Product News
03/01/2002
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Wafer surface analyzer
The WM-7 is the first wafer surface analyzer equipped with a violet laser diode as a light source. Compared with conventional products equipped with an argon ion laser, the newly adopted laser diode (400nm wavelength) saves space and reduces power consumption. It is most suitable for measuring foreign matter and flaws on nonpatterned wafers such as optical semiconductors (WDM, flashing switches, etc.) and semiconductor devices for mobile communication. It has been developed for yield control for 0.18μm design rules and above. Compared with the conventional argon ion laser, the violet laser diode has a long service life, resulting in reduced maintenance and running costs. The detection sensitivity is at the level of 0.09μm for bare wafers and 0.1μm for film wafers. It can measure 50-200mm wafers, including III/V-compound/new material such as GaAs and sapphire. Several options are available, including edge chuck, SMIF, and GEM/SECSII. Topcon Corp., Japan; ph 81/3-3558-2525, [email protected], www.topcon.co.jp.
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Integrated, self-aligned contact etch
Results of a customer evaluation have shown a productivity breakthrough for integrated (in situ) self-aligned contact (SAC) etch. Etch rates were achieved that were at least 30% higher than those of competing systems also tested, while the necessary high corner nitride selectivity was retained. The capability is achieved on the Exelan high-performance dielectric etch system with Dual Frequency Confined (DFC) technology, a fully confined plasma technology. The completely integrated SAC etch process combines SAC etch, resist strip, and etch stop layer removal, all in one chamber instead of three separate chambers. Previously, the mixing of process steps in situ was believed to be too complex and difficult to control for production; this new technology addresses those concerns. DFC technology and a low-residence-time reactor design allow a wide process window that offers high throughput, high selectivity, and integrated process capability. DFC technology also enables Clean Mode operation, preventing chamber wall contamination and memory effects. It allows for an in situ clean after each wafer, Waferless Autoclean, significantly increasing the mean time between clean for high productivity. Lam Research Corp., Fremont, CA; ph 510/572-4566, [email protected], www.lamrc.com.
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Semiautomatic die bonder
Model 410-XP precision bonder is a faster-operating, more precise design evolution of this company's ±5μm Model 410; it achieves finished bond precision of ±1-2μm. The XP features enhanced optics and mechanical movement, with a stable granite-base platform. It offers 750¥ magnification, a wide range of closed-loop bond load control, an optional ultrasonic transducer for thermosonic high bond load applications involving gold stud bumping, and easy calibration of the viewing system, which can move in fine 0.1μm increments. The 410-XP is targeted toward applications that require high precision and versatile processing capabilities. These include bonding of flip chips, VCSELs, edge-emitting laser diodes, and laser bars/arrays. Semiconductor Equipment Corp., Moorpark, CA; ph 805/529-2293, [email protected], www.semicorp.com.
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Computational fluid dynamics software
Computational fluid dynamics (CFD) software allows users to simulate the effects of fluid flow, heat transfer, and chemical reactions as they apply to their equipment, so they can optimize at an early stage in the design process. This suite of CFD software is specifically tailored to the needs of the semiconductor industry. It reliably predicts design performance in a wide variety of process applications, including plasma processing, CVD, etch, RTP, and spin coating. The software integrates with the user's existing CAD/CAE software to maximize efficiency and save time. Networking technology lets users leverage the power of the IT infrastructure for unrivaled turnaround speed, even with very large and complex models. Customized training and unlimited technical support are available. Fluent Inc., Lebanon, NH; ph 603/643-2600, [email protected], www.fluent.com/solutions/semiconductor.
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Nanomanipulation and nanolithography system
The NanoMan nanomanipulation and nanolithography system combines the field-proven stability and reliability of the Dimension Series platform SPM/AFMs, with the NanoScope IV SPM controller and new Dimension CL closed-loop scanner head. This combination offers 10¥ faster scanning, high accuracy, and repeatability in X-Y positioning. Also included is the new user interface and software for intuitive operation in moving objects at the nanometer and molecular levels. The system offers the lowest noise floor available and exclusively provides censored scanning for submicon scan sizes. Digital Instruments/Veeco Metrology Group, Santa Barbara, CA; ph 805/967-2700 ext 2295, www.veeco.com, www.di.com/nanoman.
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Hydrogen monitoring system
This continuous monitoring system detects and measures low levels of hydrogen in gaseous process streams. Designed to measure hydrogen concentrations of 500 ppm and below, the system responds in seconds to the presence of hydrogen. It is suitable for detecting hydrogen as either a desired stream constituent or as a stream contaminant. One typical application is measurement of hydrogen contamination in an argon stream. The system consists of a sensor cell linked to a companion transmitter. The sensor provides accurate hydrogen measurements in both oxygen-deficient and 100% RH atmospheres, has a three-year operational life, and has a measurement range of 0-500 ppm. Higher and lower ranges are also available, and the only maintenance required is periodic calibration. PureAire Monitoring Systems Inc., Rolling Meadows, IL; ph 847/788-8000, fax 847/788-8080, www.pureairemonitoring.com.
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157nm lenses and windows
This new series of CaF2 optics is designed for use in 157nm laser-based applications, such as microlithography and micromachining. The standard product line includes spherical lenses, cylindrical lenses, and flat windows. Both spherical lenses and windows come in diameters up to 75mm, and the lenses are offered with radius of curvature between 0.05 and 10 meters. Cylindrical lenses are available with radius of curvature between 0.05 and 10 meters, and can be produced in lengths up to 75mm. All these optics utilize an anti-reflection coating that delivers a reflectivity of less than 0.5% per surface, yielding a total typical transmission above 98%. In addition to standard products, customer-specified apertures and focal lengths are also available. Alpine Research Optics, Boulder, CO; ph 303/444-3420, [email protected], www.arocorp.com.
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Phosphor analyzer
The PDP Analyzer delivers vacuum UV excitation wavelengths at 146nm, 173nm, and others. The wavelengths are focused to sample phosphors, and the samples may be exchanged while maintaining the vacuum required for high-energy excitation. Phosphor emission is collected and delivered to a McPherson spectrometer for analysis. The spectrometer is equipped with a CCD for quick determination of the phosphor emission wavelength (color). In single-channel mode, the samples can be analyzed in more detail, especially regarding lifetime (to nanosecond time scales). Systems may also be equipped with tunable monochromatic light sources for excitation from 115-350nm and high gain photomultipliers for scanning spectra. McPherson Inc., Chelmsford, MA; ph 978/256-4512, [email protected], www.mcphersoninc.com.
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Motorized wafer shuttle stage
This motorized silicon wafer shuttle stage is designed to be used with Nikon and Olympus wafer-loader systems for 3, 4, 6 and 8-in. wafers. In operation, the shuttle system automatically moves to the correct load position and activates the loader switch, notifying the loader that the shuttle's wafer chuck is in position to receive the wafer. Once the wafer is transferred to the shuttle, the system senses the vacuum change and retracts the shuttle, moving the wafer to a pre-defined position (home). From this point, the wafer can be scanned using the joystick or a programmed pattern for totally automated inspection. The shuttle stage is used in conjunction with this company's Touch Screen Keypad, which allows quick and easy set-up and storage of inspection patterns and other stage parameters. Prior Scientific Inc., Rockland, MA; ph 800/877-2234, [email protected], www.prior.com.
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Sample preparation system
The FlashScan sample preparation system for ICP-MS and TXRF analysis offers silicon wafer surface contamination detection to 2 ppb. The combination wafer scanner and proprietary HF "Flash" SiO2 decomposition chamber prepare a sample for analysis in <10 min/wafer. The automatic scanner, which picks up impurities from the wafer surface, is fully programmable and allows sampling from selected wafer areas, such as edge exclusion, annular ring, or "wedge" scans. Pick-up media may be acid or DI water. Droplet preparation, scanning, and multi-sample (storage or sample drying for TXRF) are fully automatic. Prior to the scan, a safe and fast decomposition of the wafer surface is performed using HF mist in a sealed, interlocked chamber. The decomposition cycle, from wafer insertion to removal from the fully evacuated chamber, is <5 min. FlashScan systems are installed in ergonomically designed, Semi-S2-compliant hoods; they support wafers from 120-300mm. Interlab Inc., Danbury, CT; ph 203/748-5624, [email protected], www.interlab-inc.com.
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SiC heaters
These silicon carbide (SiC) heaters are designed for use in process chambers where rapid heating to high temperature — with low contamination — is necessary. Fabricated from high-purity chemical vapor deposition SiC, the heaters have very good wear resistance in corrosive environments, as well as high thermal conductivity and good thermal shock resistance. They offer a low outgassing rate and a low thermal mass; they also have low contact resistance to electrodes and a uniform electrical resistivity of 0.01 ohm-cm. Additionally, the heaters are available in complex geometry. Morgan Advanced Ceramics, Hudson, NH; ph 800/700-1283, [email protected], www.morganadvancedceramics.com.
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High-flow valve for 300mm and LCD
The injection-molded Furon InLine-1000 valve is designed for use in high-purity/corrosive chemical applications such as semiconductor valve boxes, chemical delivery, and chemical processing. The 2-way valve provides a true 1-in. orifice and an angled actuator that promotes maximum flow (Cv-15). Offered in pneumatically or manually actuated versions, it has a maximum operating pressure and maximum back pressure rating of 100 psig, and a fluid temperature range from 40-212°F (5-100°C). Incorporating "No O-Ring" union end fittings to the InLine-1000 offers the advantages of a welded system with the ability to change out components rapidly while eliminating dead volume space and elastomeric contamination. One-in. fine thread flare or FuseBond port connections are standard. Assembled, tested and double-bagged in a Class 100 cleanroom, the valve features 100% PFA HP and Virgin PTFE wetted flow path; rolling diaphragm technology; fully swept internal flow; no exposed metallics; a visual position indicator; a leak detection port (1/4-28 UNF); and a quick-release, nonmetallic 8-position mounting base. Saint-Gobain Performance Plastics, Wayne, NJ; ph 800/853-5661, www.plastics.saint-gobain.com.
Substrate management system
The Asyst SMS, a high-productivity wafer sorter used by chipmakers to manipulate and identify wafers, is a fully automated platform designed to ensure that wafers remain in a sub-Class 1 environment during all fab process steps. By implementing this "hands-off" approach, manufacturers can reduce handling-induced scratches and contamination, as well as protect against misprocessing errors, thereby increasing yield. With its modular design, small footprint (2.66 ft. W ¥ 3.71 ft. D), and high throughput (550 wafers/hr), SMS offers heightened tool utilization, lowering COO. Installation of the SMS averages less than one hour. Asyst Technologies Inc., Fremont, CA; ph 510/661-5000, fax 510/661-5166, [email protected].
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X-ray test and inspection
The field-proven microfocus x-ray .2 series has been redesigned with improved x-ray tube and imaging chain technology — changes that increase the system's imaging capabilities and versatility. Standard features still include a simple and ergonomic console for optimized inspection settings, an ultrahigh-precision tilt and rotate manipulator system, real-time measurement capabilities, and multiple fields of view. The modernized blue-and-white system design is now available with the latest x-ray imaging capabilities. Imaging chain choices for the system now include the direct digital x-ray detector (DDD), providing enhanced digital image processing. Advantages of the DDD include higher contrast, geometric accuracy, and magnetic field resistance. The DDD features are further enhanced by the FIP-600NT image processing workstation, which is standard on all new systems and provides filtering, networking, and data-storage capabilities, as well as 3D and color display, measurement tools (wire sweep, distance, BGA voids), and sophisticated real-time image noise reduction. FeinFocus USA Inc., Stamford, CT; ph 203/969-2161, www.feinfocus.com.
High-accuracy proportioning control valves
Combining a precision stepper motor with a patented slotted metering valve, AutoValve proportioning control valves have the ability to meter media in very precise increments on a repeatable basis. Linear flow characteristics make them suitable for such applications as precision blending or metering. Wetted surfaces of PTFE and PFA are excellent for aggressive aqueous reagents and ultrapure media. A design that incorporates dual PTFE rolling diaphragms and an integral leak detection port gives the user added protection. These products are designed for a closed-loop control system; the user simply provides a 4-20mA input into the AutoValve Control Board to open or close the valve to a desired position. Futurestar Corp., Bloomington, MN; ph 952/942-8388 ext 123, fax 952/942-8661, www.futurestarcorp.com.