used to produce transistors or integrated circuits operating at extreme temperatures, at high power levels or at high frequencies.
These new semiconductor materials can also be combined on classical silicon wafers using AIXTRON's advanced HeteroWafer technology, leading to significant cost advantages for producers. Within the framework of a German Technology Program, AIXTRON AG and the "Ministerium für Arbeit und Soziales, Qualifikation und Technologie des Landes Nordrhein-Westfalen" will co-sponsor the research co-operation project "High Power Electronics with Group III Nitrides." This future-oriented model was launched in April 2000 by the RWTH Aachen (Aachen University of Technology), Research Center Jülich (FZJ) and AIXTRON AG.
For more information, access www.aixtron.com.
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Semicon Europa
The annual Semicon Europa exposition will take place April 16-18, while the technical programs and events will be held April 15-20, both at the New Munich Trade Fair Centre in Munich, Germany. Show hours are Tuesday, April 16, and Wednesday, April 17, from 10:00 to 17:00, and on Thursday, April 18, from 10:00 to 16:00.
For an up-to-date program schedule, exhibitor list, or more information, visit www.semi.org.