New Products
02/01/2002
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Modular inspection system
The INS3300 inspection system incorporates the new DUV AT objective, which offers ultrahigh resolution and very long life. The individual lens elements of the objective are mounted using a new technique. The new objective uses special cement-free optics, ensuring long life without sacrificing image quality. Coupled with an autofocus system, the DUV AT produces constantly sharp images in real time. The INS3300 DUV system has a multi-wavelength design with the opportunity to include all applicable imaging modes, such as brightfield, darkfield, interference contrast, UV (365nm), and DUV (248nm). Films, lines and other structures applied to the wafer can be imaged with great precision. The high and non-deteriorating resolution power suits the new tool to the demands of design rules of 0.13 or even 0.1µm. The INS3300 uses VISCON NT 4.0 software, which features a user-friendly graphical user interface. Incorporating the optional ADC NT 4.0 software makes possible automatic classifiction of detected defects, relieving the operator of routine tasks and raising the accuracy of results. Leica Microsystems AG, Wetzlar, Germany; ph 49/64-4129-2200, wilfried. [email protected], www.leica-microsystems.com.
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Front-opening shipping box
The 25-capacity FabFit 300 front-opening shipping box (FOSB) is used to protect and transport 300mm wafers, increasing yields and decreasing downtime through improved OEM interface capability. The OEM interface enables wafers to be transferred safely to and from the FOSB with standard robotic transfer units. FabFit can be opened and closed using a standard 13-capacity FOUP loadport, maintaining an ultrapure environment. In addition, the shipping box has a reduced pitch that makes possible greater storage efficiencies and lower shipping costs. The dimensionally stable wafer shipper can be cleaned for re-use up to 10 times. Entegris Inc., Chaska, MN; ph 952/556-3131, [email protected], www.entegris.com.
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Large-area stud bumper for 300mm
WaferPRO is a large-area stud bumper that combines 300mm-wafer, single-pass processing capability with very high cycle speed — up to 16 bumps/sec at 60µm in-line pad pitch. A 400 x 330mm (16 x 13 in.) bondable area and WaferPRO's Accubump feature allow single-pass bumping/coining of 75-300mm wafers with ±5µm accuracy at 3s. Several material-handling options are available, from manual to fully automatic wafer-handling. A lightweight bondhead is mounted on a rigid overhead structure for maximum accuracy and stability. Programmable camera focus allows pattern recognition over a wide range of wafer heights. The vision system features confirmed 0.1 pixel accuracy for maximum units/hr and high mean time between assists. A 120-kHz Unibody transducer enables low-temperature bonding of thermally sensitive substrates, and temperature ramping capability enables processing of thermally sensitive wafer materials. Kulicke & Soffa, Willow Grove, PA; ph 215/784-6000, [email protected], www.kns.com.
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Decoupled plasma nitridation
The decoupled plasma nitridation (DPN) chamber is a critical process technology that allows the fabrication of transistor gate dielectric structures in next-generation chips. The single-wafer DPN process incorporates a high concentration of nitrogen into the surface of an ultrathin gate oxide to prevent boron penetration and reduce leakage current, resulting in repeatable and reliable transistors for 130nm (and below) device designs. The DPN chamber features an ultraclean, quasi-remote plasma source designed for use with sensitive ultrathin gate oxides. Since the chamber uses a plasma rather than a conventional thermal process to introduce nitrogen to the gate oxide, a higher concentration of nitrogen can be incorporated into the gate oxide without damage to the channel interface. The DPN process enables gate scaling beyond the 100nm design mode by preventing the diffusion of boron from the electrode into the device channel region and reducing the equivalent oxide thickness to <14Å. DPN also delivers a >20x improvement in gate leakage over pure oxide. Applied Materials Inc., Santa Clara, CA; ph 408/748-5227, www.appliedmaterials.com.
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Monitoring of minienvironments
MiniNet is the first tool designed specifically for monitoring inside minienvironments to detect particle events and other system failures. It uses an ensemble manifold that simultaneously samples particles from up to seven locations, thereby increasing the coverage sevenfold and protecting the entire tool rather than just a single location. MiniNet can be located inside or outside the minienvironment; samples are taken using either house vacuum or an optional internal pump. Particle data, differential air pressure, and two other critical factors (such as air flow velocity or ESD) are all transmitted via a single Ethernet signal to FacilityNet facility monitoring software for easy data analysis, alarms, data dissemination, and report generation. Particle Measuring Systems, Boulder, CO; ph 303/443-7100, [email protected].
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CMP systems for 300mm automation
Computer Integrated Manufacturing (CIM) is the enabling technology for improving semiconductor device fabrication by controlling product and information flow. The PM 300 Apollo CMP tool is the first CMP cluster tool to be equipped with a complete CIM-Interface for 300mm wafer production. The tool uses an Enhanced Carrier Interface (Semi E84) to control automated material handling. This carrier interface enables the tool to exchange substrate carriers (FOUPs) with all known carrier transport systems, such as an overhead transport system (OHT) or a rail-guided vehicle (RGV). Automated identification of the substrate carrier (FOUP) and the automated verification of the wafer map allows reliable loading, unloading, and job scenarios without a human operator. Incorporated in the product flow, the PM 300 supplies all required customer move-in and move-out scenarios. Based on a fully GEM-compliant interface, the PM 300 employs Advanced Carrier-, Control Job-, and Process Job Management, as well as substrate tracking and ARAMS functionality. Peter Wolters CMP-Systeme GmbH, Rendsburg, Germany; ph 49/4331-458-314, [email protected], www.peter-wolters.com.
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Test handler
The RoboTek GT-1000 test handler automatically feeds semiconductor devices from a stacked tube input system through a gravity track assembly where they are singulated into a series of test sites. After testing, the GT-1000 automatically sorts the devices into one of eight tubes in the rotary tube output system. The handler is configured using standard interchangeable modules. Lead straightening sites, multiple test sites, marking sites, and/or vision inspection sites can be implemented to customize the handler for almost any requirerment. RoboTek International, Richardson, TX; ph 469/330-0850, [email protected], www.robotek.com.
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Motorized spindles
The FerroDrive range of motorized spindles combines a hermetic vacuum feedthrough with a high-precision motor and controller, resulting in a compact, integrated sealing and rotation system. Supplied ready to install, FerroDrives are suitable for such applications as thin film, optical coating, ion beam deposition, PVD, sputtering, and ion implantation. Two versions are available: a basic motorized spindle that uses a standard controller and Hall Effect sensors for simple velocity control (within 2%), and a high-precision version that features an encoder and advanced digital controller for highly accurate speed and position control (within 0.01% or better). Shaft sizes up to 2 in. (hollow or solid) are offered as standard. The FerroDrive's spindle is driven by a brushless DC motor, permitting 100% torque transmission with zero backlash through the feedthrough shaft and eliminating the need for gears, belts or other mechanical couplings. FerroTec (USA) Corp., Nashua, NH; ph 603/883-9800, [email protected], www.ferrotec.com.
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FTIR gas analyzer
The On-Line MultiGas 2030 analyzer monitors single-emission stacks in fabs for PFC abatement efficiency. It is an FTIR-based analyzer that is capable of 1 ppb sensitivity for multiple gas species present in effluent streams that contain up to 30% water. It can provide simultaneous analysis and display of more than 30 gases. With its ability to permanently store calibration spectra for gas species, the MultiGas 2030 removes the need to use costly gas cylinders. Maintenance engineers and technicians will find the robust, fully automated 2030 easy to operate and sustain. A small volume, corrosion-resistant gas cell enables percent to ppb-level detection of highly toxic gases, without a cell change. The small size of the 2030 makes it suitable for transporting from one site to another. MKS On-Line Products, Andover, MA; ph 860/291-0719 or 888/FTIR-888, www.mksinst.com/onlineHOME.html.
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Liquid flow controller
Model 401 Liquid Flo-Controller is the first completely automatic, all-Teflon flow controller for industrial applications. The system needs only a 24 VDC power source and liquid flow in order to work. It can measure and control flow as low as 15 mL/min or as high as 8 L/min, and it works well in applications involving control of ultraclean fluids. The all-Teflon and sapphire wetted parts do not affect process chemicals and solutions. Model 401 uses a miniature turbine wheel and infrared beams to achieve 10:1 (or better) turndown ratios with repeatability of ±0.25% full scale and accuracy of ±2% full scale. It can be used as a stand-alone system by powering the controller and making the appropriate flow connections. Users then set the adjustable setpoint to the desired flow rate and let the system control. Model 401 can be easily interfaced with existing control systems by using the 4-20mA inputs and outputs. McMillan Co., Georgetown, TX; ph 800/861-0231 or 512/863-0231, [email protected], www.mcmflow.com.
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Semiconductor mechanical delayering
The MULTIPOL 8 Precision Polisher offers the ability to delayer electronic circuitry from the front-side of die to sub-micron accuracy. By using true flat lapping technology — wherein MULTIPOL's precision polishing jig, which holds the sample being prepared, rides on the surface of the polishing plate — a higher degree of surface flatness can be obtained, when compared to existing "off the lap" machinery. A special quick-release fixture allows fast and convenient transfer to and from the microscope during sample preparation, to ensure that the correct layer and/or device within the circuitry is located. MULTIPOL 8 offers additional improved control and precision in cross-sectioning, electron microscopy, and backside sample preparations. Also available are lapping films and consumables to support all cutting and polishing applications. ULTRA TEC Mfg., Inc., Santa Ana, CA; ph 714/542-0608, [email protected], www.ultratecusa.com.
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Multichip die bonder
The 2200 apm+ is an extension of the proven modular platform concept for advanced packaging, offering 300mm wafer handling. The multichip die bonder is ready for the transition to 300mm and is built on the same concept as the proven 2200 apm system, capable of handling 300 mm wafers for large die up to 50mm for die attach and flip chip. The new generation of die bonders integrates seamlessly into the modular platform concept, ensuring maximum flexibility and reliability. With today's set of advanced packaging requirements, more and more assembly lines require a large degree of modularity. Different modules can be arranged consecutively, so that either the throughput can be multiplied or all kinds of tasks can be processed in parallel. The flexibility of the 2200 apm+ is reflected in the full MCM capability by automatic wafer changing, automatic tool changing, a multichip ejector carrousel system, die attach and flip-chip capabilities, and compliance with the Semi SECS standards. Datacon GmbH, Radfeld, Austria; ph 43/5337-600-104, fax 43/5337-600-663, [email protected].
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Partial pressure monitor
The Malin partial pressure monitor is a compact mini-quadrupole mass spectrometer used to detect impurities or leaks in LP-CVD, etching, or photoresist residues in PVD systems. It is a low-cost miniature residual gas analyzer with a mass range of 12-37 M/e, and its sensor head measures pressures up to 1 Pa (7.5 x 10-2 torr) without the need for differential pumping. The unit operates on all voltages and frequencies (100-240V, 50/60Hz). Trend data of any four channels and continuous analog scans can be monitored and recorded over time. Windows 95, 98 and NT 4.0 software makes control and data collection easy. Also, the Malin's four programmable alarm setpoints enable it to become a very sensitive high-pressure monitor for corrosive processes, including endpoint detection for CVD and etch system cleaning operations. ULVAC Technologies Inc., Methuen, MA; ph 978/686-7550, [email protected], www.ulvac.com.
248nm excimer laser systems
The ELS-6010, the first production-worthy 2500Hz DUV KrF laser, delivers <0.5 pm at FWHM bandwidth and <1.4pm 95% energy integral control, allowing high performance from steppers and scanners using lenses with >0.70 NA for 0.13µm semiconductor manufacturing. With a 25% higher repetition rate compared to 2kHz repetition rate laser systems, the ELS-6010 delivers more laser pulses per die, enhancing energy dose stability for improved CD control and higher yields. The ELS-7000 is a volume production light source for lithography. A high-performance 248nm (KrF) excimer laser, offering 30W at 4000Hz, the ELS-7000 is designed to allow the highest scanning speeds for maximum throughput and productivity. Cymer Inc., San Diego, CA; ph 858/385-5232, fax 858/385-6090, [email protected].
Self-calibrating temperature sensor
This dynamically self-validating and self-calibrating temperature sensor (SVS) system eliminates drift and improves system reliability to help users optimize their processes. The SVS temperature sensors are intended for use in critical semiconductor fabrication temperature control and monitoring applications. A wide range of configurations is available to fit diffusion, CVD, or crystal-growing applications. The patented SVS technology provides a continuously validated output traceable to NIST standards. AccuTru International, Kingwood, TX; ph 281/358-5600, fax 281/358-5605, www.accutru.com.
Retrofit kit for ionized PVD
This retrofit kit converts the conventional magnetron sputter cathode to the negative sputter ion beam source for the ionized PVD process. The retrofit can provide solutions to the many limitations in thin film formation using sputter cathodes and generate advanced coatings; atomically smooth surface (<1 nm Ra), strong adhesion, atomic layer deposition, and room temperature ITO (6 x 10-4 ohm-cm, 90% transmittance). The retrofit kit can be installed at the shield of the sputter cathode in any size, even rectangular magnetron cathodes. The ionized PVD process is based on the negative surface ionization mechanism using Cesium. SKION (a Plasmion company), Hoboken, NJ; ph 201/963-5450, [email protected], www.skion.com.
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Microelectronics machining
AccuLaze is a compact, tabletop microelectronics machining system designed for numerous applications, including semiconductor failure analysis, circuit isolation, and polyimide and passivation removal. A compact and completely self-contained system, AccuLaze is available in six wavelengths from deep UV (213nm) to IR (1064nm). Each system includes a rugged Nd:YAG laser, a high-magnification video system, and control software to allow trimming and repairing of a variety of micro devices. The system's software package controls all laser parameters, device viewing, and stage positioning. Repetition rates vary — up to 10kHz for the J-models, up to 30Hz for the P- and T-models. Spot sizes range from 10-150µm. AccuLaze is available with various precision stage sizes offering submicron resolution from 2 x 2 in. to 8 x 8 in. Several objective lenses are also available. New Wave Research, Fremont, CA; ph 510/249-1550, [email protected], www.new-wave.com.
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Tabletop automatic bonder
Model 275 is the first available thoroughly ESD-protected, manual to fully automatic, high-resolution tabletop bonder. It consistently provides placement accuracy <5µm and ESD levels <2% of currently installed automatic bonders. To reduce the risk of damage to static sensitive devices, ESD levels are under 5 milliamps transient current and <10V of parent field radiation, below 2% of typical levels in automatic bonders. Closed-loop servo controlled Z movement, precision X-Y stages, and voice coil controlled bonding force provides precision ultrasonic bonding from 5-300 grams at 0.01-7.5W and placement accuracy under 5µm, with nanometer resolution optional. Anza Technology Inc., Roseville, CA; ph 916/787-0111, [email protected], www.anzatech.com.