Product News
01/01/2002
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ICPECVD for low-temperature SiNx films
The SI 500D inductively coupled PECVD system was designed for low-temperature deposition processes based on the properties of this company's PTSA 200 plasma source. At 90°C, deposited silicon nitride can be used successfully as an isolator material for MIM capacitors on InP. The low-temperature deposition allows the use of a standard lift-off technique to pattern the dielectric film. The outstanding properties of the films are also demonstrated in passivating InGaAs - pin - photodiodes. The low-temperature, low-damage deposition process has almost no influence on the reverse leakage current. The SI 500D is a modern ICPECVD deposition system complete with load-lock and computerized control system. The system is controlled by advanced hard- and software with client-server architecture. The user-friendly plasma process operation software allows fast and easy recipe generation and process control. The SI 500D has a small footprint and can be installed "through the wall" to minimize the use of cleanroom space. SENTECH Instruments GmbH, Berlin, Germany; ph 49/30-6392-5520, [email protected], www.sentech.de.
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High-resolution optical microscope
Using a 193nm exposure source and a high NA objective, and offering a resolution of 155nm, the Actinix TMT-193 is designed to measure the transmittance of extremely small features, defects and repairs on advanced photomasks. It is illuminated at 193nm by the Actinix 2193 solid-state light source, which in conjunction with a high-quality, high NA (0.75) objective lens offers the finest resolution available in conventional transmitted light optical microscopes. Photomask shops and mask users will use this transmission measurement tool to verify the quality of repaired defects. Often, in the mask defect repair process, a residue is left behind, such as the gallium stain from an ion miller. The TMT-193 can project a minute (<200nm) probe spot onto the mask and measure the light transmission through the mask at the precise location of the repair. Probe spot sizes are selectable from 180nm to 5µm to match the particular size of the feature under test. Actinix, Soquel, CA; ph 831/479-0837, [email protected], www.actinix.com.
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Plug-and-play pumping system
This new optimized dry pump installation approach greatly increases available space in crowded fab basements by reducing the footprint for one tool by 30-70%. The Alcatel Tool Pumping Solution (ATPS) provides standardized inlet connections, fully independent pumping lines, lower noise level, increased safety, and easy maintenance. The ATPS is an optimised concept for pump installation that can be used with 100 or 600 m3/hr pumping lines. The integrated A100 miniaturised dry pump can be boosted to 600 m3/hr with a Roots blower when required. Other benefits include standardized inlet connections (at 1.9m height), fully independent pumping lines which ensure that when one pump is stopped the others remain unaffected, and easy maintenance. The new ATPS dry pump range consists of three versions: ATPS 61, for up to three pumping lines in a footprint of 1 x 1m (maximum of three booster assisted lines); ATPS 81, for up to six pumping lines of 1 x 1m (maximum of 2 booster assisted lines); and ATPS 101, for up to six pumping lines in a footprint of 1.5 x 1m (maximum of four booster assisted lines). Applications include PVD, etch, WCVD, Ti/TiN CVD, and undoped silicon oxide CVD (HDP-CVD, RTP-CVD). Alcatel Vacuum Technology, Annecy, France; ph 33/5065-7875, [email protected], www.alcatelvacuum.com.
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Process monitoring for CVD and etch
Spectra Vision 1000-C and Vision 1000-E process monitors are designed for continuous in situ monitoring of — respectively — CVD and etch processes and feature proprietary sampling inlet and recipe-driven software for automated data acquisition and interpretation. These new process monitors continuously collect and interpret data from the process tools to ensure that they are operating at maximum efficiency. Both monitors combine a closed ion source "smart" analyzer with a close-coupled automated inlet for seamless monitoring of the complete CVD or etch process cycle. The proprietary fast-response Unibloc inlet valve automates the sampling of background and process gases via recipe-based Spectra Process Eye 2000 software. When not sampling, both the valve and the analyzer are automatically isolated from the process chamber and purged with inert gas to keep the source clean. Because of the nature of the process gases, the Unibloc valve is fitted with a heating jacket to provide temperature control to minimize deposition (Vision 1000-C) and surface adsorption (Vision 1000-E) within the valve. In addition, the heated assembly maintains constant mobility of sticky/polar gases through the inlet, leading to a longer system lifetime. MKS Instruments Inc., Andover, MA; ph 800/822-2432 or 408/778-6060, www.mksinst.com.
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Defect/materials characterization
The Strata DB235 is a small-stage DualBeam tool designed for this company's Structural Diagnostics, including semiconductor defect characterization, materials characterization, and process development of small samples, packaged parts, and TEM samples. It helps speed "time-to-answer" by performing material and defect analysis on a single tool that delivers high-resolution images and compositional data. To support the increasing need for TEM samples of shrinking device geometries, the Strata DB235 can be configured to prepare multiple samples automatically in a single session. FEI Co., Hillsboro, OR; ph 503/640-7500, [email protected], www.feic.com.
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No flow-fluxing underfills
The E1340 series of no flow-fluxing underfills incorporates solder fluxing capability into an epoxy-based underfill chemistry. The result is a robust encapsulant for interconnecting/underfilling area array devices. The series is specifically designed to enhance the reliability of area array device assemblies such as flip chip, chip scale packages, and ball grid arrays. The first product of the series, E1344, facilitates solder joint interconnect and fully cures in a variety of SMT processing configurations. Using a typical SMT reflow cycle, E1344 interconnects and achieves full cure in only one typical SMT reflow exposure plus an in-line (or snap) post cure. With a slightly modified SMT reflow condition, it will interconnect and fully cure in just one reflow exposure, allowing the assembly of area array devices with underfill to be virtually transparent to the typical SMT process. Emerson & Cuming, Billerica, MA; ph 800/832-4929, [email protected], www.emersoncuming.com.
Deposition rate tuner
The 4000DRT deposition rate tuner optimizes dielectric PECVD tool processes with feedback in <1 min. This new technology allows off-line predictive process control and rapid recipe revision and helps eliminate the misprocessing of costly wafers. It provides immediate information that allows engineers to change the heater block temperature ramp rate and features programmable go/no-go indicators to flag wafers for inspection. The instrument, which minimizes the thin-film deposition range and improves wafer-to-wafer thickness uniformity, provides the end-user with more good wafers, requires no tool modification, reduces the number of pilot wafers, and extends tool and component life. It is available in single- and dual-chamber configurations. Advanced Energy Industries Inc., Fort Collins, CO; ph 800/446-9167, fax 970/407-5280, [email protected].
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Nanofocus x-ray tube
The xs/series nanofocus (nf) is a nanofocus x-ray tube that obtains images down to 0.5µm, small enough for sharp imaging of microvias. Combined with the capabilities offered by this company's x-ray technology, the xs/series nf provides quality checking and failure analysis to increase productivity and reduce scrap. The technology offers a simple technique for a wide variety of high-magnification x-ray applications, analyzing such defects as fine bond wire cracks and tiny voids that occur in flip chip solder balls as small as 25µm in diameter. Even after electrical tests have been carried out, and breaks in bond wires occur and are thermically destroyed by overcurrent, the xs/series nf provides very fine resolution to discover exactly where the failures occurred. The nanofocus tube provides a new focus for determining failures in production of multilayer boards, BGA and µBGA integrity, chip and board prototyping, and micro mechanics. Phoenix/x-ray Systems + Services Inc., Camarillo, CA; ph 877/749-9729 or 805/389-0911 ext 11, [email protected], www.phoenix-xray.com.
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Clamp-on ultrasonic flowmeter
The DigitalFlow GC868 Flowmeter is the first clamp-on ultrasonic flowmeter for gases at high or low pressure — in pipes made of metal or of almost any other material. Thw new meter has been tested extensively on metal pipes containing air, hydrogen and natural gas over a wide range of pipe sizes (3-36 in.). Using patented Correlation Transit-Time detection techniques, demonstrated accuracy is better than ±2% of reading, with a time-averaged accuracy of ±1% of reading. Data show repeatability of ±0.5% of reading. The GC868 can be used to measure the flow of any gas, and it is especially useful for metering erosive, corrosive, toxic, high-purity, or sterile gases. Since no tapping or cutting of the pipe is required, permanent installation costs are reduced significantly. The meter has no wetted or moving parts, requires no regular maintenance, causes no pressure drop, and has very wide rangeability. Panametrics Inc., Waltham, MA; ph 800/833-9438 or 781/899-2719 ext 172, [email protected], www.panametrics.com.
Defect/materials characterization
The Strata DB235 is a small-stage DualBeam tool designed for this company's Structural Diagnostics, including semiconductor defect characterization, materials characterization, and process development of small samples, packaged parts, and TEM samples. It helps speed "time-to-answer" by performing material and defect analysis on a single tool that delivers high-resolution images and compositional data. To support the increasing need for TEM samples of shrinking device geometries, the Strata DB235 can be configured to prepare multiple samples automatically in a single session. FEI Co., Hillsboro, OR; ph 503/640-7500, [email protected], www.feic.com.
No flow-fluxing underfills
The E1340 series of no flow-fluxing underfills incorporates solder fluxing capability into an epoxy-based underfill chemistry. The result is a robust encapsulant for interconnecting/underfilling area array devices. The series is specifically designed to enhance the reliability of area array device assemblies such as flip chip, chip scale packages, and ball grid arrays. The first product of the series, E1344, facilitates solder joint interconnect and fully cures in a variety of SMT processing configurations. Using a typical SMT reflow cycle, E1344 interconnects and achieves full cure in only one typical SMT reflow exposure plus an in-line (or snap) post cure. With a slightly modified SMT reflow condition, it will interconnect and fully cure in just one reflow exposure, allowing the assembly of area array devices with underfill to be virtually transparent to the typical SMT process. Emerson & Cuming, Billerica, MA; ph 800/832-4929, [email protected], www.emersoncuming.com.
Deposition rate tuner
The 4000DRT deposition rate tuner optimizes dielectric PECVD tool processes with feedback in <1 min. This new technology allows off-line predictive process control and rapid recipe revision and helps eliminate the misprocessing of costly wafers. It provides immediate information that allows engineers to change the heater block temperature ramp rate and features programmable go/no-go indicators to flag wafers for inspection. The instrument, which minimizes the thin-film deposition range and improves wafer-to-wafer thickness uniformity, provides the end-user with more good wafers, requires no tool modification, reduces the number of pilot wafers, and extends tool and component life. It is available in single- and dual-chamber configurations. Advanced Energy Industries Inc., Fort Collins, CO; ph 800/446-9167, fax 970/407-5280, [email protected].
Nanofocus x-ray tube
The xs/series nanofocus (nf) is a nanofocus x-ray tube that obtains images down to 0.5µm, small enough for sharp imaging of microvias. Combined with the capabilities offered by this company's x-ray technology, the xs/series nf provides quality checking and failure analysis to increase productivity and reduce scrap. The technology offers a simple technique for a wide variety of high-magnification x-ray applications, analyzing such defects as fine bond wire cracks and tiny voids that occur in flip chip solder balls as small as 25µm in diameter. Even after electrical tests have been carried out, and breaks in bond wires occur and are thermically destroyed by overcurrent, the xs/series nf provides very fine resolution to discover exactly where the failures occurred. The nanofocus tube provides a new focus for determining failures in production of multilayer boards, BGA and µBGA integrity, chip and board prototyping, and micro mechanics. Phoenix/x-ray Systems + Services Inc., Camarillo, CA; ph 877/749-9729 or 805/389-0911 ext 11, [email protected], www.phoenix-xray.com.
Clamp-on ultrasonic flowmeter
The DigitalFlow GC868 Flowmeter is the first clamp-on ultrasonic flowmeter for gases at high or low pressure — in pipes made of metal or of almost any other material. Thw new meter has been tested extensively on metal pipes containing air, hydrogen and natural gas over a wide range of pipe sizes (3-36 in.). Using patented Correlation Transit-Time detection techniques, demonstrated accuracy is better than ±2% of reading, with a time-averaged accuracy of ±1% of reading. Data show repeatability of ±0.5% of reading. The GC868 can be used to measure the flow of any gas, and it is especially useful for metering erosive, corrosive, toxic, high-purity, or sterile gases. Since no tapping or cutting of the pipe is required, permanent installation costs are reduced significantly. The meter has no wetted or moving parts, requires no regular maintenance, causes no pressure drop, and has very wide rangeability. Panametrics Inc., Waltham, MA; ph 800/833-9438 or 781/899-2719 ext 172, [email protected], www.panametrics.com.
CMP process tool
Momentum300 is a third-generation CMP process tool that flexibly delivers 0.13-0.10µm process metrics for copper, low-k, direct STI, tungsten and oxide. It offers uniform velocity with solid polish support through an orbital hard platen. Its pressure-controlled Hexazone multichannel carrier is the industry's only adaptive polish carrier for optimized removal rate and total wafer metrics control. The tool's multizone in situ process monitor and broadband OEPD system offer precise and reliable endpoint and process-quality control. Other Momentum300 features include: a small 300mm tool footprint, six independent process modules for flexible process flow and high throughput, and through-the-pad slurry delivery for economical slurry consumption and lower COO. SpeedFam-IPEC, Chandler, AZ; ph 480/705-2473, fax 480/705-2786, [email protected].